NXP Producten

PMDPB65UP,115

NXP

MOSFET 2P-CH 20V 3.5A SOT1118

• FET Type: 2 P-Channel (Dual)
• FET Feature: Logic Level Gate
• Drain to Source Voltage (Vdss): 20V
• Current - Continuous Drain (Id) @ 25°C: 3.5A
• Rds On (Max) @ Id, Vgs: 70 mOhm @ 1A, 4.5V
• Vgs(th) (Max) @ Id: 1V @ 250µA
• Gate Charge (Qg) (Max) @ Vgs: 6nC @ 4.5V
• Input Capacitance (Ciss) (Max) @ Vds: 380pF @ 10V
• Power - Max: 520mW
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 6-UDFN Exposed Pad
• Supplier Device Package: DFN2020-6

package: 6-UDFN Exposed Pad

PBSS5140V,315

NXP

TRANS PNP 40V 1A SOT-666

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 1A
• Voltage - Collector Emitter Breakdown (Max): 40V
• Vce Saturation (Max) @ Ib, Ic: 310mV @ 100mA, 1A
• Current - Collector Cutoff (Max): 100nA
• DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 100mA, 5V
• Power - Max: 500mW
• Frequency - Transition: 150MHz
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SOT-563, SOT-666
• Supplier Device Package: SOT-666

package: SOT-563, SOT-666

MC33882EPR2

NXP

IC SWITCH LO SIDE 6OUT 32-QFN

• Switch Type: General Purpose
• Number of Outputs: 6
• Ratio - Input:Output: 1:1
• Output Configuration: Low Side
• Output Type: N-Channel
• Interface: SPI, Parallel
• Voltage - Load: 8 V ~ 25 V
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Current - Output (Max): -
• Rds On (Typ): 400 mOhm
• Input Type: -
• Features: -
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 32-VQFN Exposed Pad
• Supplier Device Package: 32-QFN-EP (7x7)

package: 32-VQFN Exposed Pad

SSTU32866EC,518

NXP

IC BUFFER 1.8V 25BIT SOT536-1

• Logic Type: 1:1, 1:2 Configurable Registered Buffer with Parity
• Supply Voltage: 1.7 V ~ 1.9 V
• Number of Bits: 25, 14
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 96-LFBGA
• Supplier Device Package: 96-LFBGA (13.5x5.5)

package: 96-LFBGA

74HC4015DB,112

NXP

IC DUAL 4BIT SHIFT REGIST 16SSOP

• Logic Type: Shift Register
• Output Type: Push-Pull
• Number of Elements: 2
• Number of Bits per Element: 4
• Function: Serial to Parallel
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 16-SSOP

package: 16-SSOP (0.209", 5.30mm Width)

N74F164D,623

NXP

IC SHIFT REGISTER 8BIT 14SOIC

• Logic Type: Shift Register
• Output Type: Push-Pull
• Number of Elements: 1
• Number of Bits per Element: 8
• Function: Serial to Parallel
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

package: 14-SOIC (0.154", 3.90mm Width)

74LVT543PW,112

NXP

IC TRANSCVR 8BIT N-INV 24TSSOP

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 24-TSSOP

package: 24-TSSOP (0.173", 4.40mm Width)

TDA1517P/N3,112

NXP

IC AMP AUDIO PWR 6W STER 18HDIP

• Type: Class B
• Output Type: 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 6W x 2 @ 4 Ohm
• Voltage - Supply: 6 V ~ 18 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Through Hole
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 18-HDIP
• Package / Case: 18-DIP (0.300", 7.62mm) Exposed Pad

package: 18-DIP (0.300", 7.62mm) Exposed Pad

PCA9538PW,112

NXP

IC I/O EXPANDER I2C 8B 16TSSOP

• Number of I/O: 8
• Interface: I2C, SMBus
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 10mA, 25mA
• Clock Frequency: 400kHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: 16-TSSOP (0.173", 4.40mm Width)

MPC8347ZQAGD

NXP

IC MPU MPC83XX 400MHZ 620BGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 620-BBGA Exposed Pad
• Supplier Device Package: 620-PBGA (29x29)

package: 620-BBGA Exposed Pad

KMPC860SRVR80D4

NXP

IC MPU MPC8XX 80MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 80MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

package: 357-BBGA

MPC8272CVRPIEA

NXP

IC MPU MPC82XX 300MHZ 516BGA

• Core Processor: PowerPC G2_LE
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 300MHz
• Co-Processors/DSP: Communications; RISC CPM, Security; SEC
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

package: 516-BBGA

MC8641DVJ1000NE

NXP

IC MPU E600 DUAL CORE 1023FCCBGA

• Core Processor: PowerPC e600
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1023-BCBGA, FCCBGA
• Supplier Device Package: 1023-FCCBGA (33x33)

package: 1023-BCBGA, FCCBGA

MCIMX6S6AVM08ABR

NXP

IC MPU I.MX6S 800MHZ 624MAPBGA

• Core Processor: ARM? Cortex?-A9
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (4)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 624-LFBGA
• Supplier Device Package: 624-MAPBGA (21x21)

package: 624-LFBGA

MCIMX6L2DVN10AB

NXP

IC MPU I.MX6SL 1.0GHZ 432MAPBGA

• Core Processor: ARM? Cortex?-A9
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (3)
• Voltage - I/O: 1.2V, 1.8V, 3.0V
• Operating Temperature: 0°C ~ 95°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 432-TFBGA
• Supplier Device Package: 432-MAPBGA (13x13)

package: 432-TFBGA

P87C51FA-5A,512

NXP

IC MCU 8BIT 8KB OTP 44PLCC

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: EBI/EMI, UART/USART
• Peripherals: POR, PWM
• Number of I/O: 32
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

package: 44-LCC (J-Lead)

