Logic Producten

CENPXA270-HLR01-0708R-A

Logic

CARD ENGINE 64MB SDRAM

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

package: -

SOMDM3730-31-2880AKXR

Logic

SOM TORPEDO WIRELESS DM3730 1GHZ

• Module/Board Type: MPU, DSP Core
• Core Processor: ARM? Cortex?-A8, DM3730
• Co-Processor: TMS320C64x (DSP)
• Speed: 1GHz
• Flash Size: 512MB
• RAM Size: 512MB
• Connector Type: Board-to-Board (BTB) Socket - 200
• Size / Dimension: 0.59" x 1.3" (15mm x 33mm)
• Operating Temperature: -40°C ~ 70°C

package: -

SOMDM3730-30-2780AKCR

Logic

SYSTEM ON MODULE TORP+ DM3730

• Module/Board Type: MPU, DSP Core
• Core Processor: ARM? Cortex?-A8, DM3730
• Co-Processor: TMS320C64x (DSP)
• Speed: 1GHz
• Flash Size: 512MB
• RAM Size: 256MB
• Connector Type: Board-to-Board (BTB) Socket - 200
• Size / Dimension: 0.59" x 1.3" (15mm x 33mm)
• Operating Temperature: 0°C ~ 70°C

package: -

SOMOMAP3530-11-1670EFCR

Logic

SYSTEM ON MODULE LV OMAP3530

• Module/Board Type: MPU, DSP Core
• Core Processor: ARM? Cortex?-A8, OMAP3530
• Co-Processor: TMS320C64x (DSP)
• Speed: 600MHz
• Flash Size: 256MB
• RAM Size: 128MB
• Connector Type: Board-to-Board (BTB) Socket - 240
• Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm)
• Operating Temperature: 0°C ~ 70°C

package: -

SOMOMAP3503-21-1670AGCR

Logic

SYSTEM ON MODULE LV OMAP3503

• Module/Board Type: MPU Core
• Core Processor: ARM? Cortex?-A8, OMAP3503
• Co-Processor: -
• Speed: 600MHz
• Flash Size: 256MB
• RAM Size: 128MB
• Connector Type: Board-to-Board (BTB) Socket - 200
• Size / Dimension: 0.59" x 1.06" (15mm x 27mm)
• Operating Temperature: 0°C ~ 70°C

package: -

SOMOMAP3503-11-1672IFCR

Logic

SYSTEM ON MODULE LV OMAP3503

• Module/Board Type: MPU Core
• Core Processor: ARM? Cortex?-A8, OMAP3503
• Co-Processor: -
• Speed: 600MHz
• Flash Size: 256MB (NAND), 8MB (NOR)
• RAM Size: 128MB
• Connector Type: Board-to-Board (BTB) Socket - 240
• Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm)
• Operating Temperature: 0°C ~ 70°C

package: -

SOMOMAP3530-21-1670AGCR

Logic

SYSTEM ON MODULE LV OMAP3530

• Module/Board Type: MPU Core
• Core Processor: ARM? Cortex?-A8, OMAP3530
• Co-Processor: -
• Speed: 600MHz
• Flash Size: 256MB
• RAM Size: 128MB
• Connector Type: Board-to-Board (BTB) Socket - 200
• Size / Dimension: 0.59" x 1.06" (15mm x 27mm)
• Operating Temperature: 0°C ~ 70°C

package: -

SOMOMAP3530-20-1670AGIR

Logic

SYSTEM ON MODULE LV OMAP3530

• Module/Board Type: MPU Core
• Core Processor: ARM? Cortex?-A8, OMAP3530
• Co-Processor: -
• Speed: 600MHz
• Flash Size: 256MB
• RAM Size: 128MB
• Connector Type: Board-to-Board (BTB) Socket - 200
• Size / Dimension: 0.59" x 1.06" (15mm x 27mm)
• Operating Temperature: -40°C ~ 85°C

package: -

SOMOMAP3530-10-1670EFCR

Logic

SYSTEM ON MODULE LV OMAP3530

• Module/Board Type: MPU Core
• Core Processor: ARM? Cortex?-A8, OMAP3503
• Co-Processor: -
• Speed: 600MHz
• Flash Size: 256MB
• RAM Size: 128MB
• Connector Type: Board-to-Board (BTB) Socket - 480
• Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm)
• Operating Temperature: 0°C ~ 70°C

