Microchip Technology Producten

DSC1101AE5-007.6800T

Microchip Technology

OSC MEMS 7.68MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 7.68MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±10ppm
• Operating Temperature: -20°C ~ 70°C
• Current - Supply (Max): 35mA
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead, Exposed Pad
• Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

package: 6-SMD, No Lead, Exposed Pad

MCP1317T-31AE/OT

Microchip Technology

IC SUPERVISOR 3.1V SOT23-5

• Type: Simple Reset/Power-On Reset
• Number of Voltages Monitored: 1
• Output: Push-Pull, Totem Pole
• Reset: Active High
• Reset Timeout: 1 ms Minimum
• Voltage - Threshold: 3.1V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: SC-74A, SOT-753
• Supplier Device Package: SOT-23-5

package: SC-74A, SOT-753

AT73C240

Microchip Technology

IC POWER MANAGEMENT PMAAC 32QFN

• Applications: Handheld/Mobile Devices
• Current - Supply: 6mA
• Voltage - Supply: 3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-VQFN (5x5)

package: 32-VFQFN Exposed Pad

U2008B-MFPG3Y

Microchip Technology

IC MOTOR CNTRL ON/OFF 8SO

• Motor Type - Stepper: -
• Motor Type - AC, DC: AC, Induction
• Function: Triac Controller
• Output Configuration: Pre-Driver - Triac
• Interface: On/Off
• Technology: Bipolar
• Step Resolution: -
• Applications: General Purpose
• Current - Output: -
• Voltage - Supply: 14.5 V ~ 16.8 V
• Voltage - Load: -
• Operating Temperature: -10°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

package: 8-SOIC (0.154", 3.90mm Width)

AT25020B-SSHL-B

Microchip Technology

IC EEPROM 2KBIT 20MHZ 8SOIC

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 2Kb (256 x 8)
• Memory Interface: SPI
• Clock Frequency: 20MHz
• Write Cycle Time - Word, Page: 5ms
• Access Time: -
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

package: 8-SOIC (0.154", 3.90mm Width)

AT24C512C1-10CU-2.7

Microchip Technology

IC EEPROM 512KBIT 1MHZ 8LAP

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 512Kb (64K x 8)
• Memory Interface: I2C
• Clock Frequency: 1MHz
• Write Cycle Time - Word, Page: 10ms
• Access Time: 550ns
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-TDFN
• Supplier Device Package: 8-LAP

package: 8-TDFN

AT45D041A-RI

Microchip Technology

IC FLASH 4MBIT 15MHZ 28SOIC

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH
• Memory Size: 4Mb (264 Bytes x 2048 pages)
• Memory Interface: SPI
• Clock Frequency: 15MHz
• Write Cycle Time - Word, Page: 14ms
• Access Time: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TC)
• Mounting Type: Surface Mount
• Package / Case: 28-SOIC (0.342", 8.69mm Width)
• Supplier Device Package: 28-SOIC

package: 28-SOIC (0.342", 8.69mm Width)

MIC2012ZM-TR

Microchip Technology

IC USB PWR CTRLR DUAL 8-SOIC

• Protocol: USB
• Function: Controller
• Interface: -
• Standards: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Supply: 16µA
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

package: 8-SOIC (0.154", 3.90mm Width)

DSPIC33EP64MC202T-E/MM

Microchip Technology

IC MCU 16BIT 64KB FLASH 28QFN

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 60 MIPs
• Connectivity: I2C, IrDA, LIN, QEI, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 21
• Program Memory Size: 64KB (22K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 16
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-VQFN Exposed Pad
• Supplier Device Package: 28-QFN-S (6x6)

package: 28-VQFN Exposed Pad

PIC16C65B-20E/P

Microchip Technology

IC MCU 8BIT 7KB OTP 40DIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 33
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 192 x 8
• Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 40-DIP (0.600", 15.24mm)
• Supplier Device Package: 40-PDIP

package: 40-DIP (0.600", 15.24mm)

PIC16C57-HSE/SP

Microchip Technology

IC MCU 8BIT 3KB OTP 28SDIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: -
• Peripherals: POR, WDT
• Number of I/O: 20
• Program Memory Size: 3KB (2K x 12)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 72 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-DIP (0.300", 7.62mm)
• Supplier Device Package: 28-SPDIP

package: 28-DIP (0.300", 7.62mm)

ATSAM4LS8BA-AUR

Microchip Technology

IC MCU 32BIT 512KB FLASH 64TQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 48
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.68 V ~ 3.6 V
• Data Converters: A/D 7x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP (10x10)

package: 64-TQFP

PIC18LF26K22-E/SS

Microchip Technology

IC MCU 8BIT 64KB FLASH 28SSOP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number of I/O: 24
• Program Memory Size: 64KB (32K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 3.8K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 19x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP

package: 28-SSOP (0.209", 5.30mm Width)

