NXP Producten

MW6S010GNR1

NXP

FET RF 68V 960MHZ TO270-2GW

• Transistor Type: LDMOS
• Frequency: 960MHz
• Gain: 18dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 125mA
• Power - Output: 10W
• Voltage - Rated: 68V
• Package / Case: TO-270-2 Gull Wing
• Supplier Device Package: TO-270-2 GULL

package: TO-270-2 Gull Wing

MC10XS3535JHFKR2

NXP

IC SWITCH HIGH SIDE 24PQFN

• Switch Type: General Purpose
• Number of Outputs: 6
• Ratio - Input:Output: 1:6
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 7 V ~ 20 V
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Current - Output (Max): -
• Rds On (Typ): 10 mOhm (Max), 35 mOhm (Max)
• Input Type: -
• Features: Watchdog Timer
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 24-PowerQFN
• Supplier Device Package: 24-PQFN (12x12)

package: 24-PowerQFN

MC33932EKR2

NXP

IC MOTOR DRIVER PAR 54SOIC

• Motor Type - Stepper: -
• Motor Type - AC, DC: Brushed DC
• Function: Driver - Fully Integrated, Control and Power Stage
• Output Configuration: Half Bridge (4)
• Interface: Parallel
• Technology: CMOS
• Step Resolution: -
• Applications: Automotive
• Current - Output: 5A
• Voltage - Supply: 5 V ~ 28 V
• Voltage - Load: 5 V ~ 28 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 54-SOICW-EP

package: 54-SSOP (0.295", 7.50mm Width) Exposed Pad

SSL2109AT/1,118

NXP

IC LED DRIVER OFFL SWITCHER 8SO

• Type: AC DC Offline Switcher
• Topology: Flyback, Step-Down (Buck), Step-Up (Boost)
• Internal Switch(s): No
• Number of Outputs: 1
• Voltage - Supply (Min): 8V
• Voltage - Supply (Max): 16V
• Voltage - Output: 600V
• Current - Output / Channel: -
• Frequency: -
• Dimming: -
• Applications: Lighting
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

package: 8-SOIC (0.154", 3.90mm Width)

TEA1738LT/N1,118

NXP

IC CTRLR SMPS GREEN OVP 8SO

• Output Isolation: Isolated
• Internal Switch(s): No
• Voltage - Breakdown: -
• Topology: Flyback
• Voltage - Start Up: 20.6V
• Voltage - Supply (Vcc/Vdd): 12 V ~ 30 V
• Duty Cycle: 80%
• Frequency - Switching: 26.5kHz ~ 78kHz
• Power (Watts): 75W
• Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
• Control Features: -
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO
• Mounting Type: Surface Mount

package: 8-SOIC (0.154", 3.90mm Width)

MHW9206N

NXP

IC CATV AMP MOD 870MHZ 7-CATV

• Applications: CATV
• Output Type: -
• Number of Circuits: 1
• -3db Bandwidth: -
• Slew Rate: -
• Current - Supply: 245mA
• Current - Output / Channel: -
• Voltage - Supply, Single/Dual (±): -
• Mounting Type: Surface Mount
• Package / Case: Module
• Supplier Device Package: 7-CATV Module

package: Module

PCAL9535APW,118

NXP

IC I/O PORT 16BIT 24TSSOP

• Number of I/O: 16
• Interface: I2C, SMBus
• Interrupt Output: Yes
• Features: POR
• Output Type: Open Drain, Push-Pull
• Current - Output Source/Sink: 10mA, 25mA
• Clock Frequency: 400kHz
• Voltage - Supply: 1.65 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 24-TSSOP

package: 24-TSSOP (0.173", 4.40mm Width)

MPC8572ELVTATLD

NXP

IC MPU MPC85XX 1.2GHZ 1023FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: Signal Processing; SPE, Security; SEC
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 1023-BFBGA, FCBGA
• Supplier Device Package: 1023-FCPBGA (33x33)

package: 1023-BFBGA, FCBGA

KMPC8347EZUALFB

NXP

IC MPU MPC83XX 667MHZ 672TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 672-LBGA
• Supplier Device Package: 672-TBGA (35x35)

package: 672-LBGA

SPC5643LF0MLQ8

NXP

IC MCU 32BIT 1MB FLASH 144LQFP

• Core Processor: e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 80MHz
• Connectivity: CAN, FlexRay, LIN, SPI, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 32x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

PK30X128VMD100

NXP

IC MCU 32BIT 128KB FLASH 144BGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
• Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
• Number of I/O: 102
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 31x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LBGA
• Supplier Device Package: 144-MAPBGA (13x13)

package: 144-LBGA

P89LPC921FN,112

NXP

IC MCU 8BIT 4KB FLASH 20DIP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 18MHz
• Connectivity: I2C, UART/USART
• Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
• Number of I/O: 18
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-DIP (0.300", 7.62mm)
• Supplier Device Package: 20-DIP

package: 20-DIP (0.300", 7.62mm)

XC68HC705B32CFN

NXP

IC MCU 8BIT 32KB OTP 52PLCC

• Core Processor: HC05
• Core Size: 8-Bit
• Speed: 2.1MHz
• Connectivity: SCI
• Peripherals: POR, WDT
• Number of I/O: 32
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: OTP
• EEPROM Size: 256 x 8
• RAM Size: 528 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 52-LCC (J-Lead)
• Supplier Device Package: 52-PLCC (19.1x19.1)

package: 52-LCC (J-Lead)

SPC5604BACLL6R

NXP

IC MCU 32BIT 512KB FLASH 100LQFP

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 79
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 16
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 28x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: 100-LQFP

