NXP Producten

MRFE6VP5600HR5

NXP

FET RF 2CH 130V 230MHZ NI1230

• Transistor Type: LDMOS (Dual)
• Frequency: 230MHz
• Gain: 25dB
• Voltage - Test: 50V
• Current Rating: -
• Noise Figure: -
• Current - Test: 100mA
• Power - Output: 600W
• Voltage - Rated: 130V
• Package / Case: NI-1230
• Supplier Device Package: NI-1230

package: NI-1230

BF862,215

NXP

JFET N-CH 20V 25MA SOT23

• Transistor Type: N-Channel JFET
• Frequency: -
• Gain: -
• Voltage - Test: -
• Current Rating: 25mA
• Noise Figure: -
• Current - Test: -
• Power - Output: -
• Voltage - Rated: 20V
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

package: TO-236-3, SC-59, SOT-23-3

BZX284-C11,115

NXP

DIODE ZENER 11V 400MW SOD2

• Voltage - Zener (Nom) (Vz): 11V
• Tolerance: ±5%
• Power - Max: 400mW
• Impedance (Max) (Zzt): 10 Ohms
• Current - Reverse Leakage @ Vr: 100nA @ 8V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: SOD-110
• Supplier Device Package: SOD110

package: SOD-110

BAP64-02,115

NXP

DIODE PIN 175V 100MA SOD-523

• Diode Type: PIN - Single
• Voltage - Peak Reverse (Max): 175V
• Current - Max: 100mA
• Capacitance @ Vr, F: 0.35pF @ 20V, 1MHz
• Resistance @ If, F: 1.35 Ohm @ 100mA, 100MHz
• Power Dissipation (Max): 715mW
• Operating Temperature: -65°C ~ 150°C (TJ)
• Package / Case: SC-79, SOD-523
• Supplier Device Package: SOD-523

package: SC-79, SOD-523

TDA3617J/N1,112

NXP

IC REG LINEAR 9V/5V/3.3V 9PDBS

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 3
• Voltage - Input (Max): 17.5V
• Voltage - Output (Min/Fixed): 9V, 5V, 3.3V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 1V @ 1.3A, 1.5V @ 600mA, -
• Current - Output: 1.3A, 600mA, 300mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 40µA
• PSRR: 70dB (3kHz)
• Control Features: Enable, Hold
• Protection Features: Load Dump, Over Current, Over Temperature, Short Circuit, Transient Voltage
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 9-SIP Formed Leads
• Supplier Device Package: 9-PDBS

package: 9-SIP Formed Leads

MC08XS6421EKR2

NXP

IC SWITCH HIGH SIDE 32SOIC

• Switch Type: General Purpose
• Number of Outputs: 4
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 7 V ~ 18 V
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Current - Output (Max): 5.5A, 11A
• Rds On (Typ): 8 mOhm, 21 mOhm
• Input Type: -
• Features: Slew Rate Controlled
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP

package: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

SSTV16859EC,551

NXP

IC BUFFER DDR 13BIT 96-LFBGA

• Logic Type: Registered Buffer with SSTL_2 Compatible I/O for DDR
• Supply Voltage: 2.3 V ~ 2.7 V
• Number of Bits: 13, 26
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 96-LFBGA
• Supplier Device Package: 96-LFBGA (13.5x5.5)

package: 96-LFBGA

74LVU04D,112

NXP

IC HEX INVERTER 14SOIC

• Logic Type: Inverter
• Number of Circuits: 6
• Number of Inputs: 6
• Features: -
• Voltage - Supply: 1 V ~ 5.5 V
• Current - Quiescent (Max): 40µA
• Current - Output High, Low: 12mA, 12mA
• Logic Level - Low: 0.2 V ~ 0.5 V
• Logic Level - High: 1 V ~ 2.4 V
• Max Propagation Delay @ V, Max CL: 7ns @ 3.3V, 50pF
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-SO
• Package / Case: 14-SOIC (0.154", 3.90mm Width)

package: 14-SOIC (0.154", 3.90mm Width)

74LVT74DB,118

NXP

IC D-TYPE POS TRG DUAL 14SSOP

• Function: Set(Preset) and Reset
• Type: D-Type
• Output Type: Differential
• Number of Elements: 2
• Number of Bits per Element: 1
• Clock Frequency: 345MHz
• Max Propagation Delay @ V, Max CL: 5ns @ 3.3V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 20mA, 32mA
• Voltage - Supply: 2.7 V ~ 3.6 V
• Current - Quiescent (Iq): 1mA
• Input Capacitance: 3pF
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 14-SSOP (0.209", 5.30mm Width)

package: 14-SSOP (0.209", 5.30mm Width)

HEF4059BP,652

NXP

IC PROG DIV-BY-COUNTER 24DIP

• Logic Type: Divide-by-N
• Direction: Down
• Number of Elements: 1
• Number of Bits per Element: 16
• Reset: Asynchronous
• Timing: -
• Count Rate: 20MHz
• Trigger Type: Positive Edge
• Voltage - Supply: 4.5 V ~ 15.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 24-DIP (0.600", 15.24mm)
• Supplier Device Package: 24-DIP

package: 24-DIP (0.600", 15.24mm)

