NXP Producten

BZX284-C39,115

NXP

DIODE ZENER 39V 400MW SOD2

• Voltage - Zener (Nom) (Vz): 39V
• Tolerance: ±5%
• Power - Max: 400mW
• Impedance (Max) (Zzt): 75 Ohms
• Current - Reverse Leakage @ Vr: 50nA @ 27.3V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: SOD-110
• Supplier Device Package: SOD110

package: SOD-110

MC33910BAC

NXP

IC SYSTEM BASIS CHIP 32LQFP

• Applications: System Basis Chip
• Current - Supply: 4.5mA
• Voltage - Supply: 5.5 V ~ 27 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

package: 32-LQFP

74ALVC162334ADGG:5

NXP

IC UNIV BUS DVR 16BIT 48TSSOP

• Logic Type: Universal Bus Driver
• Number of Circuits: 16-Bit
• Current - Output High, Low: 12mA, 12mA
• Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 48-TSSOP

package: 48-TFSOP (0.240", 6.10mm Width)

GTL2010BS,118

NXP

IC VOLT TRANSLATOR 24-HVQFN

• Translator Type: Voltage Level
• Channel Type: Bidirectional
• Number of Circuits: 1
• Channels per Circuit: 10
• Voltage - VCCA: 1V ~ 5.5V
• Voltage - VCCB: 1V ~ 5.5V
• Input Signal: -
• Output Signal: -
• Output Type: Open Drain
• Data Rate: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Features: Auto-Direction Sensing
• Mounting Type: Surface Mount
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-HVQFN (4x4)

package: 24-VFQFN Exposed Pad

N74F158AD,623

NXP

IC DATA SELECTOR/MUX 2IN 16SOIC

• Type: Multiplexer
• Circuit: 4 x 2:1
• Independent Circuits: 1
• Current - Output High, Low: 1mA, 20mA
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

package: 16-SOIC (0.154", 3.90mm Width)

SC26C92A1B,557

NXP

IC UART DUAL W/FIFO 44QFP

• Features: Configurable GPIO, Internal Oscillator, Timer/Counter
• Number of Channels: 2, DUART
• FIFO's: 8 Byte
• Protocol: -
• Data Rate (Max): 1Mbps
• Voltage - Supply: 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 44-QFP
• Supplier Device Package: 44-PQFP (10x10)

package: 44-QFP

MC8640DTVU1000NC

NXP

IC MPU MPC86XX 1.0GHZ 994FCCBGA

• Core Processor: PowerPC e600
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 994-BCBGA, FCCBGA
• Supplier Device Package: 994-FCCBGA (33x33)

package: 994-BCBGA, FCCBGA

MPC8548VUATG

NXP

IC MPU MPC85XX 1.2GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

T4160NXE7PQB

NXP

IC SOC 64BIT 16X 1.5GHZ 1932BGA

• Core Processor: PowerPC e6500
• Number of Cores/Bus Width: 8 Core, 64-Bit
• Speed: 1.8GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1 Gbps (13), 10 Gbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FCPBGA (45x45)

package: 1932-BBGA, FCBGA

MC9S12D64VPVER

NXP

IC MCU 16BIT 64KB FLASH 112LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: PWM, WDT
• Number of I/O: 91
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

package: 112-LQFP

MC68334GCEH20

NXP

IC MCU 32BIT ROMLESS 132QFP

• Core Processor: CPU32
• Core Size: 32-Bit
• Speed: 20MHz
• Connectivity: EBI/EMI, UART/USART
• Peripherals: -
• Number of I/O: 47
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 8x8/10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 132-BQFP Bumpered
• Supplier Device Package: 132-PQFP (24.13x24.13)

package: 132-BQFP Bumpered

S912DG12AE0CPVE

NXP

IC MCU 16BIT 128KB FLASH 112LQFP

• Core Processor: CPU12
• Core Size: 16-Bit
• Speed: 8MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 69
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 16x8/10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

package: 112-LQFP

MC9S12XS256CAE

NXP

IC MCU 16BIT 256KB FLASH 64LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: CAN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 44
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

