NXP Producten

PHP222NQ04LT,127

NXP

MOSFET N-CH 40V 75A TO220AB

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 40V
• Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 2V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 93.6nC @ 5V
• Input Capacitance (Ciss) (Max) @ Vds: 7880pF @ 25V
• Vgs (Max): ±15V
• FET Feature: -
• Power Dissipation (Max): 300W (Tc)
• Rds On (Max) @ Id, Vgs: 2.8 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: TO-220AB
• Package / Case: TO-220-3

package: TO-220-3

BUK9524-55A,127

NXP

MOSFET N-CH 55V 46A TO220AB

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 55V
• Current - Continuous Drain (Id) @ 25°C: 46A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 2V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: -
• Input Capacitance (Ciss) (Max) @ Vds: 1815pF @ 25V
• Vgs (Max): ±10V
• FET Feature: -
• Power Dissipation (Max): 105W (Tc)
• Rds On (Max) @ Id, Vgs: 21.7 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: TO-220AB
• Package / Case: TO-220-3

package: TO-220-3

LD6806TD/22P,125

NXP

IC REG LINEAR 2.2V 200MA 5TSOP

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 2.2V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.13V @ 200mA
• Current - Output: 200mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 100µA ~ 250µA
• PSRR: 55dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: SC-74A, SOT-753
• Supplier Device Package: 5-TSOP

package: SC-74A, SOT-753

74AVCM162834DGG:11

NXP

IC TRANSCVR 3-ST 18BIT 56TSSOP

• Logic Type: Universal Bus Driver
• Number of Circuits: 18-Bit
• Current - Output High, Low: 12mA, 12mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 56-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 56-TSSOP

package: 56-TFSOP (0.240", 6.10mm Width)

74LV573D,118

NXP

IC OCTAL D TRANSP LATCH 20SOIC

• Logic Type: D-Type Transparent Latch
• Circuit: 8:8
• Output Type: Tri-State
• Voltage - Supply: 1 V ~ 5.5 V
• Independent Circuits: 1
• Delay Time - Propagation: 24ns
• Current - Output High, Low: 16mA, 16mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SO

package: 20-SOIC (0.295", 7.50mm Width)

74LVC27PW,112

NXP

IC GATE NOR 3CH 3-INP 14-TSSOP

• Logic Type: NOR Gate
• Number of Circuits: 3
• Number of Inputs: 3
• Features: -
• Voltage - Supply: 1.2 V ~ 3.6 V
• Current - Quiescent (Max): 40µA
• Current - Output High, Low: 24mA, 24mA
• Logic Level - Low: 0.7 V ~ 0.8 V
• Logic Level - High: 1.7 V ~ 2 V
• Max Propagation Delay @ V, Max CL: 2.4ns @ 3.3V, 50pF
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-TSSOP
• Package / Case: 14-TSSOP (0.173", 4.40mm Width)

package: 14-TSSOP (0.173", 4.40mm Width)

74LVC109PW,112

NXP

IC JK TYPE POS TRG DUAL 16TSSOP

• Function: Set(Preset) and Reset
• Type: JK Type
• Output Type: Differential
• Number of Elements: 2
• Number of Bits per Element: 1
• Clock Frequency: 330MHz
• Max Propagation Delay @ V, Max CL: 6.8ns @ 3.3V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 1.65 V ~ 3.6 V
• Current - Quiescent (Iq): 10µA
• Input Capacitance: 5pF
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)

package: 16-TSSOP (0.173", 4.40mm Width)

TDF8544J/N3,112

NXP

IC AMP AUDIO BTL DBS27P

• Type: Class AB
• Output Type: 4-Channel (Quad)
• Max Output Power x Channels @ Load: 28W x 4 @ 4 Ohm
• Voltage - Supply: 6 V ~ 18 V
• Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Through Hole
• Operating Temperature: -
• Supplier Device Package: DBS27P
• Package / Case: 27-SIP, Formed Leads

package: 27-SIP, Formed Leads

PC33663LEFR2

NXP

LINCELL SO14

• Applications: -
• Interface: -
• Voltage - Supply: -
• Package / Case: -
• Supplier Device Package: -
• Mounting Type: -

package: -

TDA8574T/N1,512

NXP

IC LINE DRIVER CLASS-H 16-SOIC

• Type: Driver
• Protocol: -
• Number of Drivers/Receivers: 2/0
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: 6 V ~ 12 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SO

package: 16-SOIC (0.295", 7.50mm Width)

