Microchip Technology Producten

DSC1001CL1-024.5760

Microchip Technology

OSC MEMS 24.5760MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 24.576MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 105°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 4-SMD, No Lead

DSC1103NI1-074.2500T

Microchip Technology

OSC MEMS 74.25MHZ LVDS SMD

• Type: MEMS (Silicon)
• Frequency: 74.25MHz
• Function: Standby (Power Down)
• Output: LVDS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 32mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 6-SMD, No Lead

DSC1001CL5-014.3181T

Microchip Technology

OSC MEMS 14.3181MHZ CMOS SMT

• Type: MEMS (Silicon)
• Frequency: 14.3181MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±10ppm
• Operating Temperature: -40°C ~ 105°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 4-SMD, No Lead

MIC5310-OOYML-TR

Microchip Technology

IC REG LIN 2.9V/2.9V 8MLF

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 2
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 2.9V, 2.9V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.1V @ 150mA, 0.1V @ 150mA
• Current - Output: 150mA, 150mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 120µA ~ 190µA
• PSRR: 70dB ~ 65dB (1kHz ~ 20kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-VFDFN Exposed Pad, 8-MLF?
• Supplier Device Package: 8-MLF? (2x2)

package: 8-VFDFN Exposed Pad, 8-MLF?

MIC2583R-LBQS-TR

Microchip Technology

IC CTRLR HOT SWAP 150MV 16-QSOP

• Type: Hot Swap Controller
• Number of Channels: 1
• Internal Switch(s): No
• Applications: General Purpose
• Features: Auto Retry
• Programmable Features: Fault Timeout, Slew Rate, UVLO
• Voltage - Supply: 2.3 V ~ 13.2 V
• Current - Output (Max): -
• Operating Temperature: -40°C ~ 85°C
• Current - Supply: 1.5mA
• Mounting Type: Surface Mount
• Package / Case: 16-SSOP (0.154", 3.90mm Width)
• Supplier Device Package: 16-QSOP

package: 16-SSOP (0.154", 3.90mm Width)

MCP73831T-2DCI/MC

Microchip Technology

IC CONTROLLER LI-ION 4.2V 8DFN

• Battery Chemistry: Lithium-Ion/Polymer
• Number of Cells: 1
• Current - Charging: Constant - Programmable
• Programmable Features: Current
• Fault Protection: Over Voltage
• Charge Current - Max: 500mA
• Battery Pack Voltage: 4.2V
• Voltage - Supply (Max): 6V
• Interface: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 8-VFDFN Exposed Pad
• Supplier Device Package: 8-DFN (2x3)

package: 8-VFDFN Exposed Pad

ATA6560-GAQW

Microchip Technology

IC TXRX CAN NSIL 8SO

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: -
• Receiver Hysteresis: 120mV
• Data Rate: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

package: 8-SOIC (0.154", 3.90mm Width)

PIC16C72-04I/SS

Microchip Technology

IC MCU 8BIT 3.5KB OTP 28SSOP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: I2C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 22
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 4 V ~ 6 V
• Data Converters: A/D 5x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP

package: 28-SSOP (0.209", 5.30mm Width)

PIC18LF4450-I/ML

Microchip Technology

IC MCU 8BIT 16KB FLASH 44QFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: UART/USART, USB
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number of I/O: 34
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 768 x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 5.5 V
• Data Converters: A/D 13x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-VQFN Exposed Pad
• Supplier Device Package: 44-QFN (8x8)

package: 44-VQFN Exposed Pad

PIC16F1786T-I/ML

Microchip Technology

IC MCU 8BIT 14KB FLASH 28QFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PSMC, PWM, WDT
• Number of I/O: 24
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 11x12b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-VQFN Exposed Pad
• Supplier Device Package: 28-QFN (6x6)

package: 28-VQFN Exposed Pad

PIC16F505T-I/MG

Microchip Technology

IC MCU 8BIT 1.5KB FLASH 16QFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: -
• Peripherals: POR, WDT
• Number of I/O: 11
• Program Memory Size: 1.5KB (1K x 12)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 72 x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-VFQFN Exposed Pad
• Supplier Device Package: 16-QFN-EP (3x3)

package: 16-VFQFN Exposed Pad

DSPIC30F2020-30I/SO

Microchip Technology

IC MCU 16BIT 12KB FLASH 28SOIC

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 21
• Program Memory Size: 12KB (4K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

package: 28-SOIC (0.295", 7.50mm Width)

AT89S2051-24PU

Microchip Technology

IC MCU 8BIT 2KB FLASH 20DIP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 24MHz
• Connectivity: UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM
• Number of I/O: 15
• Program Memory Size: 2KB (2K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-DIP (0.300", 7.62mm)
• Supplier Device Package: 20-PDIP

package: 20-DIP (0.300", 7.62mm)

PIC18F2525-I/SP

Microchip Technology

IC MCU 8BIT 48KB FLASH 28SDIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 48KB (24K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 3.8K x 8
• Voltage - Supply (Vcc/Vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-DIP (0.300", 7.62mm)
• Supplier Device Package: 28-SPDIP

package: 28-DIP (0.300", 7.62mm)

