NXP Producten

2N7002K,215

NXP

MOSFET N-CH 60V 340MA SOT23

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 60V
• Current - Continuous Drain (Id) @ 25°C: 340mA (Ta)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 2V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: -
• Input Capacitance (Ciss) (Max) @ Vds: 40pF @ 10V
• Vgs (Max): ±15V
• FET Feature: -
• Power Dissipation (Max): 830mW (Ta)
• Rds On (Max) @ Id, Vgs: 3.9 Ohm @ 500mA, 10V
• Operating Temperature: -65°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: TO-236AB (SOT23)
• Package / Case: TO-236-3, SC-59, SOT-23-3

package: TO-236-3, SC-59, SOT-23-3

MRF8P18265HR6

NXP

FET RF 2CH 65V 1.88GHZ NI1230-8

• Transistor Type: LDMOS (Dual)
• Frequency: 1.88GHz
• Gain: 16dB
• Voltage - Test: 30V
• Current Rating: -
• Noise Figure: -
• Current - Test: 800mA
• Power - Output: 72W
• Voltage - Rated: 65V
• Package / Case: SOT-1110A
• Supplier Device Package: NI1230-8

package: SOT-1110A

BFR520,235

NXP

TRANS NPN 15V 70MA 9GHZ SOT23

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 15V
• Frequency - Transition: 9GHz
• Noise Figure (dB Typ @ f): 1.1dB ~ 2.1dB @ 900MHz
• Gain: -
• Power - Max: 300mW
• DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 20mA, 6V
• Current - Collector (Ic) (Max): 70mA
• Operating Temperature: 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

package: TO-236-3, SC-59, SOT-23-3

PZM15NB1,115

NXP

DIODE ZENER 15V 300MW SMT3

• Voltage - Zener (Nom) (Vz): 15V
• Tolerance: ±2%
• Power - Max: 300mW
• Impedance (Max) (Zzt): 15 Ohms
• Current - Reverse Leakage @ Vr: 70nA @ 11V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

package: TO-236-3, SC-59, SOT-23-3

74HCT366N,652

NXP

IC HEX BUFFER/LINE DVR 16DIP

• Logic Type: Buffer, Inverting
• Number of Elements: 1
• Number of Bits per Element: 6
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 6mA, 6mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

package: 16-DIP (0.300", 7.62mm)

74LVCH32245AEC/G,5

NXP

IC TRANSCVR TRI-ST 32BIT 96BGA

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 4
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 96-LFBGA
• Supplier Device Package: 96-LFBGA (13.5x5.5)

package: 96-LFBGA

PCA9574PW,112

NXP

IC I/O EXPANDER I2C 8B 16TSSOP

• Number of I/O: 8
• Interface: I2C, SMBus
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 1mA, 3mA
• Clock Frequency: 400kHz
• Voltage - Supply: 1.1 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: 16-TSSOP (0.173", 4.40mm Width)

USB2SERA10CFK

NXP

IC CONTROLLER USB 24QFN

• Protocol: USB
• Function: Bridge, USB to UART
• Interface: UART
• Standards: USB 2.0
• Voltage - Supply: 2.7 V ~ 5.5 V
• Current - Supply: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 24-VQFN Exposed Pad
• Supplier Device Package: 24-QFN-EP (5x5)

package: 24-VQFN Exposed Pad

MPC8569VTAUNLB

NXP

IC MPU MPC85XX 1.333GHZ 783BGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR2, DDR3, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (8), 1 Gbps (4)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

KMC7457VG1267LC

NXP

IC MPU MPC74XX 1.267GHZ 483BGA

• Core Processor: PowerPC G4
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.267GHz
• Co-Processors/DSP: Multimedia; SIMD
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 483-BCBGA, FCCBGA
• Supplier Device Package: 483-FCCBGA (29x29)

package: 483-BCBGA, FCCBGA

MC68MH360ZP33L

NXP

IC MPU M683XX 33MHZ 357BGA

• Core Processor: CPU32+
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 33MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 357-BGA
• Supplier Device Package: 357-PBGA (25x25)

package: 357-BGA

MCIMX253CJM4A

NXP

IC MPU I.MX25 400MHZ 400MAPBGA

• Core Processor: ARM926EJ-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: -
• RAM Controllers: LPDDR, DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: Keypad
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: -
• Package / Case: 400-LFBGA
• Supplier Device Package: 400-MAPBGA (17x17)

package: 400-LFBGA

MK40DX128VMB7

NXP

IC MCU 32BIT 128KB FLASH 81BGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, I2C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
• Number of I/O: 52
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 20x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 81-LBGA
• Supplier Device Package: 81-MAPBGA (10x10)

package: 81-LBGA

MC68HC908GR16MFA

NXP

IC MCU 8BIT 16KB FLASH 48LQFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: LIN, SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 37
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

