NXP Producten

BUK9516-55A,127

NXP

MOSFET N-CH 55V 66A TO220AB

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 55V
• Current - Continuous Drain (Id) @ 25°C: 66A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
• Vgs(th) (Max) @ Id: 2V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: -
• Input Capacitance (Ciss) (Max) @ Vds: 3085pF @ 25V
• Vgs (Max): ±10V
• FET Feature: -
• Power Dissipation (Max): 138W (Tc)
• Rds On (Max) @ Id, Vgs: 15 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: TO-220AB
• Package / Case: TO-220-3

package: TO-220-3

BUK7524-55A,127

NXP

MOSFET N-CH 55V 47A TO220AB

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 55V
• Current - Continuous Drain (Id) @ 25°C: 47A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 10V
• Vgs(th) (Max) @ Id: 4V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: -
• Input Capacitance (Ciss) (Max) @ Vds: 1310pF @ 25V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 106W (Tc)
• Rds On (Max) @ Id, Vgs: 24 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: TO-220AB
• Package / Case: TO-220-3

package: TO-220-3

MRF377HR3

NXP

FET RF 65V 860MHZ NI-860C

• Transistor Type: LDMOS
• Frequency: 860MHz
• Gain: 18.2dB
• Voltage - Test: 32V
• Current Rating: 17A
• Noise Figure: -
• Current - Test: 2A
• Power - Output: 45W
• Voltage - Rated: 65V
• Package / Case: NI-860C3
• Supplier Device Package: NI-860C3

package: NI-860C3

BFU530WF

NXP

TRANS RF NPN 12V 40MA SOT-323

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 12V
• Frequency - Transition: 11GHz
• Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz
• Gain: 12.5dB
• Power - Max: 450mW
• DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
• Current - Collector (Ic) (Max): 40mA
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SC-70, SOT-323
• Supplier Device Package: SOT-323-3

package: SC-70, SOT-323

NTS0101GW,125

NXP

TXRX TRANSLATING DUAL 6TSSOP

• Translator Type: Voltage Level
• Channel Type: Bidirectional
• Number of Circuits: 1
• Channels per Circuit: 1
• Voltage - VCCA: 1.65V ~ 3.6V
• Voltage - VCCB: 2.3V ~ 5.5V
• Input Signal: -
• Output Signal: -
• Output Type: Open Drain, Tri-State
• Data Rate: 50Mbps
• Operating Temperature: -40°C ~ 125°C (TA)
• Features: Auto-Direction Sensing
• Mounting Type: Surface Mount
• Package / Case: 6-TSSOP, SC-88, SOT-363
• Supplier Device Package: 6-TSSOP

package: 6-TSSOP, SC-88, SOT-363

N74F32D,623

NXP

IC GATE OR 4CH 2-INP 14-SO

• Logic Type: OR Gate
• Number of Circuits: 4
• Number of Inputs: 2
• Features: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Max): -
• Current - Output High, Low: 1mA, 20mA
• Logic Level - Low: 0.8V
• Logic Level - High: 2V
• Max Propagation Delay @ V, Max CL: 5.6ns @ 5V, 50pF
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-SO
• Package / Case: 14-SOIC (0.154", 3.90mm Width)

package: 14-SOIC (0.154", 3.90mm Width)

N74F374N,602

NXP

IC D-TYPE POS TRG SNGL 20DIP

• Function: Standard
• Type: D-Type
• Output Type: Tri-State, Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 8
• Clock Frequency: 165MHz
• Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 3mA, 24mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Iq): 86mA
• Input Capacitance: -
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Through Hole
• Package / Case: 20-DIP (0.300", 7.62mm)

package: 20-DIP (0.300", 7.62mm)

TDA18274HD/C1,557

NXP

IC TUNER TERR/CATV 48HLQFN

• Type: Tuner
• Applications: TV
• Mounting Type: Surface Mount
• Package / Case: 48-LFQFN Exposed Pad
• Supplier Device Package: 48-HLQFN (7x7)

package: 48-LFQFN Exposed Pad

P5020NSN1TNB

NXP

IC MPU Q OR IQ 2.0GHZ 1295FCBGA

• Core Processor: PowerPC e5500
• Number of Cores/Bus Width: 2 Core, 64-Bit
• Speed: 2.0GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1 Gbps (5), 10 Gbps (1)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1295-BBGA, FCBGA
• Supplier Device Package: 1295-FCPBGA (37.5x37.5)

package: 1295-BBGA, FCBGA

P1014NSN5DFA

NXP

IC MPU Q OR IQ 800MHZ 425TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 425-FBGA
• Supplier Device Package: 425-TEPBGA I (19x19)

package: 425-FBGA

MPC8536AVTAUL

NXP

IC MPU MPC85XX 1.333GHZ 783BGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 (3)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 90°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

KMPC8555EPXALF

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: Communications; CPM, Security; SEC
• RAM Controllers: DDR, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

