NXP Producten

PBSS3540E,115

NXP

TRANS PNP 40V 0.5A SC75

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 500mA
• Voltage - Collector Emitter Breakdown (Max): 40V
• Vce Saturation (Max) @ Ib, Ic: 350mV @ 50mA, 500mA
• Current - Collector Cutoff (Max): 100nA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V
• Power - Max: 250mW
• Frequency - Transition: 300MHz
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SC-75, SOT-416
• Supplier Device Package: SC-75

package: SC-75, SOT-416

BFU530R

NXP

TRANS RF NPN 12V 40MA SOT-143B

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 12V
• Frequency - Transition: 11GHz
• Noise Figure (dB Typ @ f): 0.6dB @ 900MHz
• Gain: 21.5dB
• Power - Max: 450mW
• DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
• Current - Collector (Ic) (Max): 40mA
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: TO-253-4, TO-253AA
• Supplier Device Package: SOT-143B

package: TO-253-4, TO-253AA

BZX284-C15,135

NXP

DIODE ZENER 15V 400MW SOD2

• Voltage - Zener (Nom) (Vz): 15V
• Tolerance: ±5%
• Power - Max: 400mW
• Impedance (Max) (Zzt): 15 Ohms
• Current - Reverse Leakage @ Vr: 50nA @ 10.5V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: SOD-110
• Supplier Device Package: SOD110

package: SOD-110

PCA9306DP1,125

NXP

IC LEVEL TRANSLATOR 8-TSSOP

• Translator Type: Voltage Level
• Channel Type: Bidirectional
• Number of Circuits: 1
• Channels per Circuit: 2
• Voltage - VCCA: 1V ~ 3.6V
• Voltage - VCCB: 1.8V ~ 5.5V
• Input Signal: -
• Output Signal: -
• Output Type: Open Drain
• Data Rate: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Features: Auto-Direction Sensing
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-TSSOP

package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

74LVC841APW,118

NXP

IC 10BIT TRANSP LATCH 24TSSOP

• Logic Type: D-Type Transparent Latch
• Circuit: 10:10
• Output Type: Tri-State
• Voltage - Supply: 2.7 V ~ 3.6 V
• Independent Circuits: 1
• Delay Time - Propagation: 1.5ns
• Current - Output High, Low: 24mA, 24mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 24-TSSOP

package: 24-TSSOP (0.173", 4.40mm Width)

74HC75N,652

NXP

IC LATCH QUAD BISTABLE 16DIP

• Logic Type: D-Type Transparent Latch
• Circuit: 2:2
• Output Type: Differential
• Voltage - Supply: 2 V ~ 6 V
• Independent Circuits: 2
• Delay Time - Propagation: 11ns
• Current - Output High, Low: 5.2mA, 5.2mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

package: 16-DIP (0.300", 7.62mm)

74ABT543APW,118

NXP

IC TRANSCVR 3ST 8BIT 24TSSOP

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 24-TSSOP

package: 24-TSSOP (0.173", 4.40mm Width)

M83241G13

NXP

IC C1K 450MHZ VOIP 448BGA

• Function: -
• Interface: -
• Number of Circuits: -
• Voltage - Supply: -
• Current - Supply: -
• Power (Watts): -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

KMPC8343CVRAGDB

NXP

IC MPU MPC83XX 400MHZ 620BGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 620-BBGA Exposed Pad
• Supplier Device Package: 620-PBGA (29x29)

package: 620-BBGA Exposed Pad

MPC8360VVAGDG

NXP

IC MPU MPC83XX 400MHZ 740TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 740-LBGA
• Supplier Device Package: 740-TBGA (37.5x37.5)

package: 740-LBGA

MC68MH360ZP33LR2

NXP

IC MPU M683XX 33MHZ 357BGA

• Core Processor: CPU32+
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 33MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 357-BGA
• Supplier Device Package: 357-PBGA (25x25)

package: 357-BGA

KMPC8248VRTMFA

NXP

IC MPU MPC82XX 400MHZ 516BGA

• Core Processor: PowerPC G2_LE
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Communications; RISC CPM, Security; SEC
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

