NXP Producten

AFT18H356-24SR6

NXP

FET RF 2CH 65V 1.88GHZ NI1230-4

• Transistor Type: -
• Frequency: 1.88GHz
• Gain: 15dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.1A
• Power - Output: 63W
• Voltage - Rated: 65V
• Package / Case: NI-1230-4LS2L
• Supplier Device Package: NI-1230-4LS2L

package: NI-1230-4LS2L

MRF6VP3091NBR1

NXP

FET RF 2CH 115V 860MHZ TO272-4

• Transistor Type: LDMOS (Dual)
• Frequency: 860MHz
• Gain: 22dB
• Voltage - Test: 50V
• Current Rating: -
• Noise Figure: -
• Current - Test: 350mA
• Power - Output: 18W
• Voltage - Rated: 115V
• Package / Case: TO-272BB
• Supplier Device Package: TO-272 WB-4

package: TO-272BB

PDTC144VK,115

NXP

TRANS PREBIAS NPN 250MW SMT3

• Transistor Type: NPN - Pre-Biased
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Resistor - Base (R1) (Ohms): 47k
• Resistor - Emitter Base (R2) (Ohms): 10k
• DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 5mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
• Current - Collector Cutoff (Max): 1µA
• Frequency - Transition: -
• Power - Max: 250mW
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

package: TO-236-3, SC-59, SOT-23-3

PDTC114YS,126

NXP

TRANS PREBIAS NPN 500MW TO92-3

• Transistor Type: NPN - Pre-Biased
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Resistor - Base (R1) (Ohms): 10k
• Resistor - Emitter Base (R2) (Ohms): 47k
• DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
• Current - Collector Cutoff (Max): 1µA
• Frequency - Transition: -
• Power - Max: 500mW
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
• Supplier Device Package: TO-92-3

package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

HEF4794BP,112

NXP

IC LED DRIVER LINEAR 40MA 16DIP

• Type: Linear
• Topology: Shift Register
• Internal Switch(s): Yes
• Number of Outputs: 8
• Voltage - Supply (Min): 3V
• Voltage - Supply (Max): 15V
• Voltage - Output: -
• Current - Output / Channel: 40mA
• Frequency: 28MHz
• Dimming: -
• Applications: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

package: 16-DIP (0.300", 7.62mm)

74HCT259N,652

NXP

IC ADDRESSABLE LATCH 8BIT 16DIP

• Logic Type: D-Type, Addressable
• Circuit: 1:8
• Output Type: Standard
• Voltage - Supply: 4.5 V ~ 5.5 V
• Independent Circuits: 1
• Delay Time - Propagation: 20ns
• Current - Output High, Low: 4mA, 4mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

package: 16-DIP (0.300", 7.62mm)

74LVT00D,112

NXP

IC GATE NAND 4CH 2-INP 14-SO

• Logic Type: NAND Gate
• Number of Circuits: 4
• Number of Inputs: 2
• Features: -
• Voltage - Supply: 2.7 V ~ 3.6 V
• Current - Quiescent (Max): -
• Current - Output High, Low: 20mA, 32mA
• Logic Level - Low: 0.8V
• Logic Level - High: 2V
• Max Propagation Delay @ V, Max CL: 2.7ns @ 3.3V, 50pF
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-SO
• Package / Case: 14-SOIC (0.154", 3.90mm Width)

package: 14-SOIC (0.154", 3.90mm Width)

74LV574PW,112

NXP

IC D-TYPE POS TRG SNGL 20TSSOP

• Function: Standard
• Type: D-Type
• Output Type: Tri-State, Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 8
• Clock Frequency: 70MHz
• Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 16mA, 16mA
• Voltage - Supply: 1 V ~ 5.5 V
• Current - Quiescent (Iq): 160µA
• Input Capacitance: 3.5pF
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)

package: 20-TSSOP (0.173", 4.40mm Width)

74LV125DB,118

NXP

IC BUFF DVR TRI-ST QUAD 14SSOP

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 4
• Number of Bits per Element: 1
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 16mA, 16mA
• Voltage - Supply: 1 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 14-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 14-SSOP

package: 14-SSOP (0.209", 5.30mm Width)

74ABT648PW,118

NXP

IC TRANSCEIVER 8BIT INV 24TSSOP

• Logic Type: Transceiver, Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 24-TSSOP

package: 24-TSSOP (0.173", 4.40mm Width)

74HCT126N,652

NXP

IC BUFFER DVR TRI-ST QD 14DIP

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 4
• Number of Bits per Element: 1
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 6mA, 6mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Through Hole
• Package / Case: 14-DIP (0.300", 7.62mm)
• Supplier Device Package: 14-DIP

package: 14-DIP (0.300", 7.62mm)

TFA9841J/N1,112

NXP

IC AMP AUDIO PWR 7.5W MONO 9SIL

• Type: Class AB
• Output Type: 1-Channel (Mono)
• Max Output Power x Channels @ Load: 7.5W x 1 @ 4 Ohm
• Voltage - Supply: 9 V ~ 26 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Through Hole
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 9-PDBS-EP
• Package / Case: 9-SIP Exposed Tab, Formed Leads

package: 9-SIP Exposed Tab, Formed Leads

SC16C650BIBS,157

NXP

IC UART SINGLE W/FIFO 32-HVQFN

• Features: -
• Number of Channels: 1, UART
• FIFO's: 32 Byte
• Protocol: -
• Data Rate (Max): 3Mbps
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

package: 32-VFQFN Exposed Pad

MCIMX31DVKN5DR2

NXP

IC MPU I.MX31 532MHZ 457MAPBGA

• Core Processor: ARM1136JF-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 532MHz
• Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
• RAM Controllers: DDR
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keyboard, Keypad, LCD
• Ethernet: -
• SATA: -
• USB: USB 2.0 (3)
• Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
• Operating Temperature: -20°C ~ 70°C (TA)
• Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
• Package / Case: 457-LFBGA
• Supplier Device Package: -

package: 457-LFBGA

MC8641DTHX1250HC

NXP

IC MPU MPC86XX 1.25GHZ 1023BGA

• Core Processor: PowerPC e600
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.25GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1023-BCBGA, FCCBGA
• Supplier Device Package: 1023-FCCBGA (33x33)

package: 1023-BCBGA, FCCBGA

MPC8555PXAPF

NXP

IC MPU MPC85XX 833MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 833MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DDR, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

