Intel Producten

10AS048K4F35E3LG

Intel

1152-PIN FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 480K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

EPCV4SI8N

Intel

IC CONFIG DEVICE

• Programmable Type: In System Programmable
• Memory Size: 4MB
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

package: 8-SOIC (0.154", 3.90mm Width)

EP20K1500EFC1020-1X

Intel

IC FPGA

• Number of LABs/CLBs: 5184
• Number of Logic Elements/Cells: 51840
• Total RAM Bits: 442368
• Number of I/O: 808
• Number of Gates: 2392000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1020-BBGA
• Supplier Device Package: 1020-FBGA (33x33)

package: 1020-BBGA

EP1S30F780C8N

Intel

IC FPGA 597 I/O 780FBGA

• Number of LABs/CLBs: 3247
• Number of Logic Elements/Cells: 32470
• Total RAM Bits: 3317184
• Number of I/O: 597
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

package: 780-BBGA, FCBGA

5SGXEA5N1F45C2LN

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 53105664
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

package: 1932-BBGA, FCBGA

5SGXEA3K2F40I2LN

Intel

IC FPGA 696 I/O 1517FBGA

• Number of LABs/CLBs: 128300
• Number of Logic Elements/Cells: 340000
• Total RAM Bits: 23704576
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

package: 1517-BBGA, FCBGA

5SGSMD4H3F35C4N

Intel

IC FPGA 432 I/O 1152FBGA

• Number of LABs/CLBs: 135840
• Number of Logic Elements/Cells: 360000
• Total RAM Bits: 23946240
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

package: 1152-BBGA, FCBGA

EP3CLS100F780I7

Intel

IC FPGA 413 I/O 780FBGA

• Number of LABs/CLBs: 6278
• Number of Logic Elements/Cells: 100448
• Total RAM Bits: 4451328
• Number of I/O: 413
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 780-BGA
• Supplier Device Package: 780-FBGA (29x29)

package: 780-BGA

EP3C5U256C6N

Intel

IC FPGA 182 I/O 256UBGA

• Number of LABs/CLBs: 321
• Number of Logic Elements/Cells: 5136
• Total RAM Bits: 423936
• Number of I/O: 182
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LFBGA
• Supplier Device Package: 256-UBGA (14x14)

package: 256-LFBGA

EP2C50F484I8

Intel

IC FPGA 294 I/O 484FBGA

• Number of LABs/CLBs: 3158
• Number of Logic Elements/Cells: 50528
• Total RAM Bits: 594432
• Number of I/O: 294
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BGA

EP4CE6E22C9L

Intel

IC FPGA 91 I/O 144EQFP

• Number of LABs/CLBs: 392
• Number of Logic Elements/Cells: 6272
• Total RAM Bits: 276480
• Number of I/O: 91
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-LQFP Exposed Pad
• Supplier Device Package: 144-EQFP (20x20)

package: 144-LQFP Exposed Pad

5AGXMA7G6F35C6G

Intel

IC FPGA 544 I/O 1152FBGA

• Number of LABs/CLBs: 11460
• Number of Logic Elements/Cells: 242000
• Total RAM Bits: 15470592
• Number of I/O: 544
• Number of Gates: -
• Voltage - Supply: 1.07V ~ 1.13V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

package: 1152-BBGA, FCBGA

EP4SGX360FH29I4G

Intel

IC FPGA 289 I/O 780HBGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: -
• Total RAM Bits: -
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

package: -

Request a Quote

5SGXMABN1F45I2LG

Intel

IC FPGA 840 I/O 1932FCBGA

• Number of LABs/CLBs: 359200
• Number of Logic Elements/Cells: 952000
• Total RAM Bits: 53248000
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

package: -

Request a Quote

AGFD019R24C2I3E

Intel

IC FPGA AGILEX-F 2340BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.9M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2340-BFBGA Exposed Pad
• Supplier Device Package: 2340-BGA (45x42)

package: -

Request a Quote

AGID023R31B2I1VB

Intel

IC FPGA AGILEX-I 3184BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.3M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 3184-BFBGA Exposed Pad
• Supplier Device Package: 3184-BGA (56x45)

package: -

Request a Quote

AGFA027R25A2E2V

Intel

IC FPGA AGILEX-F 2581FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.7M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

Request a Quote

AGFB006R24C2I2V

Intel

IC FPGA AGILEX-F 2340FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 573K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

Request a Quote

AGFB022R24C3I3V

Intel

IC FPGA AGILEX-F 2340FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.2M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

Request a Quote

5SGXMA3H1F35I2G

Intel

IC FPGA 600 I/O 1152FBGA

• Number of LABs/CLBs: 128300
• Number of Logic Elements/Cells: 340000
• Total RAM Bits: 19456000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

package: -

Request a Quote

EP4S100G5F45I3G

Intel

IC FPGA 781 I/O 1932FCBGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: -
• Total RAM Bits: -
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

package: -

Request a Quote

5SGSMD5K2F40I3G

Intel

IC FPGA 696 I/O 1517FBGA

• Number of LABs/CLBs: 172600
• Number of Logic Elements/Cells: 457000
• Total RAM Bits: 39936000
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

package: -

Request a Quote

1ST250EY2F55E2LG

Intel

IC FPGA 296 I/O 2912BGA

• Number of LABs/CLBs: 312500
• Number of Logic Elements/Cells: 2500000
• Total RAM Bits: -
• Number of I/O: 296
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2912-BBGA, FCBGA
• Supplier Device Package: 2912-FBGA, FC (55x55)

package: -

Request a Quote

5962-8766803MXA

Intel

IC MPU MG80386 20MHZ 132CPGA

• Core Processor: 80386
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 20MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5V
• Operating Temperature: -55°C ~ 125°C (TC)
• Security Features: -
• Package / Case: 132-BCPGA
• Supplier Device Package: 132-CPGA (37.59x37.59)

package: -

Request a Quote

1ST085ES1F50I2VG

Intel

IC FPGA STRATIX10TX 2397FBGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: 841000
• Total RAM Bits: 71303168
• Number of I/O: 440
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2397-BBGA, FCBGA
• Supplier Device Package: 2397-FBGA, FC (50x50)

package: -

Request a Quote

5SGXMA5N3F45C4NCV

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 46080000
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

package: -

Request a Quote

5SGXMBBR1H43I2G

Intel

IC FPGA 600 I/O 1760HBGA

• Number of LABs/CLBs: 359200
• Number of Logic Elements/Cells: 952000
• Total RAM Bits: 53248000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-HBGA (45x45)

package: -

Request a Quote

AGIA040R39A1I1V

Intel

IC

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 4.047M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 3948-BFBGA Exposed Pad
• Supplier Device Package: 3948-BGA (56x56)

package: -

Request a Quote