NXP Producten

PH9930L,115

NXP

MOSFET N-CH 30V 63A LFPAK

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 30V
• Current - Continuous Drain (Id) @ 25°C: 63A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 2.15V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 13.3nC @ 4.5V
• Input Capacitance (Ciss) (Max) @ Vds: 1565pF @ 12V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 62.5W (Tc)
• Rds On (Max) @ Id, Vgs: 9.9 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: LFPAK56, Power-SO8
• Package / Case: SC-100, SOT-669

package: SC-100, SOT-669

MRF373ALR1

NXP

FET RF 70V 860MHZ NI-360

• Transistor Type: LDMOS
• Frequency: 860MHz
• Gain: 18.2dB
• Voltage - Test: 32V
• Current Rating: -
• Noise Figure: -
• Current - Test: 200mA
• Power - Output: 75W
• Voltage - Rated: 70V
• Package / Case: NI-360
• Supplier Device Package: NI-360

package: NI-360

MRF7S18170HR3

NXP

FET RF 65V 1.81GHZ NI-880

• Transistor Type: LDMOS
• Frequency: 1.81GHz
• Gain: 17.5dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.4A
• Power - Output: 50W
• Voltage - Rated: 65V
• Package / Case: NI-880
• Supplier Device Package: NI-880

package: NI-880

PDTA113EE,115

NXP

TRANS PREBIAS PNP 150MW SC75

• Transistor Type: PNP - Pre-Biased
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Resistor - Base (R1) (Ohms): 1k
• Resistor - Emitter Base (R2) (Ohms): 1k
• DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 40mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 150mV @ 1.5mA, 30mA
• Current - Collector Cutoff (Max): 1µA
• Frequency - Transition: -
• Power - Max: 150mW
• Mounting Type: Surface Mount
• Package / Case: SC-75, SOT-416
• Supplier Device Package: SC-75

package: SC-75, SOT-416

BZX284-B10,115

NXP

DIODE ZENER 10V 400MW SOD2

• Voltage - Zener (Nom) (Vz): 10V
• Tolerance: ±2%
• Power - Max: 400mW
• Impedance (Max) (Zzt): 10 Ohms
• Current - Reverse Leakage @ Vr: 200nA @ 7V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: SOD-110
• Supplier Device Package: SOD110

package: SOD-110

NX1117CE15Z,115

NXP

IC REG LINEAR 1.5V 1A SOT223

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 20V
• Voltage - Output (Min/Fixed): 1.5V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 1.2V @ 800mA
• Current - Output: 1A
• Current - Quiescent (Iq): -
• Current - Supply (Max): 6mA
• PSRR: 69dB (120Hz)
• Control Features: -
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: TO-261-4, TO-261AA
• Supplier Device Package: SOT-223

package: TO-261-4, TO-261AA

MC50XSD200BEKR2

NXP

IC SWITCH HISD 36V DUAL 32SOIC

• Switch Type: General Purpose
• Number of Outputs: 2
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 8 V ~ 36 V
• Voltage - Supply (Vcc/Vdd): 3.3 V ~ 5 V
• Current - Output (Max): 1.2A
• Rds On (Typ): 50 mOhm
• Input Type: -
• Features: Slew Rate Controlled
• Fault Protection: Open Load Detect, Over Temperature
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP

package: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

PCF8576T,112

NXP

IC LCD DVR UNVRSL LOW-MUX 56VSOP

• Display Type: LCD
• Configuration: 8 Segment, 15 Segment, 160 Element
• Interface: I2C, 2-Wire Serial
• Digits or Characters: 10 Characters, 20 Characters, 160 Elements
• Current - Supply: 180µA
• Voltage - Supply: 2 V ~ 9 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 56-BSOP (0.435", 11.05mm Width)
• Supplier Device Package: 56-VSOP

package: 56-BSOP (0.435", 11.05mm Width)

N74F543DB,118

NXP

IC TRANSCVR TRI-ST 8BIT 24SSOP

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 3mA, 24mA; 15mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 24-SSOP

package: 24-SSOP (0.209", 5.30mm Width)

N74F243D,602

NXP

IC BUS TRANSCVR 3-ST 4BIT 14SOIC

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 15mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

package: 14-SOIC (0.154", 3.90mm Width)

TDA8037TT/C1J

NXP

IC SMART CARD 16TSSOP

• Applications: Smart Card
• Interface: -
• Voltage - Supply: 3.3V
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP
• Mounting Type: Surface Mount

package: 16-TSSOP (0.173", 4.40mm Width)

