NXP Producten

PSMN023-80LS,115

NXP

MOSFET N-CH 80V 34A QFN3333

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 80V
• Current - Continuous Drain (Id) @ 25°C: 34A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 10V
• Vgs(th) (Max) @ Id: 4V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 21nC @ 10V
• Input Capacitance (Ciss) (Max) @ Vds: 1295pF @ 40V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 65W (Tc)
• Rds On (Max) @ Id, Vgs: 23 mOhm @ 10A, 10V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: 8-DFN3333 (3.3x3.3)
• Package / Case: 8-VDFN Exposed Pad

package: 8-VDFN Exposed Pad

MMRF1305HSR5

NXP

FET RF 2CH 133V 512MHZ NI780S-4

• Transistor Type: LDMOS (Dual)
• Frequency: 512MHz
• Gain: 26dB
• Voltage - Test: 50V
• Current Rating: -
• Noise Figure: -
• Current - Test: 100mA
• Power - Output: 100W
• Voltage - Rated: 133V
• Package / Case: NI-780S-4
• Supplier Device Package: NI-780S-4

package: NI-780S-4

MRF8HP21080HR3

NXP

FET RF 2CH 65V 2.17GHZ NI780-4

• Transistor Type: LDMOS (Dual)
• Frequency: 2.17GHz
• Gain: 14.4dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 150mA
• Power - Output: 16W
• Voltage - Rated: 65V
• Package / Case: NI-780-4
• Supplier Device Package: NI-780-4

package: NI-780-4

PZM10NB1,115

NXP

DIODE ZENER 10V 300MW SMT3

• Voltage - Zener (Nom) (Vz): 10V
• Tolerance: ±2%
• Power - Max: 300mW
• Impedance (Max) (Zzt): 10 Ohms
• Current - Reverse Leakage @ Vr: 200nA @ 7V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

package: TO-236-3, SC-59, SOT-23-3

MC34704AEP

NXP

IC POWER MANAGEMENT 56-QFN

• Applications: Processor
• Current - Supply: 86mA
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -20°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-QFN-EP (7x7)

package: 56-VFQFN Exposed Pad

TEA1506AP/N1,112

NXP

IC CONTROLLER SMPS 8-DIP

• Output Isolation: Isolated
• Internal Switch(s): No
• Voltage - Breakdown: 650V
• Topology: Flyback
• Voltage - Start Up: 11V
• Voltage - Supply (Vcc/Vdd): 8.7 V ~ 20 V
• Duty Cycle: -
• Frequency - Switching: 25kHz ~ 175kHz
• Power (Watts): 150W
• Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage, Short Circuit
• Control Features: -
• Operating Temperature: -20°C ~ 145°C (TJ)
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-DIP
• Mounting Type: Through Hole

package: 8-DIP (0.300", 7.62mm)

TDA10027HN/C1,518

NXP

IC DEMOD DUAL W/RX 64-HVQFN

• Type: Demodulator
• Applications: Set-Top Boxes
• Mounting Type: Surface Mount
• Package / Case: 64-VFQFN Dual Rows Exposed Pad
• Supplier Device Package: 64-HVQFN (9x9)

package: 64-VFQFN Dual Rows Exposed Pad

TDA8569Q/N1C,112

NXP

IC AMP AUDIO PWR 40W QUAD 23SIL

• Type: Class B
• Output Type: 4-Channel (Quad)
• Max Output Power x Channels @ Load: 40W x 4 @ 2 Ohm
• Voltage - Supply: 6 V ~ 18 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Through Hole
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: DBS23P
• Package / Case: 23-SIP Formed Leads

package: 23-SIP Formed Leads

PCA9541D/03,118

NXP

IC I2C 2:1 SELECTOR 16-SOIC

• Applications: 2-Channel I2C Multiplexer
• Interface: I2C, SMBus
• Voltage - Supply: 2.3 V ~ 5.5 V
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO
• Mounting Type: Surface Mount

package: 16-SOIC (0.154", 3.90mm Width)

