NXP Producten

BZX84-C62/LF1R

NXP

DIODE ZENER TO-236AB SOT23

• Voltage - Zener (Nom) (Vz): 62V
• Tolerance: ±5%
• Power - Max: 250mW
• Impedance (Max) (Zzt): 215 Ohms
• Current - Reverse Leakage @ Vr: 50nA @ 43.4V
• Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

package: TO-236-3, SC-59, SOT-23-3

SSTV16859BS,157

NXP

IC REG BUFFER 26BIT 56HVQFN

• Logic Type: Registered Buffer with SSTL_2 Compatible I/O for DDR
• Supply Voltage: 2.3 V ~ 2.7 V
• Number of Bits: 13, 26
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN

package: 56-VFQFN Exposed Pad

PCA9675DB,118

NXP

IC I/O EXPANDER I2C 16B 24SSOP

• Number of I/O: 16
• Interface: I2C
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 100µA, 25mA
• Clock Frequency: 1MHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 24-SSOP

package: 24-SSOP (0.209", 5.30mm Width)

TJA1050T/VM,112

NXP

IC TRANSCEIVER CAN 8SOIC

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 70mV
• Data Rate: -
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

package: 8-SOIC (0.154", 3.90mm Width)

PCA9564BS,118

NXP

IC CTRL PARALLEL/I2C BUS 20HVQFN

• Protocol: I2C
• Function: Controller
• Interface: Parallel
• Standards: -
• Voltage - Supply: 2.3 V ~ 3.6 V
• Current - Supply: 6mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-VQFN Exposed Pad
• Supplier Device Package: 20-HVQFN (5x5)

package: 20-VQFN Exposed Pad

MPC8572ECLPXATLD

NXP

IC MPU MPC85XX 1.2GHZ 1023FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: Signal Processing; SPE, Security; SEC
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 1023-BFBGA, FCBGA
• Supplier Device Package: 1023-FCPBGA (33x33)

package: 1023-BFBGA, FCBGA

MPC8358ECZQAGDGA

NXP

IC MPU MPC83XX 400MHZ 668BGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 668-BBGA Exposed Pad
• Supplier Device Package: 668-PBGA-PGE (29x29)

package: 668-BBGA Exposed Pad

MPC8247ZQPIEA

NXP

IC MPU MPC82XX 300MHZ 516BGA

• Core Processor: PowerPC G2_LE
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 300MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

package: 516-BBGA

KMPC8265AZUPIBC

NXP

IC MPU MPC82XX 200MHZ 408TBGA

• Core Processor: PowerPC G2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 200MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 480-LBGA
• Supplier Device Package: 408-TBGA (37.5x37.5)

package: 480-LBGA

MPC8347VRADDB

NXP

IC MPU MPC83XX 266MHZ 620BGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 620-BBGA Exposed Pad
• Supplier Device Package: 620-PBGA (29x29)

package: 620-BBGA Exposed Pad

MPC8343EVRADDB

NXP

IC MPU MPC83XX 266MHZ 620BGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 620-BBGA Exposed Pad
• Supplier Device Package: 620-PBGA (29x29)

package: 620-BBGA Exposed Pad

MCIMX351AVM4BR2

NXP

IC MPU I.MX35 400MHZ 400MAPBGA

• Core Processor: ARM1136JF-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Multimedia; VFP
• RAM Controllers: LPDDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: Keypad, KPP, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: Secure Fusebox, Secure JTAG
• Package / Case: 400-LFBGA
• Supplier Device Package: 400-MAPBGA (17x17)

package: 400-LFBGA

MC9S08QE128CFTR

NXP

IC MCU 8BIT 128KB FLASH 48QFN

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 50MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number of I/O: 38
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN-EP (7x7)

package: 48-VFQFN Exposed Pad

MC9S12D64CFUER

NXP

IC MCU 16BIT 64KB FLASH 80QFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: PWM, WDT
• Number of I/O: 59
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

package: 80-QFP

S9S08SG32E1WTG

NXP

IC MCU 8BIT 32KB FLASH 16TSSOP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 12
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: -
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: 16-TSSOP (0.173", 4.40mm Width)