74ALVT162241DL,112

NXP

IC BUFF DVR TRI-ST 16BIT 48SSOP

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 4
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 12mA, 12mA
• Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-BSSOP (0.295", 7.50mm Width)
• Supplier Device Package: 48-SSOP

package: 48-BSSOP (0.295", 7.50mm Width)

74LV125D,118

NXP

IC BUFF DVR TRI-ST QUAD 14SOIC

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 4
• Number of Bits per Element: 1
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 16mA, 16mA
• Voltage - Supply: 1 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

package: 14-SOIC (0.154", 3.90mm Width)

TDA19988BET/C1,151

NXP

IC HDMI TRANSMITTER 64-TFBGA

• Type: HDMI Transmitter
• Applications: Mobile Phones, Cellular, Video Displays
• Mounting Type: Surface Mount
• Package / Case: 64-TFBGA
• Supplier Device Package: 64-TFBGA (4.5x4.5)

package: 64-TFBGA

MCZ33975EK

NXP

IC DETECTOR MULT SWITCH 32-SOIC

• Applications: Automotive
• Interface: SPI Serial
• Voltage - Supply: 5.5 V ~ 28 V
• Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP
• Mounting Type: Surface Mount

package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

TJA1054AT/S900,518

NXP

IC CAN TXRX FAULT-TOL 14-SOIC

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

package: 14-SOIC (0.154", 3.90mm Width)

MC92604ZT

NXP

IC TXRX ETH DUAL GIG 196-MAPBGA

• Type: Transceiver
• Protocol: Gigabit Ethernet
• Number of Drivers/Receivers: 2/2
• Duplex: Full
• Receiver Hysteresis: -
• Data Rate: 1Gbps
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 196-LBGA
• Supplier Device Package: 196-MAPBGA (15x15)

package: 196-LBGA

MC68HC000CRC8

NXP

IC MPU M680X0 8MHZ 68PGA

• Core Processor: EC000
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 8MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: -
• Package / Case: 68-BCPGA
• Supplier Device Package: 68-PGA (27x27)

package: 68-BCPGA

MCIMX280CVM4B

NXP

IC MPU I.MX28 454MHZ 289MAPBGA

• Core Processor: ARM926EJ-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 454MHz
• Co-Processors/DSP: Data; DCP
• RAM Controllers: LVDDR, LVDDR2, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: Keypad
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.8V, 3.3V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: Boot Security, Cryptography, Hardware ID
• Package / Case: 289-LFBGA
• Supplier Device Package: 289-MAPBGA (14x14)

package: 289-LFBGA

MC9S08RG60FJE

NXP

IC MCU 8BIT 60KB FLASH 32LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 27
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

package: 32-LQFP

MC68HRC98JL3ECDW

NXP

IC MCU 8BIT 4KB FLASH 28SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LED, LVD, POR, PWM
• Number of I/O: 15
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V
• Data Converters: A/D 12x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

package: 28-SOIC (0.295", 7.50mm Width)

MKV46F256VLL15

NXP

IC MCU 32BIT 256KB FLASH 100LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 150MHz
• Connectivity: CAN, I2C, SPI, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 74
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 16x12b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: 100-LQFP

MMA3221KEG

NXP

ACCEL 50G/20G ANALOG 20SOIC

• Type: Analog
• Axis: X, Y
• Acceleration Range: ±50g (X), ±20g (Y)
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 40 (X), 100 (Y)
• Bandwidth: 400Hz
• Output Type: Analog Voltage
• Voltage - Supply: 4.75 V ~ 5.25 V
• Features: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

package: 20-SOIC (0.295", 7.50mm Width)

P5DF072EHN/T0PD409

NXP

IC SAM MIFARE SAM AV1 32HVQFN

• Type: RFID Transponder
• Frequency: 13.56MHz
• Standards: ISO 14443, MIFARE
• Interface: UART
• Voltage - Supply: 2.7 V ~ 3.3 V
• Operating Temperature: -
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

package: 32-VFQFN Exposed Pad

NCF2972MTT/T0E080J

NXP

IC REMOTE KEYLESS ENTRY 38TSSOP

• Type: -
• Frequency: -
• Standards: -
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

package: -

MC32PF1510A3EPR2

NXP

PF1510

• Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
• Current - Supply: -
• Voltage - Supply: 3.8 V ~ 7 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-QFN (5x5)

package: 40-VFQFN Exposed Pad

NX30P6093UKZ

NXP

I2C CONTROLLED OVP LOAD SWITCH

• Switch Type: -
• Number of Outputs: -
• Ratio - Input:Output: -
• Output Configuration: -
• Output Type: -
• Interface: -
• Voltage - Load: -
• Voltage - Supply (Vcc/Vdd): -
• Current - Output (Max): -
• Rds On (Typ): -
• Input Type: -
• Features: -
• Fault Protection: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

package: -

MC9S08QD4MSCR

NXP

S08QD 8-BIT MCU S08 CORE 4KB F

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 4
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

package: 8-SOIC (0.154", 3.90mm Width)

TJA1044ATK-3-0Z

NXP

IC TRANSCEIVER HALF 1/1 8HVSON

• Type: Transceiver
• Protocol: CANbus
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 300 mV
• Data Rate: 5Mbps
• Voltage - Supply: 4.5V ~ 5.5V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 8-VDFN Exposed Pad
• Supplier Device Package: 8-HVSON (3x3)

package: -

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