MC9S08AC32CFGER

NXP

IC MCU 8BIT 32KB FLASH 44LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 34
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

package: 44-LQFP

S9S12G64F0CLFR

NXP

IC MCU 16BIT 64KB FLASH 48LQFP

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

PCF8591T/2,512

NXP

IC ADC/DAC 8-BIT I2C 16-SOIC

• Type: ADC, DAC
• Number of Channels: -
• Resolution (Bits): 8 b
• Sampling Rate (Per Second): 11.1k
• Data Interface: I2C, Serial
• Voltage Supply Source: Single Supply
• Voltage - Supply: 2.5 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SO

package: 16-SOIC (0.295", 7.50mm Width)

MMA621010EGR2

NXP

ACCELEROMETER 100G ANALOG 20SOIC

• Type: Analog
• Axis: X, Y
• Acceleration Range: ±100g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 4.68mV/V/g
• Bandwidth: 3kHz
• Output Type: Analog Voltage
• Voltage - Supply: 3.13 V ~ 5.25 V
• Features: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

package: 20-SOIC (0.295", 7.50mm Width)

MMA5124KW

NXP

ACCELEROMETER 240G PCM/SPI 16QFN

• Type: Digital
• Axis: Z
• Acceleration Range: ±240g
• Sensitivity (LSB/g): 2
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: PCM, SPI
• Voltage - Supply: 4.2 V ~ 17 V
• Features: Selectable Low Pass Filter
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-QFN Exposed Pad
• Supplier Device Package: 16-QFN (6x6)

package: 16-QFN Exposed Pad

HTSMOH5601EV,118

NXP

IC HITAG-S 256BIT MOA2 PLLMC

• Type: RFID Transponder
• Frequency: 100kHz ~ 150kHz
• Standards: ISO 14223, ISO 11784, ISO 11785, ISO 18000-2
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -25°C ~ 85°C
• Package / Case: MOA4, Smart Card Module
• Supplier Device Package: -

package: MOA4, Smart Card Module

MPXY8500DK016T1

NXP

IC PRESSURE SENSOR 32QFN

• Frequency: 315MHz, 434MHz
• Applications: TPM (Tire Pressure Monitor)
• Modulation or Protocol: FSK, OOK
• Data Rate (Max): -
• Power - Output: -
• Current - Transmitting: -
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Memory Size: 8kB Flash, 512B SRAM
• Features: -
• Voltage - Supply: 2.3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 32-QFN Exposed Pad

package: 32-QFN Exposed Pad

TEF6642HW/V101,557

NXP

IC ONE-CHIP RADIO 64HTQFP

• Frequency: -
• Sensitivity: -
• Data Rate (Max): -
• Modulation or Protocol: AM, FM
• Applications: AM/FM Radio Receiver
• Current - Receiving: -
• Data Interface: PCB, Surface Mount
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: 64-TQFP Exposed Pad
• Supplier Device Package: 64-HTQFP (10x10)

package: 64-TQFP Exposed Pad

PCAL6408AEX1Z

NXP

LOW-VOLTAGE TRANSLATING, 8-BIT I

• Number of I/O: 8
• Interface: I²C, SMBus
• Interrupt Output: Yes
• Features: POR
• Output Type: Open Drain, Push-Pull
• Current - Output Source/Sink: 10mA, 25mA
• Clock Frequency: 400kHz
• Voltage - Supply: 1.65 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-XFLGA
• Supplier Device Package: 16-X2QFN (1.6x1.6)

package: 16-XFLGA

LS1026ASE8P1A

NXP

QORIQ LAYERSCAPE 2XA72 64BIT ARM

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

package: -

SP5748GSK0AVMJ2R

NXP

TRIPLE CORE, 6M FLASH

• Core Processor: e200z2, e200z4, e200z4
• Core Size: 32-Bit Tri-Core
• Speed: 80MHz/160MHz
• Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: 178
• Program Memory Size: 6MB (6M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 768K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 80x10b, 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-MAPPBGA (17x17)

package: 256-LBGA

MWCT1123FVLL

NXP

KV4X WCT 100LQFP

• Applications: Microcontroller, MCU
• Current - Supply: -
• Voltage - Supply: 1.71V ~ 3.6V
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: -

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S9S12GN48J0VLFR

NXP

S12 CORE,48K FLASH,AU

• Core Processor: S12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1.5K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: -

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MFS8613BMBA0ESR2

NXP

SAFETY SYSTEM BASIS CHIP FOR DOM

• Applications: Camera
• Current - Supply: -
• Voltage - Supply: 60V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-HVQFN (7x7)

package: -

Request a Quote