MVF60NN151CMK50

NXP

IC MCU 32BIT ROMLESS 364MAPBGA

• Core Processor: ARM? Cortex?-A5 + Cortex?-M4
• Core Size: 32-Bit Dual-Core
• Speed: 500MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG
• Peripherals: DMA, LVD, WDT
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 1.5MB
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D Dual x 12b, D/A Dual x 12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 364-LFBGA
• Supplier Device Package: 364-MAPBGA (17x17)

package: 364-LFBGA

LPC2939FET208,551

NXP

IC MCU 32BIT 768KB FLASH 208LQFP

• Core Processor: ARM9?
• Core Size: 16/32-Bit
• Speed: 125MHz
• Connectivity: CAN, EBI/EMI, I2C, LIN, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 152
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 16K x 8
• RAM Size: 56K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 24x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 208-LQFP
• Supplier Device Package: 208-LQFP (28x28)

package: 208-LQFP

LPC2470FBD208,551

NXP

IC MCU 32BIT ROMLESS 208LQFP

• Core Processor: ARM7?
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
• Number of I/O: 160
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 98K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 208-LQFP
• Supplier Device Package: 208-LQFP (28x28)

package: 208-LQFP

TDF8771AH/C1,518

NXP

IC DAC TRPL 8-BIT VIDEO 44-QFP

• Number of Bits: 8
• Number of D/A Converters: 3
• Settling Time: 50µs
• Output Type: Voltage - Buffered
• Differential Output: No
• Data Interface: Parallel
• Reference Type: Internal
• Voltage - Supply, Analog: 5V
• Voltage - Supply, Digital: 5V
• INL/DNL (LSB): ±0.3, ±0.15
• Architecture: String DAC
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-QFP
• Supplier Device Package: 44-PQFP (10x10)
• Mounting Type: -

package: 44-QFP

MPR083QR2

NXP

IC CTLR TOUCH SENSOR PROX 16-QFN

• Type: Buttons, Slider, Wheel
• Proximity Detection: Yes
• Number of Inputs: 8
• LED Driver Channels: -
• Interface: I2C
• Resolution: -
• Voltage - Supply: 1.8 V ~ 3.6 V
• Current - Supply: 1.62mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-VQFN Exposed Pad
• Supplier Device Package: 16-QFN-EP (5x5)

package: 16-VQFN Exposed Pad

OM7960

NXP

KIT EVAL BFU520W, 530W, 550W

• Type: Amplifier
• Frequency: -
• For Use With/Related Products: BFU520W, BFU530W, BFU550W
• Supplied Contents: 2 Boards, Samples

package: -

SPC5748CBK0AMKU6

NXP

IC MCU 32BIT 6MB FLASH 176LQFP

• Core Processor: e200z2, e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 80MHz, 160MHz
• Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: 129
• Program Memory Size: 6MB (6M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 768K x 8
• Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
• Data Converters: A/D 48x10b, 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 176-LQFP Exposed Pad
• Supplier Device Package: 176-LQFP (24x24)

package: -

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LS1027AXN7HNA

NXP

IC MPU QORIQ 800MHZ 448FBGA

• Core Processor: ARM® Cortex®-A72
• Number of Cores/Bus Width: 2 Core, 64-Bit
• Speed: 800MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: 1Gbps (1), 2.5Gbps (5)
• SATA: SATA 6Gbps (1)
• USB: -
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 448-BFBGA
• Supplier Device Package: 448-FBGA (17x17)

package: -

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S32K311NHT0MPAST

NXP

S32K311, CES, 100 MAXQFP

• Core Processor: ARM® Cortex®-M7
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
• Peripherals: DMA, I2S, WDT
• Number of I/O: -
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 112K x 8
• Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
• Data Converters: A/D 24x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-QFP
• Supplier Device Package: 100-MaxQFP (10x10)

package: -

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K32L2B11VMP0A

NXP

IC MCU 32BIT 64KB FLASH 64MAPBGA

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit Single-Core
• Speed: 48MHz
• Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
• Peripherals: DMA, LCD, PWM, WDT
• Number of I/O: -
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.2V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 64-LFBGA
• Supplier Device Package: 64-MAPBGA (5x5)

package: -

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MIMX8MN6DVTJZCA

NXP

IC MPU 1.5GHZ/750MHZ 486LFBGA

• Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
• Number of Cores/Bus Width: 5 Core, 64-Bit
• Speed: 1.5GHz, 750MHz
• Co-Processors/DSP: Multimedia; NEON™ MPE
• RAM Controllers: DDR3L, DDR4, LPDDR4
• Graphics Acceleration: Yes
• Display & Interface Controllers: MIPI-CSI, MIPI-DSI, LCD
• Ethernet: GbE
• SATA: -
• USB: USB 2.0 OTG + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 95°C (TJ)
• Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
• Package / Case: 486-LFBGA, FCBGA
• Supplier Device Package: 486-LFBGA (14x14)

package: -

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MC33FS8420G0ESR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

• Applications: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

package: -

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