NXP Producten

PSMN009-100W,127

NXP

MOSFET N-CH 100V 100A SOT429

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 100V
• Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 10V
• Vgs(th) (Max) @ Id: 4V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 214nC @ 10V
• Input Capacitance (Ciss) (Max) @ Vds: 9000pF @ 25V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 300W (Tc)
• Rds On (Max) @ Id, Vgs: 9 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: TO-247-3
• Package / Case: TO-247-3

package: TO-247-3

BSN254,126

NXP

MOSFET N-CH 250V 310MA SOT54

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 250V
• Current - Continuous Drain (Id) @ 25°C: 310mA (Ta)
• Drive Voltage (Max Rds On, Min Rds On): 2.4V, 10V
• Vgs(th) (Max) @ Id: 2V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: -
• Input Capacitance (Ciss) (Max) @ Vds: 120pF @ 25V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 1W (Ta)
• Rds On (Max) @ Id, Vgs: 5 Ohm @ 300mA, 10V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: TO-92-3
• Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

BC857CT,115

NXP

TRANS PNP 45V 0.1A SC-75

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 45V
• Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
• Current - Collector Cutoff (Max): 15nA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
• Power - Max: 150mW
• Frequency - Transition: 100MHz
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SC-75, SOT-416
• Supplier Device Package: SC-75

package: SC-75, SOT-416

MC33911BAC

NXP

IC SYSTEM BASIS CHIP 32LQFP

• Applications: System Basis Chip
• Current - Supply: 4.5mA
• Voltage - Supply: 5.5 V ~ 27 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

package: 32-LQFP

GTL2107PW,118

NXP

IC 12BIT GTL/LVTTL TRNSL 28TSSOP

• Translator Type: Mixed Signal
• Channel Type: Unidirectional
• Number of Circuits: 1
• Channels per Circuit: 12
• Voltage - VCCA: -
• Voltage - VCCB: -
• Input Signal: GTL
• Output Signal: LVTTL
• Output Type: Open Drain, Push-Pull
• Data Rate: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Features: -
• Mounting Type: Surface Mount
• Package / Case: 28-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 28-TSSOP

package: 28-TSSOP (0.173", 4.40mm Width)

74HCT253N,652

NXP

IC MULTIPLEX DUAL 4IN 3ST 16-DIP

• Type: Multiplexer
• Circuit: 2 x 4:1
• Independent Circuits: 1
• Current - Output High, Low: 6mA, 6mA
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

package: 16-DIP (0.300", 7.62mm)

HEC4027BT,112

NXP

IC JK TYPE POS TRG DUAL 16SOIC

• Function: Set(Preset) and Reset
• Type: JK Type
• Output Type: Differential
• Number of Elements: 2
• Number of Bits per Element: 1
• Clock Frequency: 30MHz
• Max Propagation Delay @ V, Max CL: 60ns @ 15V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: -
• Voltage - Supply: 3 V ~ 15 V
• Current - Quiescent (Iq): 16µA
• Input Capacitance: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)

package: 16-SOIC (0.154", 3.90mm Width)

TDA18274HD/C1,518

NXP

IC TUNER TERR/CATV 48HLQFN

• Type: Tuner
• Applications: TV
• Mounting Type: Surface Mount
• Package / Case: 48-LFQFN Exposed Pad
• Supplier Device Package: 48-HLQFN (7x7)

package: 48-LFQFN Exposed Pad

TDA8263HN/C1,518

NXP

IC SATELLITE TUNER 32-HVQFN

• Type: Satellite Tuner
• Applications: Demodulation
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

package: 32-VFQFN Exposed Pad

MC8641DVU1000GB

NXP

IC MPU MPC86XX 1.0GHZ 1023FCCBGA

• Core Processor: PowerPC e600
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1023-BCBGA, FCCBGA
• Supplier Device Package: 1023-FCCBGA (33x33)

package: 1023-BCBGA, FCCBGA

KMPC823CVR66B2T

NXP

IC MPU MPC8XX 66MHZ 256BGA

• Core Processor: PowerPC
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: LCD, Video
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

package: 256-BBGA

KMPC875VR133

NXP

IC MPU MPC8XX 133MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 133MHz
• Co-Processors/DSP: Communications; CPM, Security; SEC
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1), 10/100 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: Cryptography
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

package: 256-BBGA

MPC8343ZQAGDB

NXP

IC MPU MPC83XX 400MHZ 620BGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 620-BBGA Exposed Pad
• Supplier Device Package: 620-PBGA (29x29)