NX3L1G384GM,115

NXP

IC SWITCH SPST 6XSON

• Switch Circuit: SPST - NC
• Multiplexer/Demultiplexer Circuit: 1:1
• Number of Circuits: 1
• On-State Resistance (Max): 750 mOhm
• Channel-to-Channel Matching (ΔRon): -
• Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 24ns, 7ns
• -3db Bandwidth: 60MHz
• Charge Injection: 6pC
• Channel Capacitance (CS(off), CD(off)): 35pF
• Current - Leakage (IS(off)) (Max): 10nA
• Crosstalk: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 6-XFDFN
• Supplier Device Package: 6-XSON, SOT886 (1.45x1)

package: 6-XFDFN

MPC855TZQ50D4R2

NXP

IC MPU MPC8XX 50MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 50MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1), 10/100 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

package: 357-BBGA

MPC8323ECVRADDCA

NXP

IC MPU MPC83XX 266MHZ 516BGA

• Core Processor: PowerPC e300c2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

package: 516-BBGA

MC68HC11D0CFNE2

NXP

IC MCU 8BIT ROMLESS 44PLCC

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 2MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number of I/O: 26
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 192 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (17.525x17.525)

package: 44-LCC (J-Lead)

MPC5566MZP144

NXP

IC MCU 32BIT 3MB FLASH 416BGA

• Core Processor: e200z6
• Core Size: 32-Bit
• Speed: 144MHz
• Connectivity: CAN, EBI/EMI, Ethernet, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 256
• Program Memory Size: 3MB (3M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
• Data Converters: A/D 40x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 416-BBGA
• Supplier Device Package: 416-PBGA (27x27)

package: 416-BBGA

SPC5604BF2MLQ6

NXP

IC MCU 32BIT 512KB FLASH 144LQFP

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 123
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 16
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 36x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

MC9S08DZ96CLF

NXP

IC MCU 8BIT 96KB FLASH 48LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 6K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

MC9S08PA60VLDR

NXP

IC MCU 8BIT 60KB FLASH 44LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 37
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

package: 44-LQFP

MSC8154ESVT1000B

NXP

IC PROCESSOR QUAD DGTL 783FCBGA

• Type: SC3850 Quad Core
• Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
• Clock Rate: 1GHz
• Non-Volatile Memory: ROM (96 kB)
• On-Chip RAM: 576kB
• Voltage - I/O: 2.50V
• Voltage - Core: 1.00V
• Operating Temperature: 0°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

PCF8523AUG/HAV

NXP

IC RTC CLK/CALENDAR I2C 12WLCSP

• Type: -
• Features: -
• Memory Size: -
• Time Format: -
• Date Format: -
• Interface: -
• Voltage - Supply: -
• Voltage - Supply, Battery: -
• Current - Timekeeping (Max): -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

KTY82/251,215

NXP

IC TEMP SENSOR SOT23

• Resistance in Ohms @ 25°C: 1.95k
• Resistance Tolerance: -
• Operating Temperature: -55°C ~ 150°C
• Power - Max: -
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

package: TO-236-3, SC-59, SOT-23-3

MKL16Z256VLH4R

NXP

KINETIS KL16: 48MHZ CORTEX-M0+ U

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I²C, LINbus, SPI, TSI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D - 16bit, D/A - 12bit
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

S9S12GA48AMLF

NXP

12-BIT ADC SPE TST SCREE

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1.5K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

S32G379ASCK1VUCT

NXP

4XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2

• Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
• Number of Cores/Bus Width: 4 Core, 32/64-Bit
• Speed: 400MHz, 1.3GHz
• Co-Processors/DSP: Multimedia; NEON
• RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 2.5Gbps (3)
• SATA: -
• USB: USB 2.0 OTG (1)
• Voltage - I/O: 1.8V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
• Package / Case: 525-FBGA, FCBGA
• Supplier Device Package: 525-FCPBGA (19x19)

package: -

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FS32K116LFT0VFMT

NXP

IC MCU 32BIT 128KB FLASH 32HVQFN

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit Single-Core
• Speed: 48MHz
• Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
• Peripherals: DMA, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 17K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 13x12b SAR; D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

package: -

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LX2080XC72029B

NXP

IC MPU QORLQ LX2 2GHZ 1517FCPBGA

• Core Processor: ARM® Cortex®-A72
• Number of Cores/Bus Width: 8 Core, 64-Bit
• Speed: 2GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR4
• Graphics Acceleration: Yes
• Display & Interface Controllers: -
• Ethernet: 100Gbps (2)
• SATA: SATA 3.0 (4)
• USB: USB 3.0 (2) + PHY (2)
• Voltage - I/O: 1.2V, 1.8V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Security Features: Secure Boot, TrustZone®
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCPBGA (40x40)

package: -

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SPC5643LFAMLL6

NXP

IC MCU 32BIT 1MB FLASH 100LQFP

• Core Processor: e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 64MHz
• Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 3V ~ 3.63V
• Data Converters: A/D 32x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: -

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