Microchip Technology Producten

DSC1121AI2-024.5760T

Microchip Technology

OSC MEMS 24.5760MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 24.576MHz
• Function: Enable/Disable
• Output: CMOS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 35mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead, Exposed Pad
• Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 6-SMD, No Lead, Exposed Pad

DSC1103AE1-212.5000T

Microchip Technology

OSC MEMS 212.5MHZ LVDS SMD

• Type: MEMS (Silicon)
• Frequency: 212.5MHz
• Function: Standby (Power Down)
• Output: LVDS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±50ppm
• Operating Temperature: -20°C ~ 70°C
• Current - Supply (Max): 32mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead, Exposed Pad
• Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 6-SMD, No Lead, Exposed Pad

DSC1001DI1-025.0000T

Microchip Technology

OSC MEMS 25.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 25MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 4-SMD, No Lead

DSC1123BI2-100.0000

Microchip Technology

OSC MEMS 100.000MHZ LVDS SMD

• Type: MEMS (Silicon)
• Frequency: 100MHz
• Function: Enable/Disable
• Output: LVDS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 32mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 6-SMD, No Lead

MCP1827S-2502E/AB

Microchip Technology

IC REG LINEAR 2.5V 1.5A TO220-3

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 6V
• Voltage - Output (Min/Fixed): 2.5V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.6V @ 1.5A
• Current - Output: 1.5A
• Current - Quiescent (Iq): -
• Current - Supply (Max): 220µA
• PSRR: 60dB (100Hz)
• Control Features: -
• Protection Features: Over Temperature, Short Circuit, Under Voltage Lockout (UVLO)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: TO-220-3
• Supplier Device Package: TO-220-3

package: TO-220-3

TC1303B-ZA0EUNTR

Microchip Technology

IC REG DL BCK/LINEAR SYNC 10MSOP

• Topology: Step-Down (Buck) Synchronous (1), Linear (LDO) (1)
• Function: Any Function
• Number of Outputs: 2
• Frequency - Switching: 2MHz
• Voltage/Current - Output 1: Adj, 500mA
• Voltage/Current - Output 2: 3.3V, 300mA
• Voltage/Current - Output 3: -
• w/LED Driver: No
• w/Supervisor: No
• w/Sequencer: Yes
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 10-MSOP

package: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)

MCP101-475DI/TO

Microchip Technology

IC SUPERVISOR 4.75V HIGH TO92

• Type: Simple Reset/Power-On Reset
• Number of Voltages Monitored: 1
• Output: Push-Pull, Totem Pole
• Reset: Active High
• Reset Timeout: 150 ms Minimum
• Voltage - Threshold: 4.625V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA)
• Supplier Device Package: TO-92-3

package: TO-226-3, TO-92-3 (TO-226AA)

MCP120T-450I/TT

Microchip Technology

IC SUPRVSR 4.50V OPN DRAIN SOT23

• Type: Simple Reset/Power-On Reset
• Number of Voltages Monitored: 1
• Output: Open Drain or Open Collector
• Reset: Active Low
• Reset Timeout: 150 ms Minimum
• Voltage - Threshold: 4.375V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SOT-23-3

package: TO-236-3, SC-59, SOT-23-3

TC4467COE713

Microchip Technology

IC MOSFET DVR QUAD NAND 16SOIC

• Driven Configuration: Low-Side
• Channel Type: Independent
• Number of Drivers: 4
• Gate Type: N-Channel, P-Channel MOSFET
• Voltage - Supply: 4.5 V ~ 18 V
• Logic Voltage - VIL, VIH: 0.8V, 2.4V
• Current - Peak Output (Source, Sink): 1.2A, 1.2A
• Input Type: Inverting
• High Side Voltage - Max (Bootstrap): -
• Rise / Fall Time (Typ): 15ns, 15ns
• Operating Temperature: 0°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

package: 16-SOIC (0.295", 7.50mm Width)

KSZ8794CNXIC

Microchip Technology

IC CONTROLLER ETHERNET 64QFN

• Protocol: Ethernet
• Function: Controller
• Interface: MII, RMII
• Standards: 10/100 Base-T/TX PHY
• Voltage - Supply: 3.3V
• Current - Supply: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-QFN (8x8)

package: 64-VFQFN Exposed Pad

PIC24EP32MC204T-E/PT

Microchip Technology

IC MCU 16BIT 32KB FLASH 44TQFP

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 60 MIPs
• Connectivity: I2C, IrDA, LIN, QEI, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 32KB (10.7K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 16
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 9x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

package: 44-TQFP

PIC18F452-E/PT

Microchip Technology

IC MCU 8BIT 32KB FLASH 44TQFP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number of I/O: 34
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 1.5K x 8
• Voltage - Supply (Vcc/Vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

package: 44-TQFP

AT32UC3C064C-ALUR

Microchip Technology

IC MCU 32BIT 64KB FLASH 144LQFP

• Core Processor: AVR
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 123
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16x12b, D/A 4x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