package: 620-BBGA Exposed Pad

S9S12DG12F1MPVE

NXP

IC MCU 16BIT 128KB FLASH 112LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: PWM, WDT
• Number of I/O: 91
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

package: 112-LQFP

MC56F8135VFGE

NXP

IC MCU 16BIT 64KB FLASH 128LQFP

• Core Processor: 56800E
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 49
• Program Memory Size: 64KB (32K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 16
• Voltage - Supply (Vcc/Vdd): 2.25 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 128-LQFP
• Supplier Device Package: 128-LQFP (14x20)

package: 128-LQFP

MK22FX512VMC12

NXP

IC MCU 32BIT 512KB FLASH 121BGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 64
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 38x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 121-LFBGA
• Supplier Device Package: 121-MAPBGA (8x8)

package: 121-LFBGA

MK20DN32VMP5

NXP

IC MCU 32BIT 32KB FLASH 64MAPBGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 13x16b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LFBGA
• Supplier Device Package: 64-MAPBGA (5x5)

package: 64-LFBGA

MMA3204KEGR2

NXP

ACCEL 112.5G/33.75G ANAL 20SOIC

• Type: Analog
• Axis: X, Y
• Acceleration Range: ±112.5g (X), ±33.75g (Y)
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 20 (X), 66.67 (Y)
• Bandwidth: 400Hz
• Output Type: Analog Voltage
• Voltage - Supply: 4.75 V ~ 5.25 V
• Features: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

package: 20-SOIC (0.295", 7.50mm Width)

SA614AD/01,118

NXP

IC FM IF SYSTEM LOW PWR 16-SOIC

• Function: FM IF System
• Frequency: 25MHz
• RF Type: Cellular, ASK, FSK
• Secondary Attributes: RSSI Equipped
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

package: 16-SOIC (0.154", 3.90mm Width)

MC33771BSP2AER2

NXP

BATTERY CELL CONTROLLER PREMIUM

• Function: Battery Cell Controller
• Battery Chemistry: Lithium-Ion
• Number of Cells: 7 ~ 14
• Fault Protection: Over/Under Voltage
• Interface: SPI
• Operating Temperature: -40°C ~ 105°C (TA)
• Package / Case: 64-LQFP Exposed Pad
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP Exposed Pad

MKE14Z128VLH7

NXP

KINETIS KE14Z: 72MHZ CORTEX-M0+

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: FlexIO, I²C, SPI, UART/USART
• Peripherals: DMA, LVD, PWM, WDT
• Number of I/O: 58
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 34K x 8
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

FS32K148URT0VLQR

NXP

S32K148 144 LQFP

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 112MHz
• Connectivity: CANbus, Ethernet, FlexIO, I²C, LINbus, SPI, UART/USART
• Peripherals: I²S, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 32x12b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

FS32K142UAT0VLHR

NXP

S32K142 64 LQFP

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 112MHz
• Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

S912ZVML31F1MKF

NXP

MAGNIV 16-BIT MCU S12Z CORE 32

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: LINbus, SCI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 31
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
• Data Converters: A/D 4x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP-EP (7x7)

package: 48-LQFP Exposed Pad

S9S08RN60W1VLF

NXP

8-BIT MCU S08 CORE 60KB FLASH

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, LINbus, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

LX2080XE72029B

NXP

IC MPU QORLQ LX2 2GHZ 1517FCPBGA

• Core Processor: ARM® Cortex®-A72
• Number of Cores/Bus Width: 8 Core, 64-Bit
• Speed: 2GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR4
• Graphics Acceleration: Yes
• Display & Interface Controllers: -
• Ethernet: 100Gbps (2)
• SATA: SATA 3.0 (4)
• USB: USB 3.0 (2) + PHY (2)
• Voltage - I/O: 1.2V, 1.8V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Security Features: Secure Boot, TrustZone®
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCPBGA (40x40)

package: -

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MC33PT2001AE

NXP

SOLENOID CONTROLLER 6 64LQFP

• Applications: Solenoid Controller
• Current - Supply: -
• Voltage - Supply: 0V ~ 72V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP Exposed Pad
• Supplier Device Package: 64-HLQFP (10x10)

package: -

FS32R294LCK0MJDT

NXP

IC MCU 32BIT 2MB CRAM 269LFBGA

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

Request a Quote