TDA8034HN/C1,118

NXP

IC SMARD CARD INTERFACE 24HVQFN

• Applications: -
• Interface: Analog
• Voltage - Supply: 1.8V, 3V, 5V
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-HVQFN (4x4)
• Mounting Type: Surface Mount

package: 24-VFQFN Exposed Pad

PCA8575DB,118

NXP

IC I/O EXPANDER I2C 16B 24SSOP

• Number of I/O: 16
• Interface: I2C
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 100µA, 25mA
• Clock Frequency: 400kHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 24-SSOP

package: 24-SSOP (0.209", 5.30mm Width)

MPC8548CVTAUJC

NXP

IC MPU MPC85XX 1.333GHZ 783BGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

MCIMX515DJZK8C

NXP

IC MPU I.MX51 800MHZ 529BGA

• Core Processor: ARM? Cortex?-A8
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR, DDR2
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 (3), USB 2.0 + PHY (1)
• Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
• Operating Temperature: -20°C ~ 85°C (TC)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
• Package / Case: 529-LFBGA
• Supplier Device Package: 529-BGA Case 2017 (19x19)

package: 529-LFBGA

KMPC8321ZQADDC

NXP

IC MPU MPC83XX 266MHZ 516BGA

• Core Processor: PowerPC e300c2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

package: 516-BBGA

MPC8347ZQAGDB

NXP

IC MPU MPC83XX 400MHZ 620BGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 620-BBGA Exposed Pad
• Supplier Device Package: 620-PBGA (29x29)

package: 620-BBGA Exposed Pad

MCIMX515DJM8CR2

NXP

IC MPU I.MX51 800MHZ 529BGA

• Core Processor: ARM? Cortex?-A8
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR, DDR2
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 (3), USB 2.0 + PHY (1)
• Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
• Operating Temperature: -20°C ~ 85°C (TC)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
• Package / Case: 529-LFBGA
• Supplier Device Package: 529-BGA Case 2017 (19x19)

package: 529-LFBGA

MC68302AG33C

NXP

IC MPU M683XX 33MHZ 144LQFP

• Core Processor: M68000
• Number of Cores/Bus Width: 1 Core, 8/16-Bit
• Speed: 33MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

MC9S08SH16VTG

NXP

IC MCU 8BIT 16KB FLASH 16TSSOP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 13
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: 16-TSSOP (0.173", 4.40mm Width)

P89V664FA,512

NXP

IC MCU 8BIT 64KB FLASH 44PLCC

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 36
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

package: 44-LCC (J-Lead)

MC9S08PT60VQH

NXP

IC MCU 8BIT 60KB FLASH 64QFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 57
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

package: 64-QFP

S9S08SG16E1WTG

NXP

IC MCU 8BIT 16KB FLASH 16TSSOP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 12
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: -
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: 16-TSSOP (0.173", 4.40mm Width)

LPC54607J256ET180E

NXP

IC MCU 32BIT 256KB FLASH 180BGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 180MHz
• Connectivity: I2C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
• Number of I/O: 145
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 136K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 180-TFBGA
• Supplier Device Package: 180-TFBGA (12x12)

package: 180-TFBGA

SL3S1202AC2,118

NXP

IC ID TAGS UHF FCS2

• Type: -
• Frequency: -
• Standards: -
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

package: -

MFEV630B,699

NXP

EVAL READER BLUEBOARD MFRC630

• Type: Reader Module
• Frequency: 13.56MHz
• For Use With/Related Products: MFRC630
• Supplied Contents: Board

package: -

S912XET256W1VALR

NXP

16-BIT MCU S12X CORE 256KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

package: 112-LQFP

TEA2016AAT-1-S30Y

NXP

DCM/QR PFC + RESONANT POWER SUPP

• Applications: Digital Power Controller
• Voltage - Input: -
• Voltage - Supply: 0.5V ~ 2.65V, 2.35V ~ 4.5V
• Current - Supply: 4.8 mA
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

package: -

FS32K148UJT0VLQR

NXP

S32K148 ARM CORTEX-M4F, 112 MHZ,

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 112MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
• Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
• Number of I/O: 128
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 32x12b SAR; D/A 1x8b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: -

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MFS2633AMVA0AD

NXP

SAFETY SYSTEM BASIS CHIP WITH LO

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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