package: 516-BBGA

P5021NSE7VNC

NXP

IC SOC 64BIT 2X2.0GHZ 1295FCBGA

• Core Processor: PowerPC e5500
• Number of Cores/Bus Width: 2 Core, 64-Bit
• Speed: 2.0GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1 Gbps (10), 10 Gbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.0V, 1.1V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
• Package / Case: 1295-BBGA, FCBGA
• Supplier Device Package: 1295-FCPBGA (37.5x37.5)

package: 1295-BBGA, FCBGA

P2010NSE2HHC

NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: Security; SEC 3.3
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 125°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

package: 689-BBGA Exposed Pad

P1010NXN5DFB

NXP

IC MPU Q OR IQ 1.0GHZ 425TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 425-FBGA
• Supplier Device Package: 425-TEPBGA I (19x19)

package: 425-FBGA

P2010NXN2HFC

NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Security Features: -
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

package: 689-BBGA Exposed Pad

MCHLC705KJ1CDWE

NXP

IC MCU 8BIT 1.2KB OTP 16SOIC

• Core Processor: HC05
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: -
• Peripherals: POR, WDT
• Number of I/O: 10
• Program Memory Size: 1.2KB (1.2K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 64 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

package: 16-SOIC (0.295", 7.50mm Width)

MC908KX2VDWE

NXP

IC MCU 8BIT 2KB FLASH 16SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI
• Peripherals: LVD, POR, PWM
• Number of I/O: 13
• Program Memory Size: 2KB (2K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 192 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

package: 16-SOIC (0.295", 7.50mm Width)

MC9S12DG128MPVR2

NXP

IC MCU 16BIT 128KB FLASH 112LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: PWM, WDT
• Number of I/O: 91
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

package: 112-LQFP

LPC1830FET180,551

NXP

IC MCU 32BIT ROMLESS 180TFBGA

• Core Processor: ARM? Cortex?-M3
• Core Size: 32-Bit
• Speed: 180MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 118
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 200K x 8
• Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 180-TFBGA
• Supplier Device Package: 180-TFBGA (12x12)

package: 180-TFBGA

LPC11U13FBD48/201,

NXP

IC MCU 32BIT 24KB FLASH 48LQFP

• Core Processor: ARM? Cortex?-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 40
• Program Memory Size: 24KB (24K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 6K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

MC68908GZ8CFAE

NXP

IC MCU 8BIT 8KB FLASH 48LQFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: CAN, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 37
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

MC32PF3000A3EP

NXP

POWER MANAGEMENT IC I.MX7 PRE-

• Applications: i.MX Processors
• Current - Supply: -
• Voltage - Supply: 2.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN (7x7)

package: 48-VFQFN Exposed Pad

S9S08SL16F1VTL

NXP

8-BIT MCU S08 CORE 16KB FLASH

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 22
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 28-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 28-TSSOP

package: 28-TSSOP (0.173", 4.40mm Width)

NX30P0121UKZ

NXP

NX30P0121, HIGH-VOLTAGE BACK-TO-

• Switch Type: General Purpose
• Number of Outputs: 1
• Ratio - Input:Output: 1:1
• Output Configuration: -
• Output Type: N-Channel
• Interface: -
• Voltage - Load: 2.5V ~ 20V
• Voltage - Supply (Vcc/Vdd): Not Required
• Current - Output (Max): 3A
• Rds On (Typ): 54mOhm
• Input Type: -
• Features: -
• Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, UVLO
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 12-UFBGA, WLCSP
• Supplier Device Package: 12-WLCSP (1.65x1.25)

package: 12-UFBGA, WLCSP

LPC4088FBD208K

NXP

IC MCU 32BIT 512KB FLASH 208LQFP

• Core Processor: ARM® Cortex®-M4
• Core Size: 32-Bit Single-Core
• Speed: 120MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
• Number of I/O: 165
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
• Data Converters: A/D 8x12b SAR; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 208-LQFP
• Supplier Device Package: 208-LQFP (28x28)

package: -

A5G26S004NT6

NXP

RF MOSFET DFN

• Transistor Type: -
• Frequency: -
• Gain: -
• Voltage - Test: -
• Current Rating: -
• Noise Figure: -
• Current - Test: -
• Power - Output: -
• Voltage - Rated: -
• Package / Case: -
• Supplier Device Package: -

package: -

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TEF5100EL-V1Y

NXP

IC

• Type: -
• Protocol: -
• Number of Drivers/Receivers: -
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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