AT40K20-2FQC

Microchip Technology

IC FPGA 20K GATES 304PQFP

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: 1024
• Total RAM Bits: 8192
• Number of I/O: 256
• Number of Gates: 30000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 304-BFQFP
• Supplier Device Package: 304-PQFP (40x40)

package: 304-BFQFP

MCP79521T-I/MN

Microchip Technology

IC RTC CLK/CALENDAR SPI 10-TDFN

• Type: Clock/Calendar
• Features: Alarm, EEPROM, Leap Year, Square Wave Output, SRAM, Unique ID
• Memory Size: 64B
• Time Format: HH:MM:SS:hh (12/24 hr)
• Date Format: YY-MM-DD-dd
• Interface: SPI
• Voltage - Supply: 1.8 V ~ 3.6 V
• Voltage - Supply, Battery: 1.3 V ~ 3.6 V
• Current - Timekeeping (Max): 1µA @ 1.8V ~ 3.6V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-WFDFN Exposed Pad
• Supplier Device Package: 10-TDFN (3x3)

package: 10-WFDFN Exposed Pad

EMC1403-2-YZT-TR

Microchip Technology

SENSOR TEMPERATURE SMBUS 14SOIC

• Sensor Type: Digital, Local/Remote
• Sensing Temperature - Local: -40°C ~ 125°C
• Sensing Temperature - Remote: -64°C ~ 191°C
• Output Type: SMBus
• Voltage - Supply: 3 V ~ 3.6 V
• Resolution: 11 b
• Features: One-Shot, Output Switch, Programmable Limit, Standby Mode
• Accuracy - Highest (Lowest): ±1°C (±2°C)
• Test Condition: -5°C ~ 100°C (-40°C ~ 125°C)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SOIC

package: 14-SOIC (0.154", 3.90mm Width)

PM5370-FGI

Microchip Technology

40G VT/TU SWITCHING ELEMENT

• Function: SONET/SDH
• Interface: Serial
• Number of Circuits: -
• Voltage - Supply: 1.2V
• Current - Supply: -
• Power (Watts): -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: -
• Supplier Device Package: 672-FCBGA (27x27)

package: -

1N4945

Microchip Technology

UFR,FRR

• Diode Type: -
• Voltage - DC Reverse (Vr) (Max): -
• Current - Average Rectified (Io): -
• Voltage - Forward (Vf) (Max) @ If: -
• Speed: -
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: -
• Capacitance @ Vr, F: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -
• Operating Temperature - Junction: -

package: -

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JANTXV1N4494DUS-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 160 V
• Tolerance: ±1%
• Power - Max: 1.5 W
• Impedance (Max) (Zzt): 1000 Ohms
• Current - Reverse Leakage @ Vr: 250 nA @ 128 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, A
• Supplier Device Package: D-5A

package: -

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S30410

Microchip Technology

DIODE GEN PURP 100V 40A DO5

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 100 V
• Current - Average Rectified (Io): 40A
• Voltage - Forward (Vf) (Max) @ If: 1.19 V @ 90 A
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 5 µs
• Current - Reverse Leakage @ Vr: 40 µA @ 100 V
• Capacitance @ Vr, F: -
• Mounting Type: Stud Mount
• Package / Case: DO-203AB, DO-5, Stud
• Supplier Device Package: DO-5 (DO-203AB)
• Operating Temperature - Junction: -65°C ~ 200°C

package: -

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1N959B-1

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 8.2 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 6.5 Ohms
• Current - Reverse Leakage @ Vr: 50 µA @ 6.2 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

package: -

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MPV1965-206-TR

Microchip Technology

SI TVAR NON HERMETIC MMSM

• Capacitance @ Vr, F: 3.8pF @ 1V, 1MHz
• Capacitance Ratio: 3.6
• Capacitance Ratio Condition: C1/C6
• Voltage - Peak Reverse (Max): 15 V
• Diode Type: Single
• Q @ Vr, F: 1500 @ 4V, 50MHz
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 0402 (1005 Metric)
• Supplier Device Package: 0402

package: -

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1N5226A

Microchip Technology

DIODE ZENER

• Voltage - Zener (Nom) (Vz): 3.3 V
• Tolerance: ±10%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 28 Ohms
• Current - Reverse Leakage @ Vr: 25 µA @ 950 mV
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

package: -

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JANS1N4116C-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 24 V
• Tolerance: ±2%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 150 Ohms
• Current - Reverse Leakage @ Vr: 10 nA @ 18.3 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

package: -

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JANTXV1N3595US

Microchip Technology

DIODE GEN PURP 125V 4A B SQ-MELF

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 125 V
• Current - Average Rectified (Io): 4A
• Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 3 µs
• Current - Reverse Leakage @ Vr: -
• Capacitance @ Vr, F: -
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, B
• Supplier Device Package: B, SQ-MELF
• Operating Temperature - Junction: -65°C ~ 150°C

package: -

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JANTX1N4966-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 22 V
• Tolerance: ±5%
• Power - Max: 5 W
• Impedance (Max) (Zzt): 5 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 16.7 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: E, Axial
• Supplier Device Package: -

package: -

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1N6764R

Microchip Technology

DIODE GEN PURP 150V 12A TO254

• Diode Type: Standard, Reverse Polarity
• Voltage - DC Reverse (Vr) (Max): 150 V
• Current - Average Rectified (Io): 12A
• Voltage - Forward (Vf) (Max) @ If: 1.05 V @ 12 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 35 ns
• Current - Reverse Leakage @ Vr: 10 µA @ 150 V
• Capacitance @ Vr, F: 300pF @ 5V, 1MHz
• Mounting Type: Through Hole
• Package / Case: TO-254-3, TO-254AA
• Supplier Device Package: TO-254
• Operating Temperature - Junction: -55°C ~ 175°C

package: -

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