MC8641DTHX1333JE

NXP

IC MPU MPC86XX 1.333GHZ 1023BGA

• Core Processor: PowerPC e600
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1023-BCBGA, FCCBGA
• Supplier Device Package: 1023-FCCBGA (33x33)

package: 1023-BCBGA, FCCBGA

MC9S08GT60CFDER

NXP

IC MCU 8BIT 60KB FLASH 48QFN

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN-EP (7x7)

package: 48-VFQFN Exposed Pad

MC56F8035VLD

NXP

IC MCU 16BIT 64KB FLASH 44LQFP

• Core Processor: 56800E
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 64KB (32K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 16
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

package: 44-LQFP

MK20FN1M0VMD12

NXP

IC MCU 32BIT 1MB FLASH 144MAPBGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 100
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 58x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LBGA
• Supplier Device Package: 144-MAPBGA (13x13)

package: 144-LBGA

MSC8256TAG1000B

NXP

IC DSP 6X 1GHZ SC3850 783FCBGA

• Type: SC3850 Six Core
• Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
• Clock Rate: 1GHz
• Non-Volatile Memory: ROM (96 kB)
• On-Chip RAM: 576kB
• Voltage - I/O: 2.50V
• Voltage - Core: 1.00V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

TDA8777HL/33/C1,15

NXP

IC VIDEO DAC 10BIT TRIPLE 48LQFP

• Number of Bits: 10
• Number of D/A Converters: 3
• Settling Time: -
• Output Type: Current - Unbuffered
• Differential Output: Yes
• Data Interface: Parallel
• Reference Type: Internal
• Voltage - Supply, Analog: 3 V ~ 3.6 V
• Voltage - Supply, Digital: 3 V ~ 3.6 V
• INL/DNL (LSB): ±1.8 (Max), ±0.9 (Max)
• Architecture: String DAC
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)
• Mounting Type: -

package: 48-LQFP

MC100ES6210FA

NXP

IC CLK BUFFER 1:5 3GHZ 32LQFP

• Type: Fanout Buffer (Distribution)
• Number of Circuits: 2
• Ratio - Input:Output: 1:5
• Differential - Input:Output: Yes/Yes
• Input: ECL, PECL
• Output: ECL, PECL
• Frequency - Max: 3GHz
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: 0°C ~ 110°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

package: 32-LQFP

MMA1250KEGR2

NXP

ACCELEROMETER 5G ANALOG 16SOIC

• Type: Analog
• Axis: Z
• Acceleration Range: ±5g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 400
• Bandwidth: 50Hz
• Output Type: Analog Voltage
• Voltage - Supply: 4.75 V ~ 5.25 V
• Features: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

package: 16-SOIC (0.295", 7.50mm Width)

MF1S5030XDA4/V1J

NXP

MIFARE CLASSIC SMART CARD IC

• Type: RFID Transponder
• Frequency: 13.56MHz
• Standards: ISO 14443, MIFARE
• Interface: UART
• Voltage - Supply: -
• Operating Temperature: -25°C ~ 70°C
• Package / Case: MOA4, Smart Card Module
• Supplier Device Package: PLLMC

package: MOA4, Smart Card Module

MC33664ATL1EGR2

NXP

TRANSFORMER PHYSICAL LAYER

• Applications: Isolated Communications Interface
• Current - Supply: 40mA
• Voltage - Supply: 4.5 V ~ 7 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SOIC

package: 16-SOIC (0.154", 3.90mm Width)

MFS2631AMDA0ADR2

NXP

AUTO SBC

• Applications: -
• Current - Supply: 30µA
• Voltage - Supply: 3.2V ~ 40V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP-EP (7x7)

package: -

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MC9S08PL60CLC

NXP

IC MCU 8BIT 32KB FLASH 32LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: LINbus, SCI, UART/USART
• Peripherals: LVD, POR, PWM
• Number of I/O: 30
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

package: -

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MC33VR5500V0ESR2

NXP

VR5500

• Applications: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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SPC5745BK1AMKU6

NXP

IC MCU 32BIT 2MB FLASH 176LQFP

• Core Processor: e200z4
• Core Size: 32-Bit Single-Core
• Speed: 160MHz
• Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: 129
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
• Data Converters: A/D 36x10b, 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 176-LQFP Exposed Pad
• Supplier Device Package: 176-LQFP (24x24)

package: -

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MFS2613AMBA0AD

NXP

SAFETY SYSTEM BASIS CHIP WITH LO

• Applications: -
• Current - Supply: -
• Voltage - Supply: 3.2V ~ 40V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP-EP (7x7)

package: -

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PM823HN-A0CHP

NXP

POWER MANAGEMENT IC, DUAL SYNCHR

• Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (1)
• Function: -
• Number of Outputs: 3
• Frequency - Switching: 3MHz
• Voltage/Current - Output 1: 1.1V, 1.5A
• Voltage/Current - Output 2: 2.2V, 1.5A
• Voltage/Current - Output 3: 1.8V, 525mA
• w/LED Driver: No
• w/Supervisor: No
• w/Sequencer: No
• Voltage - Supply: 2.7V ~ 5.5V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-HVQFN (4x4)

package: -

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MFS2301BMBA0EPR2

NXP

IC

• Applications: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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FS32R294KCK0MJDR

NXP

S32R29 MULTICORE POWER ARCHITECT

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 269-LFBGA
• Supplier Device Package: 269-LFBGA (14x14)

package: -

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