Afbeelding |
Onderdeelnummer |
Fabrikant |
Omschrijving |
package |
Voorraad |
Aantal |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
SOLENOID CONTROLLER 6 64LQFP
|
package: - |
Voorraad6 |
|
- | 0V ~ 72V | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP Exposed Pad | 64-HLQFP (10x10) |
||
NXP |
SYSTEM BASIS CHIP, LINEAR 0.5A V
|
package: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |
||
NXP |
POWER MANAGEMENT IC, I.MX 8DX/DX
|
package: - |
Request a Quote |
|
10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 48-VFQFN Exposed Pad | 48-HVQFN (7x7) |
||
NXP |
PMIC FOR I.MX8M MINI 845S 56HVQF
|
package: - |
Voorraad7.872 |
|
23µA | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (7x7) |
||
NXP |
POWER MANAGEMENT IC, I.MX8, PRE-
|
package: - |
Request a Quote |
|
10µA | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
SAFETY SYSTEM BASIS CHIP FOR DOM
|
package: - |
Request a Quote |
|
- | 36V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 48-VFQFN Exposed Pad | 48-HVQFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX8 NON-PR
|
package: - |
Request a Quote |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
SAFETY POWER MANAGEMENT IC, QFN5
|
package: - |
Request a Quote |
|
15mA | 60V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
SYSTEM BASIS CHIP, DCDC 0.8A VCO
|
package: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |
||
NXP |
MWCT2D17S,MAXQFP172
|
package: - |
Request a Quote |
|
- | - | - | - | - | - |
||
NXP |
SAFETY SYSTEM BASIS CHIP FOR DOM
|
package: - |
Request a Quote |
|
- | 60V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 48-VFQFN Exposed Pad | 48-HVQFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX8 PRE-PR
|
package: - |
Request a Quote |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
SYSTEM BASIS CHIP, DCDC 0.8A VCO
|
package: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP, LINEAR 0.5A V
|
package: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |
||
NXP |
POWER MANAGEMENT IC, PRE-PROG, 3
|
package: - |
Request a Quote |
|
- | - | - | Surface Mount, Wettable Flank | 32-PowerWFQFN | 32-HWQFN (5x5) |
||
NXP |
SYSTEM BASIS CHIP, LINEAR 0.5A V
|
package: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |
||
NXP |
IC
|
package: - |
Request a Quote |
|
- | 5.5V ~ 40V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 48-VFQFN Exposed Pad | 48-HVQFN (7x7) |
||
NXP |
SYSTEM BASIS CHIP, DCDC 0.8A VCO
|
package: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP, LINEAR 0.5A V
|
package: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |
||
NXP |
SAFETY SYSTEM BASIS CHIP WITH LO
|
package: - |
Request a Quote |
|
- | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
SYSTEM BASIS CHIP, LINEAR 0.5A V
|
package: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |
||
NXP |
IC FS86 SYSTEM BASIS CHIP ASIL
|
package: - |
Request a Quote |
|
- | 4.5V ~ 36V | -40°C ~ 125°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
NXP |
SYSTEM BASIS CHIP, LINEAR 0.5A V
|
package: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |
||
NXP |
AUTOQI WIRELESS CHARGING
|
package: - |
Request a Quote |
|
- | - | - | - | - | - |
||
NXP |
POWER MANAGEMENT IC I.MX8 PRE-PR
|
package: - |
Request a Quote |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
PMIC 3 BUCKS 2 LDO A1 DIE
|
package: - |
Request a Quote |
|
- | 3.3V ~ 5.25V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 40-PowerVFQFN | 40-HVQFN (6x6) |
||
NXP |
POWER MANAGEMENT IC, PRE-PROG, 3
|
package: - |
Voorraad954 |
|
10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 40-VFQFN Exposed Pad | 40-HVQFN (6x6) |
||
NXP |
POWER MANAGEMENT IC I.MX8 PRE-PR
|
package: - |
Request a Quote |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |