NXP Producten

MRF6S21140HSR5

NXP

FET RF 68V 2.12GHZ NI-880S

• Transistor Type: LDMOS
• Frequency: 2.12GHz
• Gain: 15.5dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.2A
• Power - Output: 30W
• Voltage - Rated: 68V
• Package / Case: NI-880S
• Supplier Device Package: NI-880S

package: NI-880S

BAP51-03,115

NXP

DIODE PIN GP 50V 50MA SOD-323

• Diode Type: PIN - Single
• Voltage - Peak Reverse (Max): 50V
• Current - Max: 50mA
• Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
• Resistance @ If, F: 2.5 Ohm @ 10mA, 100MHz
• Power Dissipation (Max): 500mW
• Operating Temperature: -65°C ~ 150°C (TJ)
• Package / Case: SC-76, SOD-323
• Supplier Device Package: SOD-323

package: SC-76, SOD-323

BAS216,135

NXP

DIODE GEN PURP 75V 250MA SOD2

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 75V
• Current - Average Rectified (Io): 250mA (DC)
• Voltage - Forward (Vf) (Max) @ If: 1.25V @ 150mA
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 4ns
• Current - Reverse Leakage @ Vr: 1µA @ 75V
• Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
• Mounting Type: Surface Mount
• Package / Case: SOD-110
• Supplier Device Package: SOD110
• Operating Temperature - Junction: 150°C (Max)

package: SOD-110

MC13892AJVL

NXP

IC PMU I.MX51/37/35/27 186MAPBGA

• Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 186-LFBGA
• Supplier Device Package: 186-PBGA (12x12)

package: 186-LFBGA

GTL2018PW/Q900,118

NXP

IC TRANSLATOR BIDIRECT 24-TSSOP

• Translator Type: Mixed Signal
• Channel Type: Bidirectional
• Number of Circuits: 1
• Channels per Circuit: 8
• Voltage - VCCA: -
• Voltage - VCCB: -
• Input Signal: LVTTL
• Output Signal: GTL
• Output Type: Non-Inverted
• Data Rate: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Features: -
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 24-TSSOP

package: 24-TSSOP (0.173", 4.40mm Width)

74HC670D,653

NXP

IC 4X4 REGISTER FILE 3ST 16SOIC

• Logic Type: Register File
• Output Type: Tri-State
• Number of Elements: 1
• Number of Bits per Element: 4
• Function: Universal
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

package: 16-SOIC (0.154", 3.90mm Width)

74HCT175N,652

NXP

IC D-TYPE POS TRG SNGL 16DIP

• Function: Master Reset
• Type: D-Type
• Output Type: Differential
• Number of Elements: 1
• Number of Bits per Element: 4
• Clock Frequency: 49MHz
• Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 4mA, 4mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Iq): 8µA
• Input Capacitance: 3.5pF
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)

package: 16-DIP (0.300", 7.62mm)

74LVT574PW,118

NXP

IC D-TYPE POS TRG SNGL 20TSSOP

• Function: Standard
• Type: D-Type
• Output Type: Tri-State, Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 8
• Clock Frequency: 150MHz
• Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 2.7 V ~ 3.6 V
• Current - Quiescent (Iq): 190µA
• Input Capacitance: 4pF
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)

package: 20-TSSOP (0.173", 4.40mm Width)

SA5211D/01,118

NXP

IC OPAMP TRANSIMP 180MHZ 14SO

• Amplifier Type: Transimpedance
• Number of Circuits: 1
• Output Type: Differential
• Slew Rate: -
• Gain Bandwidth Product: -
• -3db Bandwidth: 180MHz
• Current - Input Bias: -
• Voltage - Input Offset: -
• Current - Supply: 26mA
• Current - Output / Channel: 4mA
• Voltage - Supply, Single/Dual (±): 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

package: 14-SOIC (0.154", 3.90mm Width)

TDA8568Q/N3C,112

NXP

IC AMP AUDIO PWR 35W QUAD 23SIL

• Type: Class B
• Output Type: 4-Channel (Quad)
• Max Output Power x Channels @ Load: 35W x 4 @ 4 Ohm
• Voltage - Supply: 6 V ~ 18 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Through Hole
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: DBS23P
• Package / Case: 23-SIP Formed Leads

package: 23-SIP Formed Leads

TDA8563Q/N2/S10,11

NXP

IC AMP AUDIO PWR 55W STER 13SIL

• Type: Class B
• Output Type: 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 55W x 2 @ 2 Ohm
• Voltage - Supply: 6 V ~ 18 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Through Hole
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 13-PDBS
• Package / Case: 13-SIP Formed Leads

package: 13-SIP Formed Leads

MC34978AEK

NXP

IC INTERFACE SW DETECT 32-SOIC

• Applications: Multiple Switch Detection
• Interface: -
• Voltage - Supply: 4.5 V ~ 36 V
• Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP
• Mounting Type: Surface Mount

package: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

MCIMX536AVV8B

NXP

IC MPU I.MX53 800MHZ 529TEBGA

• Core Processor: ARM? Cortex?-A8
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, DDR2, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: SATA 1.5Gbps (1)
• USB: USB 2.0 (2), USB 2.0 + PHY (2)
• Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 529-FBGA
• Supplier Device Package: -

package: 529-FBGA

MC68MH360AI25VL

NXP

IC MPU M683XX 25MHZ 240FQFP

• Core Processor: CPU32+
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 25MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 240-BFQFP
• Supplier Device Package: 240-FQFP (32x32)

package: 240-BFQFP

MC56F8011VFAE

NXP

IC MCU 16BIT 12KB FLASH 32LQFP

• Core Processor: 56800E
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 26
• Program Memory Size: 12KB (6K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 16
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

package: 32-LQFP

SX2531KVWT1

NXP

ACCELEROMETER

• Type: -
• Axis: -
• Acceleration Range: -
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: -
• Voltage - Supply: -
• Features: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