PIC18F4523-E/PT

Microchip Technology

IC MCU 8BIT 32KB FLASH 44TQFP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number of I/O: 36
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 1.5K x 8
• Voltage - Supply (Vcc/Vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 13x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

package: 44-TQFP

PIC16LF1783-I/SS

Microchip Technology

IC MCU 8BIT 7KB FLASH 28SSOP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PSMC, PWM, WDT
• Number of I/O: 24
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 11x12b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP

package: 28-SSOP (0.209", 5.30mm Width)

ATMEGA1284-MU

Microchip Technology

IC MCU 8BIT 128KB FLASH 44VQFN

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 32
• Program Memory Size: 128KB (64K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-VFQFN Exposed Pad
• Supplier Device Package: 44-VQFN (7x7)

package: 44-VFQFN Exposed Pad

VSC7421XJQ-02

Microchip Technology

IC ETHERNET SWITCH 302TQFP

• Function: Ethernet Switch
• Interface: Serial
• Number of Circuits: 1
• Voltage - Supply: 1V
• Current - Supply: -
• Power (Watts): -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: -
• Supplier Device Package: 302-TQFP (24x24)

package: -

ATSAML11D16A-MF

Microchip Technology

IC MCU 32BIT 64KB FLASH 24VQFN

• Core Processor: ARM® Cortex®-M23
• Core Size: 32-Bit
• Speed: 32MHz
• Connectivity: I²C, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 17
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.62 V ~ 3.63 V
• Data Converters: A/D 5x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-VQFN (4x4)

package: 24-VFQFN Exposed Pad

PAC1952T-2E-J6CX

Microchip Technology

IC CURRENT/VOLT MON 1% 16WLCSP

• Function: Current/Voltage Monitor
• Sensing Method: Low-Side
• Accuracy: ±1%
• Voltage - Input: 2.7V ~ 5.5V
• Current - Output: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-WFBGA, WLCSP
• Supplier Device Package: 16-WLCSP (2.23x2.17)

package: -

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JANHCA1N4105C

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 11 V
• Tolerance: ±2%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 200 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 8.44 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

package: -

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LAN9696RED-V-3KW

Microchip Technology

66G INDUSTRIAL ETHERNET SWITCH

• Protocol: Ethernet
• Function: Switch
• Interface: SGMII
• Standards: -
• Voltage - Supply: 0.9V
• Current - Supply: -
• Operating Temperature: -40°C ~ 110°C (TJ)
• Package / Case: 356-LFBGA, FCCSPBGA
• Supplier Device Package: 356-FCCSP (17x17)

package: -

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JANTXV1N6319DUS-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 6.2 V
• Tolerance: ±1%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 3 Ohms
• Current - Reverse Leakage @ Vr: 5 µA @ 3.5 V
• Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, B
• Supplier Device Package: B, SQ-MELF

package: -

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JAN1N938BUR-1

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 9 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 20 Ohms
• Current - Reverse Leakage @ Vr: 10 µA @ 6 V
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: DO-213AA (Glass)
• Supplier Device Package: DO-213AA

package: -

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JAN1N7051-1-TR

Microchip Technology

DIODE ZENER 4.8V 250MW DO35

• Voltage - Zener (Nom) (Vz): 4.8 V
• Tolerance: ±10%
• Power - Max: 250 mW
• Impedance (Max) (Zzt): 35 Ohms
• Current - Reverse Leakage @ Vr: 5 µA @ 1.5 V
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

package: -

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PM40068B1-FEI

Microchip Technology

IC PFX 68XG4, 68-LANE PCIE SWITC

• Applications: -
• Interface: -
• Voltage - Supply: -
• Package / Case: -
• Supplier Device Package: -
• Mounting Type: -

package: -

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MPL4700-206-TR

Microchip Technology

SI LIMITER NON HERMETIC MMSM

• Diode Type: PIN - Single
• Voltage - Peak Reverse (Max): 25V
• Current - Max: -
• Capacitance @ Vr, F: 0.15pF @ 10V, 1MHz
• Resistance @ If, F: 2Ohm @ 10mA, 1GHz
• Power Dissipation (Max): 10 W
• Operating Temperature: -55°C ~ 150°C
• Package / Case: 0402 (1005 Metric)
• Supplier Device Package: 0402

package: -

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JAN2N2369AUA-TR

Microchip Technology

TRANS NPN 15V TO18

• Transistor Type: NPN
• Current - Collector (Ic) (Max): -
• Voltage - Collector Emitter Breakdown (Max): 15 V
• Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA
• Current - Collector Cutoff (Max): 400nA
• DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 100mA, 1V
• Power - Max: 360 mW
• Frequency - Transition: -
• Operating Temperature: -65°C ~ 200°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-206AA, TO-18-3 Metal Can
• Supplier Device Package: TO-18 (TO-206AA)

package: -

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JANTXV1N6638US

Microchip Technology

DIODE GP 125V 300MA B SQ-MELF

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 125 V
• Current - Average Rectified (Io): 300mA
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 4.5 ns
• Current - Reverse Leakage @ Vr: -
• Capacitance @ Vr, F: -
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, B
• Supplier Device Package: B, SQ-MELF
• Operating Temperature - Junction: -65°C ~ 175°C

package: -

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