NXP Producten

MRF21010LSR5

NXP

FET RF 65V 2.17GHZ NI-360S

• Transistor Type: LDMOS
• Frequency: 2.17GHz
• Gain: 13.5dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 100mA
• Power - Output: 10W
• Voltage - Rated: 65V
• Package / Case: NI-360S
• Supplier Device Package: NI-360 Short Lead

package: NI-360S

MRFE6S9125NR1

NXP

FET RF 66V 880MHZ TO-270-4

• Transistor Type: LDMOS
• Frequency: 880MHz
• Gain: 20.2dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 950mA
• Power - Output: 27W
• Voltage - Rated: 66V
• Package / Case: TO-270AB
• Supplier Device Package: TO-270 WB-4

package: TO-270AB

PZM15NB2,115

NXP

DIODE ZENER 15V 300MW SMT3

• Voltage - Zener (Nom) (Vz): 15V
• Tolerance: ±2%
• Power - Max: 300mW
• Impedance (Max) (Zzt): 15 Ohms
• Current - Reverse Leakage @ Vr: 70nA @ 11V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

package: TO-236-3, SC-59, SOT-23-3

74LV251D,118

NXP

IC 8-INPUT MUX 3-ST 16SOIC

• Type: Multiplexer
• Circuit: 1 x 8:1
• Independent Circuits: 1
• Current - Output High, Low: 6mA, 6mA
• Voltage Supply Source: Single Supply
• Voltage - Supply: 1 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

package: 16-SOIC (0.154", 3.90mm Width)

74HCT273D/AUJ

NXP

IC FLIP-FLOP OCT D POS 20SOIC

• Function: Master Reset
• Type: D-Type
• Output Type: Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 8
• Clock Frequency: 36MHz
• Max Propagation Delay @ V, Max CL: 30ns @ 4.5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 4mA, 5.2mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Iq): 8µA
• Input Capacitance: 3.5pF
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)

package: 20-SOIC (0.295", 7.50mm Width)

74HC160PW,112

NXP

IC SYNC BCD DECADE COUNT 16TSSOP

• Logic Type: Counter, Decade
• Direction: Up
• Number of Elements: 1
• Number of Bits per Element: 4
• Reset: Asynchronous
• Timing: Synchronous
• Count Rate: 66MHz
• Trigger Type: Positive Edge
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: 16-TSSOP (0.173", 4.40mm Width)

PCA9549PW,118

NXP

IC SWITCH OCTAL BUS 24TSSOP

• Applications: Translating Switch
• Interface: I2C, SMBus
• Voltage - Supply: 2.3 V ~ 3.6 V, 4.5 V ~ 5.5 V
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 24-TSSOP
• Mounting Type: Surface Mount

package: 24-TSSOP (0.173", 4.40mm Width)

KMPC862PVR66B

NXP

IC MPU MPC8XX 66MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (4), 10/100 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

package: 357-BBGA

KMPC8555EVTALF

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: Communications; CPM, Security; SEC
• RAM Controllers: DDR, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

MCIMX6X1CVO08AB

NXP

IC MPU 32BIT I.MX6 800MHZ 400BGA

• Core Processor: ARM? Cortex?-A9, ARM? Cortex?-M4
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 200MHz, 800MHz
• Co-Processors/DSP: Multimedia; NEON? MPE
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
• Package / Case: 400-LFBGA
• Supplier Device Package: 400-MAPBGA (17x17)

package: 400-LFBGA

MC9S12KG256VPVE

NXP

IC MCU 16BIT 256KB FLASH 112LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

package: 112-LQFP

MC9S08RD32CDWE

NXP

IC MCU 8BIT 32KB FLASH 28SOIC

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 23
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

package: 28-SOIC (0.295", 7.50mm Width)

P87C51RD2BBD,157

NXP

IC MCU 8BIT 64KB OTP 44LQFP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 32
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

package: 44-LQFP

SPC5634MF2MLU80

NXP

IC MCU 32BIT 1.5MB FLASH 176LQFP

• Core Processor: e200z3
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, LIN, SCI, SPI, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 80
• Program Memory Size: 1.5MB (1.5M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 94K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
• Data Converters: A/D 34x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP
• Supplier Device Package: 176-LQFP (24x24)

package: 176-LQFP

MC9S08QA4CPAE

NXP

IC MCU 8BIT 4KB FLASH 8DIP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 4
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

package: 8-DIP (0.300", 7.62mm)

