NXP Producten

SE97TL,147

NXP

IC TEMP SENSOR DDR 3.3V 8-HXSON

• Function: Temp Monitoring System (Sensor), DIMM DDR Memory
• Sensor Type: Internal
• Sensing Temperature: -40°C ~ 125°C
• Accuracy: ±3°C(Max)
• Topology: ADC (Sigma Delta), Comparator, Register Bank
• Output Type: I2C/SMBus
• Output Alarm: Yes
• Output Fan: Yes
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-XFDFN Exposed Pad
• Supplier Device Package: 8-HXSON (2x3)

package: 8-XFDFN Exposed Pad

UBA20261T/1,518

NXP

IC CFL LAMP DVR HV 20-SOIC

• Type: CFL/TL Driver
• Frequency: 40kHz ~ 100kHz
• Voltage - Supply: 11.9 V ~ 13.8 V
• Current - Supply: 1.6mA
• Current - Output Source/Sink: 540mA
• Dimming: Yes
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SO

package: 20-SOIC (0.295", 7.50mm Width)

PCF8566P,112

NXP

IC LCD DVR UNVRSL LOW-MUX 40-DIP

• Display Type: LCD
• Configuration: 7 Segment + DP, 14 Segment (24 Segment)
• Interface: I2C
• Digits or Characters: 6 Characters, 12 Digits, 96 Elements
• Current - Supply: 30µA
• Voltage - Supply: 2.5 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 40-DIP (0.600", 15.24mm)
• Supplier Device Package: 40-DIP

package: 40-DIP (0.600", 15.24mm)

PCA8553DTT/AJ

NXP

IC LCD DRIVER 40X4 56TSSOP

• Display Type: LCD
• Configuration: 160 Segment
• Interface: I2C, SPI
• Digits or Characters: 10 Characters, 20 Characters, 160 Elements
• Current - Supply: 1.8µA
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 56-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 56-TSSOP

package: 56-TFSOP (0.240", 6.10mm Width)

74HC251N,652

NXP

IC 8-INPUT MUX 3-ST 16DIP

• Type: Multiplexer
• Circuit: 1 x 8:1
• Independent Circuits: 1
• Current - Output High, Low: 5.2mA, 5.2mA
• Voltage Supply Source: Single Supply
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

package: 16-DIP (0.300", 7.62mm)

P82B96TD/S911,118

NXP

IC REDRIVER I2C 2CH 400KHZ 8SO

• Type: Buffer, ReDriver
• Applications: I2C
• Input: 2-Wire Bus
• Output: 2-Wire Bus
• Data Rate (Max): 400kHz
• Number of Channels: 2
• Delay Time: -
• Signal Conditioning: -
• Capacitance - Input: 7pF
• Voltage - Supply: 2 V ~ 15 V
• Current - Supply: 900µA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: -
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

package: 8-SOIC (0.154", 3.90mm Width)

SC18IS603IPW,128

NXP

IC BRIDGE I2C/SPI 16-TSSOP

• Protocol: I2C
• Function: Controller
• Interface: SPI
• Standards: -
• Voltage - Supply: 2.4 V ~ 3.6 V
• Current - Supply: 11mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: 16-TSSOP (0.173", 4.40mm Width)

MCIMX6G3CVK05AA

NXP

IC MPU I.MC6UL 528MHZ 272BGA

• Core Processor: ARM? Cortex?-A7
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 528MHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: LCD, LVDS
• Ethernet: 10/100 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
• Package / Case: 272-LFBGA
• Supplier Device Package: 272-MAPBGA (9x9)

package: 272-LFBGA

MPC8555PXAJD

NXP

IC MPU MPC85XX 533MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 533MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DDR, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

