NXP Producten

AFT21S232SR3

NXP

FET RF 65V 2.11GHZ NI780S-2

• Transistor Type: LDMOS
• Frequency: 2.11GHz
• Gain: 16.7dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.5A
• Power - Output: 50W
• Voltage - Rated: 65V
• Package / Case: NI-780S
• Supplier Device Package: NI-780S

package: NI-780S

AFT20S015GNR1

NXP

FET RF 65V 2.17GHZ TO270-2G

• Transistor Type: LDMOS
• Frequency: 2.17GHz
• Gain: 17.6dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 132mA
• Power - Output: 1.5W
• Voltage - Rated: 65V
• Package / Case: TO-270-2 Gull Wing
• Supplier Device Package: TO-270-2 GULL

package: TO-270-2 Gull Wing

BZX284-C68,115

NXP

DIODE ZENER 68V 400MW SOD2

• Voltage - Zener (Nom) (Vz): 68V
• Tolerance: ±5%
• Power - Max: 400mW
• Impedance (Max) (Zzt): 160 Ohms
• Current - Reverse Leakage @ Vr: 50nA @ 47.6V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: SOD-110
• Supplier Device Package: SOD110

package: SOD-110

MC33580BAPNA

NXP

IC SW QUAD HI SIDE 15MOHM 24PQFN

• Switch Type: General Purpose
• Number of Outputs: 4
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 6 V ~ 27 V
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Current - Output (Max): -
• Rds On (Typ): 15 mOhm
• Input Type: -
• Features: Slew Rate Controlled, Watchdog Timer
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 24-PowerQFN
• Supplier Device Package: 24-PQFN (12x12)

package: 24-PowerQFN

BUK129-50DL,118

NXP

MOSFET N-CH 50V 16A D2PAK

• Switch Type: General Purpose
• Number of Outputs: 1
• Ratio - Input:Output: 1:1
• Output Configuration: Low Side
• Output Type: N-Channel
• Interface: On/Off
• Voltage - Load: 50V (Max)
• Voltage - Supply (Vcc/Vdd): Not Required
• Current - Output (Max): 16A
• Rds On (Typ): 36 mOhm
• Input Type: Non-Inverting
• Features: -
• Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
• Operating Temperature: 150°C (TJ)
• Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
• Supplier Device Package: D2PAK

package: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

MC34932EKR2

NXP

IC BRIDGE DRIVER PAR 32SOIC

• Output Configuration: Half Bridge (4)
• Applications: DC Motors, General Purpose
• Interface: Logic
• Load Type: Inductive
• Technology: Power MOSFET
• Rds On (Typ): 120 mOhm
• Current - Output / Channel: 5A
• Current - Peak Output: -
• Voltage - Supply: 5 V ~ 36 V
• Voltage - Load: 5 V ~ 36 V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Features: Status Flag
• Fault Protection: Current Limiting, Over Temperature, Short Circuit, UVLO
• Mounting Type: Surface Mount
• Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP

package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

74LV174DB,112

NXP

IC D-TYPE POS TRG SNGL 16SSOP

• Function: Master Reset
• Type: D-Type
• Output Type: Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 6
• Clock Frequency: 100MHz
• Max Propagation Delay @ V, Max CL: 21ns @ 5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 12mA, 12mA
• Voltage - Supply: 1 V ~ 5.5 V
• Current - Quiescent (Iq): 160µA
• Input Capacitance: 3.5pF
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-SSOP (0.209", 5.30mm Width)

package: 16-SSOP (0.209", 5.30mm Width)

MC33689DDWBR2

NXP

IC SYSTEM BASE W/LIN 32-SOIC

• Applications: Automotive Mirror Control
• Interface: SPI Serial
• Voltage - Supply: 5.5 V ~ 18 V
• Package / Case: 32-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 32-SOIC
• Mounting Type: Surface Mount

package: 32-SOIC (0.295", 7.50mm Width)

UJA1065TW/5V0,518

NXP

IC CAN/LIN FAIL-SAFE 32HTSSOP

• Applications: Networking
• Interface: CAN, LIN
• Voltage - Supply: 5.5 V ~ 52 V
• Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
• Supplier Device Package: 32-HTSSOP
• Mounting Type: Surface Mount

package: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

MC33742SPEG

NXP

IC SYSTEM BASE W/CAN 28SOIC

• Applications: Automotive
• Interface: SPI Serial
• Voltage - Supply: 5.5 V ~ 18 V
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC
• Mounting Type: Surface Mount

package: 28-SOIC (0.295", 7.50mm Width)

PCA6408APW,118

NXP

IC I/O EXPANDER 8BIT GP 16TSSOP

• Number of I/O: 8
• Interface: I2C, SMBus
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 10mA, 25mA
• Clock Frequency: 400kHz
• Voltage - Supply: 1.65 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: 16-TSSOP (0.173", 4.40mm Width)

MC145027DWR2

NXP

IC DECODER 5 ADDR 4 DATA 16-SOIC

• Type: Encoder, Decoder
• Applications: Remote Control
• Voltage - Supply, Analog: 4.5 V ~ 18 V
• Voltage - Supply, Digital: 4.5 V ~ 18 V
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOG

package: 16-SOIC (0.295", 7.50mm Width)

MC9S12C128MFA

NXP

IC MCU 16BIT 128KB FLASH 48LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 31
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

