NXP Producten

PHT11N06LT,135

NXP

MOSFET N-CH 55V 4.9A SOT223

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 55V
• Current - Continuous Drain (Id) @ 25°C: 4.9A (Ta)
• Drive Voltage (Max Rds On, Min Rds On): 5V
• Vgs(th) (Max) @ Id: 2V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 17nC @ 5V
• Input Capacitance (Ciss) (Max) @ Vds: 1400pF @ 25V
• Vgs (Max): ±13V
• FET Feature: -
• Power Dissipation (Max): 1.8W (Ta), 8.3W (Tc)
• Rds On (Max) @ Id, Vgs: 40 mOhm @ 5A, 5V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: SOT-223
• Package / Case: TO-261-4, TO-261AA

package: TO-261-4, TO-261AA

TDA3681TH/N2S,518

NXP

IC REG MULTIPLE VOLTAGE 20HSOP

• Applications: Ignition Buffer, Regulator
• Current - Supply: 110µA
• Voltage - Supply: 9.5 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
• Supplier Device Package: 20-HSOP

package: 20-SOIC (0.433", 11.00mm Width) Exposed Pad

N74F543N,602

NXP

IC TRANSCVR TRI-ST 8BIT 24DIP

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 3mA, 24mA; 15mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Through Hole
• Package / Case: 24-DIP (0.300", 7.62mm)
• Supplier Device Package: 24-DIP

package: 24-DIP (0.300", 7.62mm)

74ALVT16241DGG,118

NXP

IC BUFF DVR TRI-ST 16BIT 48TSSOP

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 4
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 48-TSSOP

package: 48-TFSOP (0.240", 6.10mm Width)

PCA9674PW/S911,118

NXP

IC I/O EXPANDER I2C 8B 16TSSOP

• Number of I/O: 8
• Interface: I2C
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 100µA, 25mA
• Clock Frequency: 1MHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: 16-TSSOP (0.173", 4.40mm Width)

KMPC8548HXAUJ

NXP

IC MPU MPC85XX 1.333GHZ 783BGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

MPC8547EVUAUJ

NXP

IC MPU MPC85XX 1.333GHZ 783BGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: Signal Processing; SPE, Security; SEC
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

MPC8536BVJAQGA

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 (3)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

P87C51FC-4A,512

NXP

IC MCU 8BIT 32KB OTP 44PLCC

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: EBI/EMI, UART/USART
• Peripherals: POR, PWM
• Number of I/O: 32
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

package: 44-LCC (J-Lead)

MC68HC908QY4CDW

NXP

IC MCU 8BIT 4KB FLASH 16SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM
• Number of I/O: 13
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

package: 16-SOIC (0.295", 7.50mm Width)

MCF51EM128CLL

NXP

IC MCU 32BIT 128KB FLASH 100LQFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LCD, LVD, PWM, WDT
• Number of I/O: 63
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: 100-LQFP

SPC5602DF1VLH4

NXP

IC MCU 32BIT 256KB FLASH 64LQFP

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: CAN, LIN, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 45
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 16
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

PCKV857ADGG,512

NXP

IC CLK BUF DDR 250MHZ 1CIRC

• PLL: Yes
• Main Purpose: Memory, DDR, SDRAM
• Input: SSTL-2
• Output: SSTL-2
• Number of Circuits: 1
• Ratio - Input:Output: 1:10
• Differential - Input:Output: Yes/Yes
• Frequency - Max: 250MHz
• Voltage - Supply: 2.3 V ~ 2.7 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 48-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 48-TSSOP

package: 48-TFSOP (0.240", 6.10mm Width)