MC9S12XDT256VAA

NXP

IC MCU 16BIT 256KB FLASH 80QFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 59
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

package: 80-QFP

LPC2470FET208,551

NXP

IC MCU 32BIT ROMLESS 208TFBGA

• Core Processor: ARM7?
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
• Number of I/O: 160
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 98K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 208-TFBGA
• Supplier Device Package: 208-TFBGA (15x15)

package: 208-TFBGA

TDA8444T/N4,518

NXP

IC OCTUPLE DAC 6BIT 12V 16-SOIC

• Number of Bits: 6
• Number of D/A Converters: 6
• Settling Time: -
• Output Type: Voltage - Buffered
• Differential Output: No
• Data Interface: I2C
• Reference Type: External
• Voltage - Supply, Analog: 4.5 V ~ 13.2 V
• Voltage - Supply, Digital: 4.5 V ~ 13.2 V
• INL/DNL (LSB): ±0.5 (Max), ±0.5 (Max)
• Architecture: -
• Operating Temperature: -20°C ~ 70°C
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SO
• Mounting Type: -

package: 16-SOIC (0.295", 7.50mm Width)

MPXM2102GS

NXP

SENS PRESSURE 14.5 PSI MAX MPAK

• Pressure Type: Vented Gauge
• Operating Pressure: 14.5 PSI (100 kPa)
• Output Type: Wheatstone Bridge
• Output: 0 mV ~ 40 mV (10V)
• Accuracy: -
• Voltage - Supply: 10 V ~ 16 V
• Port Size: Male - 0.12" (2.97mm) Tube
• Port Style: Barbless
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 58.02 PSI (400 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 5-SMD Module
• Supplier Device Package: 5-MPAK

package: 5-SMD Module

SL3S1213FUD/BG,003

NXP

IC U-CODE G2IL+ DIE WAFER

• Type: RFID Transponder
• Frequency: 840MHz ~ 960MHz
• Standards: EPC
• Interface: -
• Voltage - Supply: 1.8V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: Die
• Supplier Device Package: Wafer

package: Die

SPC565MZP56DR2

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 56MHz
• Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 56
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 36K x 8
• Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 40x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 388-BBGA
• Supplier Device Package: 388-PBGA (27x27)

package: 388-BBGA

SPC5643LK0MLQ1R

NXP

NXP 32-BIT MCU DUAL POWER ARCH

• Core Processor: e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 120MHz
• Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 32x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

S912ZVM16F1WKF

NXP

S12Z CORE,16K FLASH

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: SCI
• Peripherals: DMA, POR, WDT
• Number of I/O: 31
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
• Data Converters: A/D 4x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP-EP (7x7)

package: 48-LQFP Exposed Pad

S9S12GA128J0VLF

NXP

12-BIT ADC SPE TST SCREE

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

S9S08RNA8W2VTGR

NXP

8-BIT MCU S08 CORE 8KB FLASH

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, LINbus, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 12
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: 16-TSSOP (0.173", 4.40mm Width)

MC33FS8410G3ESR2

NXP

SYSTEM BASIS CHIP FS8410

• Applications: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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TJA1128BTK-1Z

NXP

LIN MINI SYSTEM BASIS CHIP WITH

• Applications: System Basis Chip
• Interface: SPI
• Voltage - Supply: 3V ~ 28V
• Package / Case: 14-VDFN Exposed Pad
• Supplier Device Package: 14-HVSON (3x4.5)
• Mounting Type: Surface Mount

package: -

MPF5200AMBA0ESR2

NXP

POWER MANAGEMENT IC, PRE-PROG, 2

• Applications: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 32-PowerWFQFN
• Supplier Device Package: 32-HWQFN (5x5)

package: -

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MIMX8ML8CVNKZAB

NXP

IC MPU I.MX8ML 1.6GHZ 548LFBGA

• Core Processor: ARM® Cortex®-A53
• Number of Cores/Bus Width: 4 Core, 64-Bit
• Speed: 1.6GHz
• Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
• RAM Controllers: DDR4, LPDDR4
• Graphics Acceleration: Yes
• Display & Interface Controllers: MIPI-CSI, MIPI-DSI
• Ethernet: GbE (2)
• SATA: -
• USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TJ)
• Security Features: ARM TZ, CAAM, RDC
• Package / Case: 548-LFBGA
• Supplier Device Package: 548-LFBGA (15x15)

package: -

MIMXRT106SDVL6B

NXP

IC MCU 32BIT EXT MEM 196MAPBGA

• Core Processor: ARM® Cortex®-M7
• Core Size: 32-Bit Single-Core
• Speed: 600MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
• Number of I/O: 127
• Program Memory Size: -
• Program Memory Type: External Program Memory
• EEPROM Size: -
• RAM Size: 1M x 8
• Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
• Data Converters: A/D 20x12b
• Oscillator Type: External, Internal
• Operating Temperature: 0°C ~ 95°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 196-LFBGA
• Supplier Device Package: 196-MAPBGA (10x10)

package: -