S9KEAZN16AMLC

NXP

IC MCU 32BIT 16KB FLASH 32LQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

package: 32-LQFP

PCF85363ATL/AX

NXP

IC RTC CLK/CALENDAR I2C 10DFN

• Type: Clock/Calendar
• Features: Alarm, Leap Year, Watchdog Timer
• Memory Size: -
• Time Format: HH:MM:SS:hh (12/24 hr)
• Date Format: YY-MM-DD-dd
• Interface: I2C, 2-Wire Serial
• Voltage - Supply: 0.9 V ~ 5.5 V
• Voltage - Supply, Battery: 0.9 V ~ 5.5 V
• Current - Timekeeping (Max): 0.885µA @ 3.3V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-XFDFN Exposed Pad
• Supplier Device Package: 10-DFN (2.6x2.6)

package: 10-XFDFN Exposed Pad

MMA2718WR2

NXP

ACCELEROMETER 187G PCM/SPI 16QFN

• Type: Digital
• Axis: X
• Acceleration Range: ±187g
• Sensitivity (LSB/g): 2.731
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: PCM, SPI
• Voltage - Supply: 4 V ~ 20 V
• Features: Selectable Low Pass Filter
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-QFN
• Supplier Device Package: 16-QFN (6x6)

package: 16-QFN

TDA8274AHN/C1,518

NXP

IC TUNER CABLE SILICON 40HVQFN

• Frequency: -
• Sensitivity: -
• Data Rate (Max): -
• Modulation or Protocol: -
• Applications: General Purpose
• Current - Receiving: -
• Data Interface: PCB, Surface Mount
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: -
• Voltage - Supply: 3.3V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-HVQFN (6x6)

package: 40-VFQFN Exposed Pad

TEF6624T/V1T,512

NXP

IC CAR RADIO SGL CHIP 32SOIC

• Frequency: -
• Sensitivity: -
• Data Rate (Max): -
• Modulation or Protocol: AM, FM, RDS
• Applications: AM/FM Radio Receiver
• Current - Receiving: -
• Data Interface: PCB, Surface Mount
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: -
• Voltage - Supply: 8.5V
• Operating Temperature: -20°C ~ 85°C
• Package / Case: 32-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 32-SO

package: 32-SOIC (0.295", 7.50mm Width)

MCIMX6S7CVM08ADR

NXP

I.MX6 SOLO ROM PERFENHAN

• Core Processor: ARM® Cortex®-A9
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Multimedia; NEON™ SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (4)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 624-LFBGA
• Supplier Device Package: 624-MAPBGA (21x21)

package: 624-LFBGA

MKE16F512VLL16

NXP

KINETIS KE16F: 160MHZ CORTEX-M4F

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 168MHz
• Connectivity: CANbus, FlexIO, I²C, SPI, UART/USART
• Peripherals: DMA, LVD, PWM, WDT
• Number of I/O: 89
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 68K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: 100-LQFP

TJA1051T-3-1U

NXP

IC TRANSCEIVER HALF 1/1 8SO

• Type: Transceiver
• Protocol: CANbus
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 120 mV
• Data Rate: 5Mbps
• Voltage - Supply: 4.5V ~ 5.5V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

package: -

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SAF4000EL-101S530Y

NXP

SOFTWARE DEFINED RADIO

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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S9S12ZVLS1ACFM

NXP

S12Z CPU, 16K FLASH

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 18
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
• Data Converters: A/D 6x10b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN-EP (5x5)

package: -

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LPC51U68JBD48K

NXP

IC MCU 32BIT 256KB FLASH 48LQFP

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit Single-Core
• Speed: 100MHz
• Connectivity: USART, SPIs, I2C, USB
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT, DMA
• Number of I/O: 37
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 32K x 8
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
• Data Converters: A/D 12x12b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: -

MC34PF8100CCEPR2

NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

• Applications: High Performance i.MX 8, S32x Processor Based
• Current - Supply: -
• Voltage - Supply: 2.5V ~ 5.5V
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

package: -

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FS32K142HRT0MLLT

NXP

IC MCU 32BIT 256KB FLASH 100LQFP

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit Single-Core
• Speed: 80MHz
• Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 89
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 16x12b SAR; D/A1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: -

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