NXP Producten

BFG10W/X,115

NXP

TRANS NPN 10V 250MA SOT343N

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 10V
• Frequency - Transition: 1.9GHz
• Noise Figure (dB Typ @ f): -
• Gain: -
• Power - Max: 400mW
• DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 50mA, 5V
• Current - Collector (Ic) (Max): 250mA
• Operating Temperature: 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SOT-343 Reverse Pinning
• Supplier Device Package: 4-SO

package: SOT-343 Reverse Pinning

BZX84-C4V7/LF1VL

NXP

DIODE ZENER TO-236AB SOT23

• Voltage - Zener (Nom) (Vz): 4.7V
• Tolerance: ±5%
• Power - Max: 250mW
• Impedance (Max) (Zzt): 80 Ohms
• Current - Reverse Leakage @ Vr: 3µA @ 2V
• Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

package: TO-236-3, SC-59, SOT-23-3

SC16C550BIN40,112

NXP

IC UART 40-DIP

• Features: -
• Number of Channels: 1, UART
• FIFO's: 16 Byte
• Protocol: -
• Data Rate (Max): 3Mbps
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Through Hole
• Package / Case: 40-DIP (0.600", 15.24mm)
• Supplier Device Package: 40-DIP

package: 40-DIP (0.600", 15.24mm)

MC33689DWBR2

NXP

IC SYSTEM BASE W/LIN 32-SOIC

• Applications: Automotive Mirror Control
• Interface: SPI Serial
• Voltage - Supply: 5.5 V ~ 18 V
• Package / Case: 32-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 32-SOIC
• Mounting Type: Surface Mount

package: 32-SOIC (0.295", 7.50mm Width)

SC26C562C1A,518

NXP

IC DUAL SRL COMM CTRLR 52PLCC

• Applications: -
• Interface: DMA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Package / Case: 52-LCC (J-Lead)
• Supplier Device Package: 52-PLCC (19.2x19.2)
• Mounting Type: Surface Mount

package: 52-LCC (J-Lead)

PCA9517AD,118

NXP

IC REDRIVER I2C 1CH 400KHZ 8SO

• Type: Buffer, ReDriver
• Applications: I2C
• Input: 2-Wire Bus
• Output: 2-Wire Bus
• Data Rate (Max): 400kHz
• Number of Channels: 2
• Delay Time: -
• Signal Conditioning: -
• Capacitance - Input: 6pF
• Voltage - Supply: 2.7 V ~ 5.5 V
• Current - Supply: 5mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: -
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

package: 8-SOIC (0.154", 3.90mm Width)

TJA1040T/H/V,518

NXP

IC TXRX CAN W/STANDBY HS 8SOIC

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 70mV
• Data Rate: -
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

package: 8-SOIC (0.154", 3.90mm Width)

TJA1028T/3V3/20/1J

NXP

IC TXRX LIN SAE J2602 8SOIC

• Type: Transceiver
• Protocol: LIN
• Number of Drivers/Receivers: 1/1
• Duplex: Full
• Receiver Hysteresis: 200mV
• Data Rate: -
• Voltage - Supply: 5.5 V ~ 28 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

package: 8-SOIC (0.154", 3.90mm Width)

HEF4053BT/AUJ

NXP

IC ANLG SWITCH TRPL SPDT 16SOIC

• Switch Circuit: SPDT
• Multiplexer/Demultiplexer Circuit: 2:1
• Number of Circuits: 3
• On-State Resistance (Max): 155 Ohm
• Channel-to-Channel Matching (ΔRon): 5 Ohm
• Voltage - Supply, Single (V+): 3 V ~ 15 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): -
• -3db Bandwidth: 70MHz
• Charge Injection: -
• Channel Capacitance (CS(off), CD(off)): 7.5pF
• Current - Leakage (IS(off)) (Max): 200nA
• Crosstalk: -50dB @ 1MHz
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

package: 16-SOIC (0.154", 3.90mm Width)

MPC8544VTANGA

NXP

IC MPU MPC85XX 800MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

KMC7457VG1000NC

NXP

IC MPU MPC74XX 1.0GHZ 483FCCBGA

• Core Processor: PowerPC G4
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; SIMD
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 483-BCBGA, FCCBGA
• Supplier Device Package: 483-FCCBGA (29x29)

package: 483-BCBGA, FCCBGA

MCIMX6G2AVM05AA

NXP

IC MPU I.MC6UL 528MHZ 289BGA

• Core Processor: ARM? Cortex?-A7
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 528MHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: LCD, LVDS
• Ethernet: 10/100 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
• Package / Case: 289-LFBGA
• Supplier Device Package: 289-MAPBGA (14x14)

package: 289-LFBGA

MC9S08JM60CGT

NXP

IC MCU 8BIT 60KB FLASH 48QFN

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I2C, LIN, SCI, SPI, USB
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 37
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN-EP (7x7)

package: 48-VFQFN Exposed Pad

MSC8126TVT6400

NXP

IC DSP QUAD 16B 400MHZ 431FCBGA

• Type: SC140 Core
• Interface: DSI, Ethernet, RS-232
• Clock Rate: 400MHz
• Non-Volatile Memory: External
• On-Chip RAM: 1.436MB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 431-BFBGA, FCBGA
• Supplier Device Package: 431-FCPBGA (20x20)