package: -

COMMPC8360-10-1652LCR

Logic

KIT 128MB DDR 8MB NOR 64MB NAND

• Module/Board Type: MPU Core
• Core Processor: PowerQUICC, MPC8360
• Co-Processor: -
• Speed: 400MHz
• Flash Size: 64MB (NAND), 8MB (NOR)
• RAM Size: 128KB
• Connector Type: -
• Size / Dimension: 3.74" x 3.74" (95mm x 95mm)
• Operating Temperature: 0°C ~ 70°C

package: -

CENGPXA270-312-10-550ECR

Logic

CARD ENGINE 64MB SDRAM 64MB NAND

• Module/Board Type: MCU Core
• Core Processor: PXA270
• Co-Processor: -
• Speed: 312MHz
• Flash Size: 64MB
• RAM Size: 64MB
• Connector Type: SO-DIMM-144
• Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
• Operating Temperature: 0°C ~ 70°C

package: -

CENGPXA270-520-10-504HCR

Logic

CARD ENGINE 32MB FLASH 64MB RAM

• Module/Board Type: MCU Core
• Core Processor: PXA270
• Co-Processor: -
• Speed: 520MHz
• Flash Size: 32MB
• RAM Size: 64MB
• Connector Type: SO-DIMM-144
• Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
• Operating Temperature: 0°C ~ 70°C

package: -

CENGLH7A404-11-403EIR

Logic

CARD ENGINE 32MB SDRAM

• Module/Board Type: MPU Core
• Core Processor: ARM922T, LH7A404
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 16MB
• RAM Size: 64MB
• Connector Type: SO-DIMM-144
• Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
• Operating Temperature: -40°C ~ 85°C

package: -

CENGLH7A400-10-503HCR

Logic

CARD ENGINE 64MB SDRAM

• Module/Board Type: MPU Core
• Core Processor: ARM922T, LH7A400
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 16MB
• RAM Size: 64MB
• Connector Type: SO-DIMM-144
• Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
• Operating Temperature: 0°C ~ 70°C

package: -

SOMLX800-11-000GCR-A

Logic

MODULE SOM LX800 GEODE WO/SODIMM

• Module/Board Type: MPU Core
• Core Processor: Geode, LX 800
• Co-Processor: -
• Speed: 500MHz
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: 3.78" x 4.53" (96mm x 115mm)
• Operating Temperature: 0°C ~ 70°C

package: -

CENGPXA270-520-10-550HCR

Logic

CARD ENGINE 64MB SDRAM

• Module/Board Type: MCU Core
• Core Processor: PXA270
• Co-Processor: -
• Speed: 520MHz
• Flash Size: 32MB
• RAM Size: 64MB
• Connector Type: SO-DIMM-144
• Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
• Operating Temperature: 0°C ~ 70°C

package: -

CENGPXA270-416-10-550EI

Logic

CARD ENGINE 64MB FLASH 64MB RAM

• Module/Board Type: MCU Core
• Core Processor: PXA270
• Co-Processor: -
• Speed: 416MHz
• Flash Size: 64MB
• RAM Size: 64MB
• Connector Type: SO-DIMM-144
• Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
• Operating Temperature: -40°C ~ 85°C

package: -

CENGPXA270-520-10-504HC

Logic

CARD ENGINE 32MB FLASH 64MB RAM

• Module/Board Type: MCU Core
• Core Processor: PXA270
• Co-Processor: -
• Speed: 520MHz
• Flash Size: 32MB
• RAM Size: 64MB
• Connector Type: SO-DIMM-144
• Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
• Operating Temperature: 0°C ~ 70°C

package: -

CENGLH7A404-11-430EI

Logic

CARD ENGINE 16MB FLASH 32MB RAM

• Module/Board Type: MPU Core
• Core Processor: ARM922T, LH7A404
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 16MB
• RAM Size: 64MB
• Connector Type: SO-DIMM-144
• Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
• Operating Temperature: -40°C ~ 85°C

package: -

CENGLH7A404-11-504HC-B

Logic

CARD ENGINE 64MB SDRAM

• Module/Board Type: MPU Core
• Core Processor: ARM922T, LH7A404
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 32MB
• RAM Size: 64MB
• Connector Type: SO-DIMM-144
• Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
• Operating Temperature: 0°C ~ 70°C