PIC18LF24K22-E/SP

Microchip Technology

IC MCU 8BIT 16KB FLASH 28SDIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number of I/O: 24
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 768 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 19x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-DIP (0.300", 7.62mm)
• Supplier Device Package: 28-SPDIP

package: 28-DIP (0.300", 7.62mm)

PIC16F689-E/ML

Microchip Technology

IC MCU 8BIT 7KB FLASH 20QFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 18
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 20-VFQFN Exposed Pad
• Supplier Device Package: 20-QFN (4x4)

package: 20-VFQFN Exposed Pad

PIC32MZ2025DAH176-I/2J

Microchip Technology

IC MCU 32BIT 2MB FLASH

• Core Processor: MIPS32? microAptiv?
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, PMP, SPI, SQI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
• Number of I/O: 120
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 1.7 V ~ 3.6 V
• Data Converters: A/D 45x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP Exposed Pad
• Supplier Device Package: 176-LQFP (20x20)

package: 176-LQFP Exposed Pad

SCH5627P-NS

Microchip Technology

DESKTOP EMBEDDED CTRLR 128QFP

• Applications: -
• Core Processor: -
• Program Memory Type: -
• Controller Series: -
• RAM Size: -
• Interface: -
• Number of I/O: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

PL560-47QC

Microchip Technology

IC VCXO AFM 2X MULTIPLIER CLOCK

• Type: -
• PLL: No
• Input: Crystal
• Output: LVCMOS, LVTTL
• Number of Circuits: 1
• Ratio - Input:Output: 1:1
• Differential - Input:Output: No/No
• Frequency - Max: 160MHz
• Divider/Multiplier: No/Yes
• Voltage - Supply: 2.97 V ~ 3.63 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 16-WFQFN Exposed Pad
• Supplier Device Package: 16-QFN (3x3)

package: 16-WFQFN Exposed Pad

ATSAMD21E16C-UUT

Microchip Technology

35WLCSP,85C TEMP, GREEN, 48MHZ,

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I²C, LINbus, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number of I/O: 26
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.62 V ~ 3.6 V
• Data Converters: A/D 10x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 35-XFBGA, WLCSP
• Supplier Device Package: 35-WLCSP (2.82x2.53)

package: 35-XFBGA, WLCSP

PIC16F19185-E/PT

Microchip Technology

FLASH RAM

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I²C, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT
• Number of I/O: 43
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 39x12b, D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-TQFP
• Supplier Device Package: 48-TQFP (7x7)

package: 48-TQFP

2N3250AUB-TR

Microchip Technology

SMALL-SIGNAL BJT

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 200 mA
• Voltage - Collector Emitter Breakdown (Max): 60 V
• Vce Saturation (Max) @ Ib, Ic: 500mV @ 5mA, 50mA
• Current - Collector Cutoff (Max): 20nA
• DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 1V
• Power - Max: 360 mW
• Frequency - Transition: -
• Operating Temperature: -65°C ~ 200°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 3-SMD, No Lead
• Supplier Device Package: UB

package: -

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DSPIC33EDV64MC205T-E-M7

Microchip Technology

IC MCU 16BIT 64KB FLASH 48VQFN

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: 64KB (22K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 5.5V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-QFN
• Supplier Device Package: 48-VQFN (6x6)

package: -

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JAN1N990DUR-1

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 160 V
• Tolerance: ±1%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 1700 Ohms
• Current - Reverse Leakage @ Vr: 500 nA @ 122 V
• Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: DO-213AA (Glass)
• Supplier Device Package: DO-213AA

package: -

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CD4708

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 22 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): -
• Current - Reverse Leakage @ Vr: 10 nA @ 16.7 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

package: -

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JANS1N4972CUS

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): -
• Tolerance: -
• Power - Max: -
• Impedance (Max) (Zzt): -
• Current - Reverse Leakage @ Vr: -
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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JANTX1N6661US-TR

Microchip Technology

DIODE GEN PURP 225V 500MA D-5A

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 225 V
• Current - Average Rectified (Io): 500mA
• Voltage - Forward (Vf) (Max) @ If: 1 V @ 400 mA
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 50 nA @ 225 V
• Capacitance @ Vr, F: -
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, A
• Supplier Device Package: D-5A
• Operating Temperature - Junction: -65°C ~ 175°C

package: -

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JANS1N4626DUR-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 5.6 V
• Tolerance: ±1%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 1.4 Ohms
• Current - Reverse Leakage @ Vr: 5 µA @ 4 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: DO-213AA (Glass)
• Supplier Device Package: DO-213AA

package: -

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1N6536-TR

Microchip Technology

DIODE GP REV 400V 1A A AXIAL

• Diode Type: Standard, Reverse Polarity
• Voltage - DC Reverse (Vr) (Max): 400 V
• Current - Average Rectified (Io): 1A
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 30 ns
• Current - Reverse Leakage @ Vr: 10 µA @ 400 V
• Capacitance @ Vr, F: -
• Mounting Type: Through Hole
• Package / Case: A, Axial
• Supplier Device Package: A, Axial
• Operating Temperature - Junction: -

package: -

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