MF0UL2101DUF,005

NXP

IC MIFARE ULTRALIGHT EV1 UNCASED

• Type: RFID Transponder
• Frequency: 13.56MHz
• Standards: ISO 14443, MIFARE
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -25°C ~ 70°C
• Package / Case: Die
• Supplier Device Package: Die

package: Die

PN5331B3HN/C270,55

NXP

IC NFC CNTRL 40-HVQFN

• Type: RFID Reader/Transponder
• Frequency: 13.56MHz
• Standards: FeliCa, ISO 14443, MIFARE, NFC
• Interface: -
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -30°C ~ 85°C
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-HVQFN (6x6)

package: 40-VFQFN Exposed Pad

TEF6635HW/V106K

NXP

IC DGTL CHIP AUTO RADIO 100HTQFP

• Frequency: -
• Sensitivity: -
• Data Rate (Max): -
• Modulation or Protocol: -
• Applications: -
• Current - Receiving: -
• Data Interface: -
• Memory Size: -
• Antenna Connector: -
• Features: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

package: -

SPC5517EAVMG80

NXP

NXP 32-BIT MCU POWER ARCH 1.5M

• Core Processor: e200z0, e200z1
• Core Size: 32-Bit Dual-Core
• Speed: 66MHz
• Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 111
• Program Memory Size: 1.5MB (1.5M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 80K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
• Data Converters: A/D 40x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 208-BGA
• Supplier Device Package: 208-MAPBGA (17x17)

package: 208-BGA

PCAL6534EVJ

NXP

IC GPIO EXPANDER 34B VFBGA42

• Number of I/O: 34
• Interface: I²C
• Interrupt Output: Yes
• Features: POR
• Output Type: Open Drain, Push-Pull
• Current - Output Source/Sink: -
• Clock Frequency: 1MHz
• Voltage - Supply: 1.65V ~ 5.5V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 42-VFBGA
• Supplier Device Package: 42-VFBGA (2.6x3)

package: 42-VFBGA

CBTL04083ABS-558

NXP

DIFFERENTIAL MULTIPLEXER, 4 FUNC

• Applications: -
• Multiplexer/Demultiplexer Circuit: -
• Switch Circuit: -
• Number of Channels: -
• On-State Resistance (Max): -
• Voltage - Supply, Single (V+): -
• Voltage - Supply, Dual (V±): -
• -3db Bandwidth: -
• Features: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

package: -

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MKM35Z256VLQ7R

NXP

KM35: 75MHZ CORTEX-M0+ METROLOGY

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 75MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: DMA, LCD, RNG, WDT
• Number of I/O: 99
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
• Data Converters: A/D 16x16b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: -

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ASL5015SHNZ

NXP

IC LED DRV CTRL PWM 1.5A 36HVQFN

• Type: DC DC Controller
• Topology: Switched Capacitor (Charge Pump)
• Internal Switch(s): Yes
• Number of Outputs: 12
• Voltage - Supply (Min): 4.5V
• Voltage - Supply (Max): 5.5V
• Voltage - Output: -
• Current - Output / Channel: 1.5A
• Frequency: 200MHz
• Dimming: PWM
• Applications: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 36-VFQFN Exposed Pad
• Supplier Device Package: 36-HVQFN (6x6)

package: -

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FS32R294HBK0MJDT

NXP

S32R29 MULTICORE POWER ARCHITECT

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 269-LFBGA
• Supplier Device Package: 269-LFBGA (14x14)

package: -

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MKE13Z128VLF7

NXP

IC MCU 32BIT 128KB FLASH 48LQFP

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit Single-Core
• Speed: 72MHz
• Connectivity: FlexIO, I2C, SPI, UART/USART
• Peripherals: DMA, LVD, PWM, WDT
• Number of I/O: 42
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 11x12b SAR; D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: -

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S32G399AACK1VUCT

NXP

IC MPU S32G3 1.3GZ/400MHZ 525BGA

• Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
• Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
• Speed: 400MHz, 1.3GHz
• Co-Processors/DSP: Multimedia; NEON
• RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 2.5Gbps (3)
• SATA: -
• USB: USB 2.0 OTG (1)
• Voltage - I/O: 1.8V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
• Package / Case: 525-FBGA, FCBGA
• Supplier Device Package: 525-FCPBGA (19x19)

package: -

FS32K142HRT0MLHR

NXP

IC MCU 32BIT 256KB FLASH 64LQFP

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit Single-Core
• Speed: 80MHz
• Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 58
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 16x12b SAR; D/A1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: -

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