MPC850DEZQ66BUR2

NXP

IC MPU MPC8XX 66MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

package: 256-BBGA

MPC8347ZUAJD

NXP

IC MPU MPC83XX 533MHZ 672TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 533MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 672-LBGA
• Supplier Device Package: 672-TBGA (35x35)

package: 672-LBGA

MC68040RC25V

NXP

IC MPU M680X0 25MHZ 182PGA

• Core Processor: 68040
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 25MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 182-BEPGA
• Supplier Device Package: 182-PGA (47.24x47.24)

package: 182-BEPGA

MPC860DPVR50D4

NXP

IC MPU MPC8XX 50MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 50MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (2), 10/100 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

package: 357-BBGA

MPC8377ECVRANGA

NXP

IC MPU MPC83XX 800MHZ 689TEBGA

• Core Processor: PowerPC e300c4s
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Security; SEC 3.0
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

package: 689-BBGA Exposed Pad

P89LPC985FDH,529

NXP

IC MCU 8BIT 8KB FLASH 28TSSOP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 18MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 26
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 28-TSSOP

package: 28-TSSOP (0.173", 4.40mm Width)

MC908GR32ACFUER

NXP

IC MCU 8BIT 32KB FLASH 64QFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 53
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1.5K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

package: 64-QFP

DSP56853FGE

NXP

IC MCU 16BIT 24KB SRAM 128LQFP

• Core Processor: 56800E
• Core Size: 16-Bit
• Speed: 120MHz
• Connectivity: EBI/EMI, SCI, SPI, SSI
• Peripherals: DMA, POR, WDT
• Number of I/O: 41
• Program Memory Size: 24KB (12K x 16)
• Program Memory Type: SRAM
• EEPROM Size: -
• RAM Size: 4K x 16
• Voltage - Supply (Vcc/Vdd): 1.62 V ~ 1.98 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 128-LQFP
• Supplier Device Package: 128-LQFP (14x20)

package: 128-LQFP

MC68HC908QT1MPE

NXP

IC MCU 8BIT 1.5KB FLASH 8DIP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM
• Number of I/O: 5
• Program Memory Size: 1.5KB (1.5K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

package: 8-DIP (0.300", 7.62mm)

S9S12G48F1VLC

NXP

IC MCU 16BIT 48KB FLASH 32LQFP

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 26
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1.5K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

package: 32-LQFP

MC9S08JM16CLC

NXP

IC MCU 8BIT 16KB FLASH 32LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I2C, LIN, SCI, SPI, USB
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 21
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

package: 32-LQFP

MPC555LFCVR40

NXP

IC MCU 32BIT 448KB FLASH 272BGA

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 101
• Program Memory Size: 448KB (448K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 26K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 272-BBGA
• Supplier Device Package: 272-PBGA (27x27)

package: 272-BBGA

MM912J637AM2EPR2

NXP

IC MCU LIN BATT MONITOR 48QFN

• Applications: Battery Monitor
• Core Processor: S12
• Program Memory Type: FLASH (128 kB)
• Controller Series: HCS12
• RAM Size: 6K x 8
• Interface: LIN, SCI, SPI
• Number of I/O: 8
• Voltage - Supply: 2.25 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN-EP (7x7)

package: 48-VFQFN Exposed Pad

MC13917-900EVK

NXP

IC MC13917_900_EVK

• Type: Amplifier
• Frequency: 900MHz
• For Use With/Related Products: MC13917
• Supplied Contents: Board

package: -

A7005CGHN1/T1AGBFJ

NXP

SECURE AUTHENTICATION MICROCONTR

• Applications: -
• Core Processor: -
• Program Memory Type: -
• Controller Series: -
• RAM Size: -
• Interface: -
• Number of I/O: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

FS32K142URT0VLHR

NXP

S32K142 32-BIT MCU ARM

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 112MHz
• Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

MFS8633BMDA0ESR2

NXP

SAFETY SYSTEM BASIS CHIP FOR DOM

• Applications: Camera
• Current - Supply: -
• Voltage - Supply: 36V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-HVQFN (7x7)

package: -

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PCA85262ATT-AY

NXP

AUTOMOTIVE 32 X 4 LCD DRIVER FOR

• Display Type: LCD
• Configuration: 32 Segment
• Interface: I2C
• Digits or Characters: 8 Characters, 16 Characters, 128 Elements
• Current - Supply: 3.5 µA
• Voltage - Supply: 1.8V ~ 5.5V
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 48-TSSOP

package: -

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MFS2620AMDA0ADR2

NXP

AUTO SBC

• Applications: -
• Current - Supply: 30µA
• Voltage - Supply: 3.2V ~ 40V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP-EP (7x7)

package: -

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