MC908JB8FBE

NXP

IC MCU 8BIT 8KB FLASH 44QFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 3MHz
• Connectivity: USB
• Peripherals: LVD, POR, PWM
• Number of I/O: 37
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 44-QFP
• Supplier Device Package: 44-QFP (10x10)

package: 44-QFP

MCF51CN128CGT

NXP

IC MCU 32BIT 128KB FLASH 48QFN

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: Ethernet, I2C, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number of I/O: 38
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 24K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 12x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN-EP (7x7)

package: 48-VFQFN Exposed Pad

UDA1334BT/N2,118

NXP

IC AUDIO DAC LP 16-SOIC

• Type: DAC, Audio
• Number of Channels: -
• Resolution (Bits): 24 b
• Sampling Rate (Per Second): 100k
• Data Interface: I2S
• Voltage Supply Source: Analog and Digital
• Voltage - Supply: 1.8 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

package: 16-SOIC (0.154", 3.90mm Width)

NCF2960VHN/T0B04AJ

NXP

IC REMOTE KEYLESS ENTRY 24HVQFN

• Type: -
• Frequency: -
• Standards: -
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

package: -

SLRC61002HN,151

NXP

IC CONTACTLESS READER 32HVQFN

• Type: RFID Reader
• Frequency: 13.56MHz
• Standards: ISO 15693, ISO 18000-3
• Interface: I2C, SPI, UART
• Voltage - Supply: 3 V ~ 5.5 V
• Operating Temperature: -25°C ~ 85°C
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

package: 32-VFQFN Exposed Pad

MC13202FCR2

NXP

IC RF TXRX 802.15.4/ISM 32-VFQFN

• Type: TxRx Only
• RF Family/Standard: 802.15.4, General ISM > 1GHz
• Protocol: Zigbee?
• Modulation: DSSS, O-QPSK
• Frequency: 2.4GHz
• Data Rate (Max): 250kbps
• Power - Output: 4dBm
• Sensitivity: -92dBm
• Memory Size: -
• Serial Interfaces: SPI
• GPIO: 7
• Voltage - Supply: 2 V ~ 3.4 V
• Current - Receiving: 37mA
• Current - Transmitting: 30mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-VFQFN Exposed Pad

package: 32-VFQFN Exposed Pad

LS2084AXE7TTB

NXP

LS2084A XT WE 1800 R1.1

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

package: -

SPC5566MVR132R

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z6
• Core Size: 32-Bit
• Speed: 132MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 256
• Program Memory Size: 3MB (3M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
• Data Converters: A/D 40x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 416-BBGA
• Supplier Device Package: 416-PBGA (27x27)

package: 416-BBGA

MK22FN256VLL12R

NXP

KINETIS K 32-BIT MCU ARM CORTEX

• Core Processor: ARM® Cortex®-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I²S, LVD, POR, PWM, WDT
• Number of I/O: 66
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 48K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 33x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

ASL5008SHV-0Y

NXP

IC LED DRVR CTRLR PWM 48HLQFP

• Type: DC DC Controller
• Topology: Switched Capacitor (Charge Pump)
• Internal Switch(s): Yes
• Number of Outputs: 12
• Voltage - Supply (Min): 4.5V
• Voltage - Supply (Max): 5.5V
• Voltage - Output: -
• Current - Output / Channel: 800mA
• Frequency: 200MHz
• Dimming: PWM
• Applications: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-HLQFP (7x7)

package: -

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SAF775DHN-N208WAMP

NXP

CAR RADIO TUNER & AUDIO DSP

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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PCF85133U-2DA-1-02

NXP

IC LCD DRIVER UNIV UNCASED DIE

• Display Type: -
• Configuration: -
• Interface: -
• Digits or Characters: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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SPC5741PK1AMMM5R

NXP

IC MCU 32BIT 1MB FLASH 257MAPBGA

• Core Processor: e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 150MHz
• Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: -
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
• Data Converters: A/D 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 257-LFBGA
• Supplier Device Package: 257-LFBGA (14x14)

package: -

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