MC9S08AW16CPUE

NXP

IC MCU 8BIT 16KB FLASH 64LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

MK20DX128VLH5

NXP

IC MCU 32BIT 128KB FLASH 64LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 13x16b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

MPX2301DT1

NXP

PRESSURE SENSE MED 4SIP CHIP PAK

• Pressure Type: Differential
• Operating Pressure: 5.8 PSI (40 kPa)
• Output Type: Wheatstone Bridge
• Output: 0 mV ~ 3.006 mV (6V)
• Accuracy: ±1.5%
• Voltage - Supply: 6 V ~ 10 V
• Port Size: -
• Port Style: No Port
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 125 PSI (861.84 kPa)
• Operating Temperature: 15°C ~ 40°C
• Package / Case: 4-SIP Module
• Supplier Device Package: -

package: 4-SIP Module

MPX2102DP

NXP

SENSOR DIFF PRESS 14.5PSI MAX

• Pressure Type: Differential
• Operating Pressure: 14.5 PSI (100 kPa)
• Output Type: Wheatstone Bridge
• Output: 0 mV ~ 40 mV (10V)
• Accuracy: -0.6% ~ 0.4%
• Voltage - Supply: 10 V ~ 16 V
• Port Size: Male - 0.19" (4.93mm) Tube, Dual
• Port Style: Barbed
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 58.02 PSI (400 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 4-SIP Module
• Supplier Device Package: -

package: 4-SIP Module

MPXV5010DP

NXP

SENSOR PRESSURE INTEGRATED SILIC

• Pressure Type: Differential
• Operating Pressure: 1.45 PSI (10 kPa)
• Output Type: Analog Voltage
• Output: 0.2 V ~ 4.7 V
• Accuracy: ±5%
• Voltage - Supply: 4.75 V ~ 5.25 V
• Port Size: Male - 0.13" (3.3mm) Tube, Dual
• Port Style: Barbed
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 5.8 PSI (40 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SMD Module
• Supplier Device Package: -

package: 8-SMD Module

KMI15/1,115

NXP

MAGNETIC SWITCH SPEC PURP 2SIP

• Function: Special Purpose
• Technology: Magnetoresistive
• Polarization: -
• Sensing Range: -
• Test Condition: -
• Voltage - Supply: 12V
• Current - Supply (Max): -
• Current - Output (Max): 14mA (Typ)
• Output Type: Current Source
• Features: Temperature Compensated
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: SOT-453A
• Supplier Device Package: 2-SIP

package: SOT-453A

MFRC52301HN1,151

NXP

IC MIFARE READER 32-HVQFN

• Type: RFID Reader
• Frequency: 13.56MHz
• Standards: ISO 14443, MIFARE
• Interface: I2C, SPI, UART
• Voltage - Supply: 2.5 V ~ 3.3 V
• Operating Temperature: -25°C ~ 85°C
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

package: 32-VFQFN Exposed Pad

MF3DH8201DUD/00V

NXP

MIFARE DESFIRE EV2

• Type: RFID Reader
• Frequency: 13.56MHz
• Standards: ISO 14443
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -25°C ~ 75°C
• Package / Case: Die
• Supplier Device Package: Die

package: Die

MC13193FCR2

NXP

IC RF TXRX 802.15.4/ISM 32-VFQFN

• Type: TxRx Only
• RF Family/Standard: 802.15.4, General ISM > 1GHz
• Protocol: Zigbee?
• Modulation: O-QPSK
• Frequency: 2.4GHz
• Data Rate (Max): 250kbps
• Power - Output: 4dBm
• Sensitivity: -92dBm
• Memory Size: -
• Serial Interfaces: SPI
• GPIO: 7
• Voltage - Supply: 2 V ~ 3.4 V
• Current - Receiving: 37mA
• Current - Transmitting: 30mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-VFQFN Exposed Pad

package: 32-VFQFN Exposed Pad

SVF532R2K2CMK4R

NXP

CORTEX- M4 PRIMARY CORE CORTEX

• Core Processor: ARM® Cortex®-A5 + Cortex®-M4
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 400MHz, 133MHz
• Co-Processors/DSP: Multimedia; NEON™ MPE
• RAM Controllers: LPDDR2, DDR3, DRAM
• Graphics Acceleration: Yes
• Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
• Ethernet: 10/100 Mbps (2)
• SATA: -
• USB: USB 2.0 OTG + PHY (1)
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
• Package / Case: 364-LFBGA
• Supplier Device Package: 364-LFBGA (17x17)

package: 364-LFBGA

MCIMX6X1EVO10AC

NXP

I.MX 6SX ROM PERF ENHAN

• Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 200MHz, 1GHz
• Co-Processors/DSP: Multimedia; NEON™ MPE
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
• Operating Temperature: -20°C ~ 105°C (TJ)
• Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
• Package / Case: 400-LFBGA
• Supplier Device Package: 400-MAPBGA (17x17)

package: 400-LFBGA

MC56F8246MLFR

NXP

16-BIT DSC 56800E CORE 48KB FL

• Core Processor: 56800E
• Core Size: 16-Bit
• Speed: 60MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 48KB (24K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 3K x 16
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x12b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

SAF1504ABS/V1S,118

NXP

IC MEDIA PROCESSOR

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

package: -

MC33VR5500V1KSR2

NXP

1 BUCK, QM, INFOTAINMENT

• Applications: SMPS Start-Up
• Current - Supply: 15mA
• Voltage - Supply: 60V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

package: -

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