MKL81Z128CBH7R

NXP

KINETIS L 32-BIT MCU ARM CORTEX-

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

MKL16Z256VMP4

NXP

IC MCU 32BIT 256KB FLASH 64BGA

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D - 16bit, D/A - 12bit
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LFBGA
• Supplier Device Package: 64-MAPBGA (5x5)

package: 64-LFBGA

MSC8103M1200F

NXP

DSP 16BIT 300MHZ CPM 332FCBGA

• Type: SC140 Core
• Interface: Communications Processor Module (CPM)
• Clock Rate: 300MHz
• Non-Volatile Memory: External
• On-Chip RAM: 512kB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.60V
• Operating Temperature: -40°C ~ 75°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 332-BFBGA, FCPBGA
• Supplier Device Package: 332-FCBGA (17x17)

package: 332-BFBGA, FCPBGA

PESD5V0U1UCLD,315

NXP

TVS DIODE SOD882

• Type: -
• Unidirectional Channels: -
• Bidirectional Channels: -
• Voltage - Reverse Standoff (Typ): -
• Voltage - Breakdown (Min): -
• Voltage - Clamping (Max) @ Ipp: -
• Current - Peak Pulse (10/1000µs): -
• Power - Peak Pulse: -
• Power Line Protection: -
• Applications: -
• Capacitance @ Frequency: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

PCF7941ATJ/CA1B00E

NXP

IC MCU RISC 36SOJ

• Frequency: 125kHz
• Applications: -
• Modulation or Protocol: -
• Data Rate (Max): 5.2kbps
• Power - Output: -
• Current - Transmitting: -
• Data Interface: -
• Antenna Connector: -
• Memory Size: 4kB EEPROM, 4kB ROM, 128B RAM
• Features: -
• Voltage - Supply: 2.1 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 36-BSSOJ (0.193", 4.90mm Width)

package: 36-BSSOJ (0.193", 4.90mm Width)

BF1118,215

NXP

IC RF SWITCH SOT143B

• Frequency - Lower: DC
• Frequency - Upper: 1GHz
• Isolation @ Frequency: 30dB @ 1GHz (min)
• Insertion Loss @ Frequency: 2.5dB (max) @ 1GHz
• IIP3: -
• Topology: -
• Circuit: -
• P1dB: -
• Features: -
• Impedance: 50 Ohm
• Operating Temperature: -
• Voltage - Supply: -
• RF Type: General Purpose
• Package / Case: TO-253-4, TO-253AA
• Supplier Device Package: SOT-143B

package: TO-253-4, TO-253AA

BGM1013,115

NXP

MMIC AMPLIFIER 6TSSOP

• Frequency: 0Hz ~ 2.2GHz
• P1dB: 13dBm
• Gain: 35.5dB
• Noise Figure: 4.6dB ~ 4.7dB
• RF Type: ISM
• Voltage - Supply: 5 V ~ 6 V
• Current - Supply: 27.5mA
• Test Frequency: 1GHz
• Package / Case: 6-TSSOP, SC-88, SOT-363
• Supplier Device Package: 6-TSSOP

package: 6-TSSOP, SC-88, SOT-363

SPC5642AF2MVZ2

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 151
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.25 V
• Data Converters: A/D 40x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 324-BBGA
• Supplier Device Package: 324-TEPBGA (23x23)

package: 324-BBGA

S9S12G240F0VLL

NXP

16-BIT MCU S12 CORE 240KB FLAS

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 86
• Program Memory Size: 240KB (240K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 11K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: 100-LQFP

MKE15Z64VLD4

NXP

IC MCU 5V CM0+ TOUCH 44LQFP

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 38
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 12x12b; D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

package: 44-LQFP

FS32V234BJN2VUB

NXP

IC MPU FS32V23 800MHZ 621FCPBGA

• Core Processor: ARM® Cortex®-A53
• Number of Cores/Bus Width: 4 Core, 32/64-Bit
• Speed: 800MHz
• Co-Processors/DSP: ARM® Cortex®-M4
• RAM Controllers: DDR3, DDR3L, LPDDR2
• Graphics Acceleration: No
• Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
• Ethernet: GbE
• SATA: -
• USB: -
• Voltage - I/O: 1V, 1.8V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
• Package / Case: 621-FBGA, FCBGA
• Supplier Device Package: 621-FCPBGA (17x17)

package: -

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TDA8024AT-C1-112

NXP

IC SMART CARD INTERFACE 28SOIC

• Applications: -
• Interface: -
• Voltage - Supply: -
• Package / Case: -
• Supplier Device Package: -
• Mounting Type: -

package: -

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FS32V232CKN2VUBR

NXP

IC MPU FS32V23 1GHZ 621FCPBGA

• Core Processor: ARM® Cortex®-A53
• Number of Cores/Bus Width: 2 Core, 32/64-Bit
• Speed: 1GHz
• Co-Processors/DSP: ARM® Cortex®-M4
• RAM Controllers: DDR3, DDR3L, LPDDR2
• Graphics Acceleration: No
• Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
• Ethernet: GbE
• SATA: -
• USB: -
• Voltage - I/O: 1V, 1.8V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
• Package / Case: 621-FBGA, FCBGA
• Supplier Device Package: 621-FCPBGA (17x17)

package: -

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LX2080SC72029B

NXP

IC MPU QORLQ LX2 2GHZ 1517FCPBGA

• Core Processor: ARM® Cortex®-A72
• Number of Cores/Bus Width: 8 Core, 64-Bit
• Speed: 2GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR4
• Graphics Acceleration: Yes
• Display & Interface Controllers: -
• Ethernet: 100Gbps (2)
• SATA: SATA 3.0 (4)
• USB: USB 3.0 (2) + PHY (2)
• Voltage - I/O: 1.2V, 1.8V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TJ)
• Security Features: Secure Boot, TrustZone®
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCPBGA (40x40)

package: -

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MPF5024CMMA0ES

NXP

POWER MANAGEMENT IC, PRE-PROG, 4

• Applications: High Performance i.MX 8 Processor Based
• Current - Supply: -
• Voltage - Supply: 2.5V ~ 5.5V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-HVQFN (6x6)

package: -

Request a Quote