MCF52233CVM60

NXP

IC MCU 32BIT 256KB FLASH 121BGA

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 60MHz
• Connectivity: Ethernet, I2C, SPI, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 73
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 121-LBGA
• Supplier Device Package: 121-MAPBGA (12x12)

package: 121-LBGA

SPC5602PEF0VLL6

NXP

IC MCU 32BIT 256KB FLASH 100LQFP

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CAN, LIN, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 79
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 16
• RAM Size: 20K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: 100-LQFP

MC9S08SE8VTG

NXP

IC MCU 8BIT 8KB FLASH 16TSSOP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: LIN, SCI
• Peripherals: LVD, POR, PWM
• Number of I/O: 14
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: 16-TSSOP (0.173", 4.40mm Width)

S9S08SG4E2CSC

NXP

IC MCU 8BIT 4KB FLASH 8SOIC

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 4
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

package: 8-SOIC (0.154", 3.90mm Width)

S9S12ZVL32F0MLC

NXP

IC MCU 16BIT 32KB FLASH 32LQFP

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, LIN, SCI, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 19
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

package: 32-LQFP

SPC5743RK1MLU5

NXP

IC MCU 32BIT 2MB FLASH 176LQFP

• Core Processor: e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 200MHz
• Connectivity: CAN, Ethernet, I2C, LIN, SCI, SPI, UART/USART
• Peripherals: DMA, LVD, POR, Zipwire
• Number of I/O: -
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 3.5 V ~ 5.5 V
• Data Converters: A/D 12b SAR, 16b Sigma-Delta
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP
• Supplier Device Package: 176-LQFP (24x24)

package: 176-LQFP

MK64FX512VLQ12

NXP

IC MCU 32BIT 512KB FLASH 144LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 100
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 192K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 41x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

SPAKDSP303VF100

NXP

IC DSP 24BIT 100MHZ 196-MAPBGA

• Type: Fixed Point
• Interface: Host Interface, SSI, SCI
• Clock Rate: 100MHz
• Non-Volatile Memory: ROM (576 B)
• On-Chip RAM: 24kB
• Voltage - I/O: 3.30V
• Voltage - Core: 3.30V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 196-LBGA
• Supplier Device Package: 196-MAPBGA (15x15)

package: 196-LBGA

JN5168-001-M05Z

NXP

RF TXRX MODULE 802.15.4 U.FL ANT

• RF Family/Standard: 802.15.4
• Protocol: Zigbee?
• Modulation: O-QPSK
• Frequency: 2.4GHz
• Data Rate: -
• Power - Output: 9.5dBm
• Sensitivity: -96dBm
• Serial Interfaces: I2C, SPI, UART
• Antenna Type: Not Included, U.FL
• Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
• Voltage - Supply: 2 V ~ 3.6 V
• Current - Receiving: 22mA
• Current - Transmitting: 35mA
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 27-SMD Module

package: 27-SMD Module

TWR-KW24D512

NXP

TOWER SYSTEM KIT

• Type: Transceiver; 802.15.4
• Frequency: 2.4GHz
• For Use With/Related Products: KW2x
• Supplied Contents: Board, Cable

package: -

BGU7051,118

NXP

IC AMP LNA FOR WIRELESS 10HVSON

• Frequency: 500MHz ~ 1.5GHz
• P1dB: 16.5dB
• Gain: 21dB
• Noise Figure: 0.65dB
• RF Type: General Purpose
• Voltage - Supply: 3 V ~ 3.6 V
• Current - Supply: 65mA
• Test Frequency: 900MHz
• Package / Case: 10-VFDFN Exposed Pad
• Supplier Device Package: 10-HVSON (3x3)

package: 10-VFDFN Exposed Pad

BGA2716,115

NXP

MMIC AMPLIFIER 6TSSOP

• Frequency: 50MHz ~ 3.6GHz
• P1dB: 8.9dBm (7.8mW)
• Gain: 22.9dB
• Noise Figure: 5.3dB
• RF Type: ISM
• Voltage - Supply: 5 V ~ 6 V
• Current - Supply: 15.9mA
• Test Frequency: 1GHz
• Package / Case: 6-TSSOP, SC-88, SOT-363
• Supplier Device Package: 6-TSSOP

package: 6-TSSOP, SC-88, SOT-363

MKL17Z256VMP4R

NXP

KINETIS KL17: 48MHZ CORTEX-M0+ U

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I²C, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 20x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LFBGA
• Supplier Device Package: 64-MAPBGA (5x5)

package: 64-LFBGA

SAF4000EL-101Z275K

NXP

SAF4000EL

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

Request a Quote

LX2160CC72232B

NXP

LAYERSCAPE 64-BIT ARM CORTEX-A72

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCPBGA (40x40)

package: -

Request a Quote

MIMX8DX6GVLFZAC

NXP

I.MX 8X FIPS

• Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
• Number of Cores/Bus Width: 3 Core, 64-Bit
• Speed: 1.2GHz, 264MHz
• Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
• RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
• Graphics Acceleration: Yes
• Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
• Ethernet: 10/100/1000Mbps (2)
• SATA: -
• USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
• Package / Case: 609-BFBGA
• Supplier Device Package: 609-FBGA (21x21)

package: -

Request a Quote