package: -

CENGLH7A404-11-402HC

Logic

CARD ENGINE 32MB SDRAM

• Module/Board Type: MPU Core
• Core Processor: ARM922T, LH7A404
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 16MB
• RAM Size: 64MB
• Connector Type: SO-DIMM-144
• Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
• Operating Temperature: 0°C ~ 70°C

package: -

CENGLH7A400-10-400BC

Logic

CARD ENGINE 32MB SDRAM

• Module/Board Type: MPU Core
• Core Processor: ARM922T, LH7A400
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 16MB
• RAM Size: 64MB
• Connector Type: SO-DIMM-144
• Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
• Operating Temperature: 0°C ~ 70°C

package: -

SOMOMAP3530-11-1782JFIR

Logic

SYSTEM ON MODULE LV OMAP3530

• Module/Board Type: MPU, DSP Core
• Core Processor: ARM? Cortex?-A8, OMAP3530
• Co-Processor: TMS320C64x (DSP)
• Speed: 600MHz
• Flash Size: 512MB (NAND), 8MB (NOR)
• RAM Size: 256MB
• Connector Type: Board-to-Board (BTB) Socket - 240
• Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm)
• Operating Temperature: -40°C ~ 85°C

package: -

SOMDM3730-10-1782JFIR

Logic

SYSTEM ON MODULE LV DM3730

• Module/Board Type: MPU, DSP Core
• Core Processor: ARM? Cortex?-A8, DM3730
• Co-Processor: TMS320C64x (DSP)
• Speed: 800MHz
• Flash Size: 512MB (NAND), 8MB (NOR)
• RAM Size: 256MB
• Connector Type: Board-to-Board (BTB) Socket - 480
• Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm)
• Operating Temperature: -40°C ~ 85°C

package: -

SOMAM1808-10-1502QHCR

Logic

SYSTEM ON MODULE AM1808

• Module/Board Type: MPU Core
• Core Processor: ARM926EJ-S, AM1808
• Co-Processor: -
• Speed: 450MHz
• Flash Size: 8MB
• RAM Size: 64MB
• Connector Type: -
• Size / Dimension: 1.18" x 1.57" (30mm x 40mm)
• Operating Temperature: 0°C ~ 70°C

package: -

SOMDM3730-32-1880AKIR

Logic

SOM TORPEDO WIRELESS 800MHZ IND

• Module/Board Type: MPU, DSP Core
• Core Processor: ARM? Cortex?-A8, DM3730
• Co-Processor: TMS320C64x (DSP)
• Speed: 800MHz
• Flash Size: 512MB
• RAM Size: 512MB
• Connector Type: Board-to-Board (BTB) Socket - 200
• Size / Dimension: 0.59" x 1.3" (15mm x 33mm)
• Operating Temperature: -40°C ~ 85°C

package: -

SOMDM3730-20-1880AGIR

Logic

SYSTEM ON MODULE TORP

• Module/Board Type: MPU, DSP Core
• Core Processor: ARM? Cortex?-A8, DM3730
• Co-Processor: TMS320C64x (DSP)
• Speed: 800MHz
• Flash Size: 512MB
• RAM Size: 512MB
• Connector Type: Board-to-Board (BTB) Socket - 200
• Size / Dimension: 0.59" x 1.06" (15mm x 27mm)
• Operating Temperature: -40°C ~ 85°C

package: -

SOMDM3730-20-1780AGIR-D

Logic

SYSTEM ON MODULE TORP DM3730

• Module/Board Type: MPU, DSP Core
• Core Processor: ARM? Cortex?-A8, DM3730
• Co-Processor: TMS320C64x (DSP)
• Speed: 800MHz
• Flash Size: 512MB
• RAM Size: 256MB
• Connector Type: Board-to-Board (BTB) Socket - 200
• Size / Dimension: 0.59" x 1.06" (15mm x 27mm)
• Operating Temperature: -40°C ~ 85°C

package: -

LPD-SOM-EU-SHIELD

Logic

EMISSIONS SHIELD COVER

• Accessory Type: Shield Plate
• For Use With/Related Products: -

package: -

SOMDM3730-11-2783IFCR

Logic

DM3730 SOM-LV TYPE III 256MB LPD

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

package: -