MC9RS08KB8CWJ

NXP

IC MCU 8BIT 8KB FLASH 20SOIC

• Core Processor: RS08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 18
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 254 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

package: 20-SOIC (0.295", 7.50mm Width)

MC9S08SH8CTGR

NXP

IC MCU 8BIT 8KB FLASH 16TSSOP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 13
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: 16-TSSOP (0.173", 4.40mm Width)

MK53DN512CMD10

NXP

IC MCU 32BIT 512KB FLASH 144BGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
• Number of I/O: 94
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 41x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 144-LBGA
• Supplier Device Package: 144-MAPBGA (13x13)

package: 144-LBGA

PCK3807ADB,118

NXP

IC CLK BUFFER 1:10 400MHZ 20SSOP

• Type: Fanout Buffer (Distribution)
• Number of Circuits: 1
• Ratio - Input:Output: 1:10
• Differential - Input:Output: No/No
• Input: LVCMOS, LVTTL
• Output: LVTTL
• Frequency - Max: 400MHz
• Voltage - Supply: 2.3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

package: 20-SSOP (0.209", 5.30mm Width)

TEF6890H/V3,557

NXP

IC RADIO SIGNAL PROC 44-QFP

• Function: Audio Tone Processor
• Applications: Automotive Audio
• Number of Channels: 6
• Interface: I2C
• Voltage - Supply: 8 V ~ 9 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Specifications: AM, FM
• Package / Case: 44-QFP
• Supplier Device Package: 44-PQFP (10x10)

package: 44-QFP

MPVZ12GW6U

NXP

SENSOR PRESSURE AXIAL SO8 SMD

• Pressure Type: Vented Gauge
• Operating Pressure: 1.45 PSI (10 kPa)
• Output Type: Wheatstone Bridge
• Output: 0 mV ~ 55 mV (3V)
• Accuracy: -
• Voltage - Supply: 3 V ~ 6 V
• Port Size: Male - 0.22" (5.59mm) Tube
• Port Style: Barbless
• Features: -
• Termination Style: PCB
• Maximum Pressure: 10.88 PSI (75 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SMD Module
• Supplier Device Package: -

package: 8-SMD Module

KMA221J

NXP

MOD ANGLE SENSOR MAGN 2CH SIL4

• For Measuring: Angle
• Technology: Magnetoresistive
• Rotation Angle - Electrical, Mechanical: 0° ~ 180°
• Linear Range: -
• Output: Analog Voltage
• Output Signal: -
• Actuator Type: External Magnet Not Included
• Linearity: ±1.2°
• Resistance: -
• Resistance Tolerance: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Through Hole
• Termination Style: PC Pin
• Operating Temperature: -40°C ~ 160°C

package: -

MFRC52302HN1,157

NXP

IC READER 32-HVQFN

• Type: RFID Reader
• Frequency: 13.56MHz
• Standards: ISO 14443, MIFARE
• Interface: I2C, SPI, UART
• Voltage - Supply: 2.5 V ~ 3.3 V
• Operating Temperature: -25°C ~ 85°C
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

package: 32-VFQFN Exposed Pad

HTSICC5601EW/C7,00

NXP

TRANSPONDER RFIC HITAG S UNCASED

• Type: RFID Transponder
• Frequency: 100kHz ~ 150kHz
• Standards: -
• Interface: -
• Voltage - Supply: 3.5V
• Operating Temperature: -25°C ~ 85°C
• Package / Case: Die
• Supplier Device Package: Die

package: Die

TEA19031AGT/1J

NXP

SMART CHARGING PROTOCOL CONTR US

• Output Isolation: -
• Internal Switch(s): -
• Voltage - Breakdown: -
• Topology: -
• Voltage - Start Up: -
• Voltage - Supply (Vcc/Vdd): -
• Duty Cycle: -
• Frequency - Switching: -
• Power (Watts): -
• Fault Protection: -
• Control Features: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -
• Mounting Type: -

package: -

SPC5748GSK1MMJ6R

NXP

NXP 32-BIT MCU, TRIPLE CORE, 6MB

• Core Processor: e200z2, e200z4
• Core Size: 32-Bit Tri-Core
• Speed: 80MHz, 160MHz
• Connectivity: CANbus, Ethernet, I2C, MMC/SD/SDIO, SAI, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, LVD, I2S, POR, WDT
• Number of I/O: 246
• Program Memory Size: 6MB (6M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 768K x 8
• Voltage - Supply (Vcc/Vdd): 3.15V ~ 3.6V, 4.5V ~ 5.5V
• Data Converters: A/D 80x10b, 64x12b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 256-LBGA
• Supplier Device Package: 256-MAPPBGA (17x17)

package: -

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MC35FS4507NAE

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: 1V ~ 5V
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-HLQFP (7x7)

package: -

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