package: 431-BFBGA, FCBGA

PCF2127AT/1,518

NXP

IC RTC CLK/CAL I2C/SPI 20-SOIC

• Type: Clock/Calendar
• Features: Alarm, Leap Year, Square Wave Output, SRAM, TCXO/Crystal, Watchdog Timer
• Memory Size: 512B
• Time Format: HH:MM:SS (12/24 hr)
• Date Format: YY-MM-DD-dd
• Interface: I2C, 2-Wire Serial
• Voltage - Supply: 1.8 V ~ 4.2 V
• Voltage - Supply, Battery: 1.8 V ~ 4.2 V
• Current - Timekeeping (Max): 1.5µA @ 3.3V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SO

package: 20-SOIC (0.295", 7.50mm Width)

HTMS8101FUG/AM,005

NXP

IC TRANSPONDER RFID HITAG

• Type: RFID Transponder
• Frequency: 100kHz ~ 150kHz
• Standards: ISO 11784, ISO 11785
• Interface: -
• Voltage - Supply: 4 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: Die
• Supplier Device Package: Wafer

package: Die

HTMS1001FTB/AF,115

NXP

RFID HTAG 128BIT MEM 3XSON

• Style: Encapsulated
• Technology: Passive
• Frequency: 100kHz ~ 150kHz
• Memory Type: Read/Write
• Writable Memory: 1.76kb (User)
• Standards: ISO 11784, ISO 11785
• Operating Temperature: -
• Size / Dimension: 1.45mm x 1.00mm x 0.50mm

package: -

JN5148/001M03T,534

NXP

RF TXRX MODULE 802.15.4 U.FL ANT

• RF Family/Standard: 802.15.4
• Protocol: Zigbee?
• Modulation: -
• Frequency: 2.4GHz
• Data Rate: -
• Power - Output: 2.5dBm
• Sensitivity: -95dBm
• Serial Interfaces: I2C, SPI, UART
• Antenna Type: Not Included, U.FL
• Memory Size: 128kB ROM, 128kB RAM
• Voltage - Supply: 2.7 V ~ 3.6 V
• Current - Receiving: 17.5mA
• Current - Transmitting: 17.5mA
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Package / Case: Module

package: Module

T2081NSE8PTB

NXP

QORIQ 64B POWER ARCH 8X 1.5GHZ

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

package: -

LS1043ASE8KNLB

NXP

QORIQ 4XCPU 64-BIT ARM ARCH 1.

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

package: -

SAC57D53MCVMO

NXP

ARM 32-BIT MCU TRIPLE CORE 3MB

• Core Processor: ARM® Cortex®-A5, -M4, -M0+
• Core Size: 32-Bit Tri-Core
• Speed: 80MHz, 160MHz, 320MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI
• Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 3MB (3M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2.3M x 8
• Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 516-BGA
• Supplier Device Package: 516-MAPBGA (27x27)

package: 516-BGA

SPC5605BK0VLL6R

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 77
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 7x10b, 5x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: 100-LQFP

SPC5604BF2VLH6R

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 45
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

PNX9531E/V1,557

NXP

IC MEDIA PROCESSOR

• Applications: Multimedia
• Core Processor: TriMedia™
• Program Memory Type: -
• Controller Series: Nexperia
• RAM Size: -
• Interface: GPIO, Host Interface, I²C, PCI, USB, XIO
• Number of I/O: 8
• Voltage - Supply: 1.16V ~ 1.24V, 3.15V ~ 3.6V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 456-BGA
• Supplier Device Package: 456-PBGA (27x27)

package: 456-BGA

SAF4000EL-101S53DK

NXP

SOFTWARE DEFINED RADIO

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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MIMXRT595SFFOCR

NXP

IC MCU 32BIT 192KB ROM 249FOWLP

• Core Processor: ARM® Cortex®-M33
• Core Size: 32-Bit Dual-Core
• Speed: 200MHz
• Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
• Peripherals: DMA, I2S, LCD, POR, PWM, WDT
• Number of I/O: 136
• Program Memory Size: 192KB (192K x 8)
• Program Memory Type: ROM
• EEPROM Size: -
• RAM Size: 5M x 8
• Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
• Data Converters: A/D 10x12b
• Oscillator Type: External, Internal
• Operating Temperature: -20°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 249-WFBGA
• Supplier Device Package: 249-FOWLP (7x7)

package: -

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P3S0200GMX

NXP

IC I3C BI-DIR SWITCH XQFN10

• Type: Bus Switch
• Circuit: 2 x 1:2, 2 x 2:1
• Independent Circuits: 2
• Current - Output High, Low: -
• Voltage Supply Source: Single Supply
• Voltage - Supply: 2.3V ~ 3.6V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 10-XFQFN
• Supplier Device Package: 10-XQFN (1.55x2)

package: -

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MC33FS8425G0ESR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

• Applications: System Basis Chip
• Current - Supply: 15mA
• Voltage - Supply: 60V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

package: -

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