NCK2983AHN/T2CY

NXP

IC TRANSCEIVER 3CH 48HVQFN

• Type: TxRx + MCU
• RF Family/Standard: -
• Protocol: -
• Modulation: ASK, FSK
• Frequency: 315MHz, 433MHz, 868MHz, 915MHz
• Data Rate (Max): -
• Power - Output: -
• Sensitivity: -123dBm
• Memory Size: 32kB Flash, 4kB RAM
• Serial Interfaces: -
• GPIO: -
• Voltage - Supply: 2.1 V ~ 5.5 V
• Current - Receiving: 17mA
• Current - Transmitting: -
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 48-VFQFN Exposed Pad

package: 48-VFQFN Exposed Pad

JN5168/001,518

NXP

IC RF TXRX+MCU 802.15.4 40-VFQFN

• Type: TxRx + MCU
• RF Family/Standard: 802.15.4
• Protocol: ZigbeePRO?
• Modulation: O-QPSK
• Frequency: 2.4GHz
• Data Rate (Max): 1Mbps
• Power - Output: 2.5dBm
• Sensitivity: -96dBm
• Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
• Serial Interfaces: I2C, JTAG, SPI, UART
• GPIO: 20
• Voltage - Supply: 2 V ~ 3.6 V
• Current - Receiving: 17mA
• Current - Transmitting: 15.3mA
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 40-VFQFN Exposed Pad

package: 40-VFQFN Exposed Pad

OM7614/BGM1011

NXP

EVAL BOARD FOR BGM1011

• Type: Amplifier
• Frequency: 0Hz ~ 4GHz
• For Use With/Related Products: BGM1011
• Supplied Contents: Board

package: -

T2080NSE8T1B

NXP

QORIQ 64B POWER ARCH8X 1.8GHZ

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

package: -

LS1043ASE7MNLA

NXP

QORIQ 4XCPU 64-BIT ARM ARCH 1.

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

package: -

SPC5603BK0MLQ6

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 123
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 28K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 36x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

FS32R274KCK2MMM

NXP

NXP 32 BIT MCU 2M FLASH 1.5MB

• Core Processor: e200z4, e200z7 (2)
• Core Size: 32-Bit Tri-Core
• Speed: 180MHz, 240MHz
• Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire
• Peripherals: POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 1.5M x 8
• Voltage - Supply (Vcc/Vdd): 1.19 V ~ 5.5 V
• Data Converters: A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 257-LFBGA
• Supplier Device Package: 257-MAPBGA (14x14)

package: 257-LFBGA

S9S12GN16J1VTJ

NXP

IC MCU 16BIT 16KB FLASH 20TSSOP

• Core Processor: S12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 14
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

package: -

Request a Quote

SAF4000EL-101Z524Y

NXP

SAF4000EL

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

Request a Quote

LPC5514JBD100Y

NXP

IC MCU 32BIT 128KB FLSH 100HLQFP

• Core Processor: ARM® Cortex®-M33
• Core Size: 32-Bit Single-Core
• Speed: 150MHz
• Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
• Number of I/O: 64
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 80K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 10x16b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP Exposed Pad
• Supplier Device Package: 100-HLQFP (14x14)

package: -

Request a Quote

MIMX8MN3DUCJZAA

NXP

NANO SOLOLITE I.MX 8M LFBGA486

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

package: -

Request a Quote

LS1023ACE9PQB

NXP

LAYERSCAPE 64-BIT ARM CORTEX-A53

• Core Processor: ARM® Cortex®-A53
• Number of Cores/Bus Width: 2 Core, 64-Bit
• Speed: 1.4GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3L, DDR4
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1GbE (4), 2.5GbE (2), 10GbE (1)
• SATA: SATA 6Gbps (1)
• USB: USB 3.0 + PHY (3)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: ARM TZ, Boot Security
• Package / Case: 780-BFBGA, FCBGA
• Supplier Device Package: 780-FBGA (23x23)

package: -

Request a Quote

S912ZVL64AVLC

NXP

S12Z CPU, 64K FLASH

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

package: -

Request a Quote

MIMXRT106VDVL6B

NXP

IC MCU

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

TDA10028HN-C1-551

NXP

IC VIDEO SILICON TUNER

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

Request a Quote