NXP Producten

MRF6S19100HSR5

NXP

FET RF 68V 1.99GHZ NI-780S

• Transistor Type: LDMOS
• Frequency: 1.99GHz
• Gain: 16.1dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 900mA
• Power - Output: 22W
• Voltage - Rated: 68V
• Package / Case: NI-780S
• Supplier Device Package: NI-780S

package: NI-780S

MRF6S18060NBR1

NXP

FET RF 68V 1.99GHZ TO272-4

• Transistor Type: LDMOS
• Frequency: 1.99GHz
• Gain: 15dB
• Voltage - Test: 26V
• Current Rating: -
• Noise Figure: -
• Current - Test: 600mA
• Power - Output: 60W
• Voltage - Rated: 68V
• Package / Case: TO-272BB
• Supplier Device Package: TO-272 WB-4

package: TO-272BB

PIP250M,518

NXP

IC REG BUCK ADJ 15A SYNC 68HVQFN

• Function: Step-Down
• Output Configuration: Positive
• Topology: Buck
• Output Type: Adjustable
• Number of Outputs: 1
• Voltage - Input (Min): 5V
• Voltage - Input (Max): -
• Voltage - Output (Min/Fixed): 0.8V
• Voltage - Output (Max): -
• Current - Output: 15A
• Frequency - Switching: 300kHz
• Synchronous Rectifier: Yes
• Operating Temperature: -40°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 68-VFQFN Exposed Pad
• Supplier Device Package: 68-HVQFN (10x10)

package: 68-VFQFN Exposed Pad

PCA9625D,518

NXP

IC LED DRIVER LIN DIM 100MA 32SO

• Type: Linear
• Topology: -
• Internal Switch(s): Yes
• Number of Outputs: 16
• Voltage - Supply (Min): 2.3V
• Voltage - Supply (Max): 5.5V
• Voltage - Output: 24V
• Current - Output / Channel: 100mA
• Frequency: 100kHz ~ 1MHz
• Dimming: PWM
• Applications: Backlight
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 32-SO

package: 32-SOIC (0.295", 7.50mm Width)

PCA85133U/2DA/Q1Z

NXP

IC LCD DRIVER UNIV UNCASED

• Display Type: LCD
• Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
• Interface: I2C
• Digits or Characters: 20 Characters, 40 Characters, 320 Elements
• Current - Supply: 50mA
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 95°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

package: Die

74HC93D,112

NXP

IC 4B BINARY RIPPL COUNT 14SOIC

• Logic Type: Binary Counter
• Direction: Up
• Number of Elements: 1
• Number of Bits per Element: 4
• Reset: Asynchronous
• Timing: -
• Count Rate: 108MHz
• Trigger Type: Negative Edge
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

package: 14-SOIC (0.154", 3.90mm Width)

74AHCT1G07GW,165

NXP

IC BUFF N-INV OP/DRAIN 5TSSOP

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 1
• Input Type: -
• Output Type: Open Drain
• Current - Output High, Low: -, 8mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 5-TSSOP, SC-70-5, SOT-353
• Supplier Device Package: 5-TSSOP

package: 5-TSSOP, SC-70-5, SOT-353

PC34CM0902WEFR2

NXP

DUAL CAN HS 14SOIC

• Applications: -
• Interface: -
• Voltage - Supply: -
• Package / Case: -
• Supplier Device Package: -
• Mounting Type: -

package: -

MCZ33904A5EKR2

NXP

IC SYSTEM BASIS CHIP 32-SOIC

• Applications: System Basis Chip
• Interface: CAN
• Voltage - Supply: 5.5 V ~ 28 V
• Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP
• Mounting Type: Surface Mount

package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

UJA1065TW/3V0,512

NXP

IC CAN/LIN FAIL-SAFE 32HTSSOP

• Applications: Automotive Networking
• Interface: SPI Serial
• Voltage - Supply: 5.5 V ~ 52 V
• Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
• Supplier Device Package: 32-HTSSOP
• Mounting Type: Surface Mount

package: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

P1025NSN5BFB

NXP

IC MPU Q OR IQ 667MHZ 561TEBGA1

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 125°C (TA)
• Security Features: -
• Package / Case: 561-FBGA
• Supplier Device Package: 561-TEPBGA1 (23x23)

package: 561-FBGA

MPC8358ZUADDE

NXP

IC MPU MPC83XX 266MHZ 740TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 740-LBGA
• Supplier Device Package: 740-TBGA (37.5x37.5)

package: 740-LBGA

MC7448VS1267NC

NXP

IC MPU MPC74XX 1.267GHZ 360LGA

• Core Processor: PowerPC G4
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.267GHz
• Co-Processors/DSP: Multimedia; SIMD
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 360-CLGA, FCCLGA
• Supplier Device Package: 360-FCCLGA (25x25)

package: 360-CLGA, FCCLGA

KMPC875ZT80

NXP

IC MPU MPC8XX 80MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 80MHz
• Co-Processors/DSP: Communications; CPM, Security; SEC
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1), 10/100 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: Cryptography
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

package: 256-BBGA

MC68SEC000AA20B1

NXP

IC MPU M680X0 20MHZ 64QFP

• Core Processor: EC000
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 20MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 3.3V, 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

package: 64-QFP

MC9S08QG8CDNER

NXP

IC MCU 8BIT 8KB FLASH 8SOIC

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 4
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

package: 8-SOIC (0.154", 3.90mm Width)

MC68HC908LB8CPE

NXP

IC MCU 8BIT 8KB FLASH 20DIP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LVR, POR, PWM
• Number of I/O: 18
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 7x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-DIP (0.300", 7.62mm)
• Supplier Device Package: 20-DIP

package: 20-DIP (0.300", 7.62mm)

MC9S08PA4VWJR

NXP

IC MCU 8BIT 4KB FLASH 20SOIC

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: LIN, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 18
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

package: 20-SOIC (0.295", 7.50mm Width)

MC9S08QE16CWL

NXP

IC MCU 8BIT 16KB FLASH 28SOIC

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 50MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number of I/O: 22
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

package: 28-SOIC (0.295", 7.50mm Width)

MK64FN1M0VDC12

NXP

IC MCU 32BIT 1MB FLASH 121MAPBGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 83
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 37x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 121-XFBGA
• Supplier Device Package: 121-MAPBGA (8x8)

package: 121-XFBGA

MC9S12DG256CPVE

NXP

IC MCU 16BIT 256KB FLASH 112LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: PWM, WDT
• Number of I/O: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

package: 112-LQFP

OM7618/BGA2011

NXP

EVAL BOARD FOR BGA2011

• Type: Amplifier
• Frequency: 1.8GHz
• For Use With/Related Products: BGA2714
• Supplied Contents: Board

package: -

FS32K144UAT0VLLT

NXP

S32K144 32-BIT MCU ARM

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 112MHz
• Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: 100-LQFP

S9S12GA192F0CLL

NXP

16BIT 192K FLASH 11K RAM

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 86
• Program Memory Size: 192KB (192K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 11K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 16x12b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: 100-LQFP

TDF8532HH-N2-S710K

NXP

IC AMPLIFIER CLASS D 100HLQFP

• Type: Class D
• Output Type: 4-Channel (Quad)
• Max Output Power x Channels @ Load: 80W x 4 @ 2Ohm
• Voltage - Supply: 5.5V ~ 25V
• Features: -
• Mounting Type: Surface Mount
• Operating Temperature: -
• Supplier Device Package: 100-HLQFP (14x14)
• Package / Case: 100-FQFP Exposed Pad

package: -

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MC56F80748VLH

NXP

IC MCU 32BIT 64KB FLASH 64LQFP

• Core Processor: 56800EF
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: I2C, LINbus, SCI, SPI
• Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
• Data Converters: A/D 14x12b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: -

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MC33FS6600M2ES

NXP

SAFETY SBC FOR S32S2 MCU

• Applications: Safety
• Current - Supply: -
• Voltage - Supply: 2.7V ~ 60V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

package: -

LX2120SC72232B

NXP

IC MPU QORLQ 2.2GHZ 1517FCPBGA

• Core Processor: ARM® Cortex®-A72
• Number of Cores/Bus Width: 12 Core, 64-Bit
• Speed: 2.2GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR4
• Graphics Acceleration: Yes
• Display & Interface Controllers: -
• Ethernet: 100Gbps (2)
• SATA: SATA 3.0 (4)
• USB: USB 3.0 (2) + PHY (2)
• Voltage - I/O: 1.2V, 1.8V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TJ)
• Security Features: Secure Boot, TrustZone®
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCPBGA (40x40)

package: -

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