Intel Producten

FC80960HA33SL2GV

Intel

IC MPU I960 33MHZ 208QFP

• Core Processor: i960
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 33MHz
• Co-Processors/DSP: -
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 85°C (TC)
• Security Features: -
• Package / Case: 208-QFP
• Supplier Device Package: 208-PQFP

package: 208-QFP

10AX027H2F35I1SG

Intel

IC FPGA 384 I/O 1152FCBGA

• Number of LABs/CLBs: 101620
• Number of Logic Elements/Cells: 270000
• Total RAM Bits: 17870848
• Number of I/O: 384
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

package: 1152-BBGA, FCBGA

EP20K200EFC484-2AB

Intel

IC FPGA

• Number of LABs/CLBs: 832
• Number of Logic Elements/Cells: 8320
• Total RAM Bits: 106496
• Number of I/O: 376
• Number of Gates: 526000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BBGA

EP20K200EFC672-3

Intel

IC FPGA 376 I/O 672FBGA

• Number of LABs/CLBs: 832
• Number of Logic Elements/Cells: 8320
• Total RAM Bits: 106496
• Number of I/O: 376
• Number of Gates: 526000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 672-BBGA
• Supplier Device Package: 672-FBGA (27x27)

package: 672-BBGA

EP3C5U256C8N

Intel

IC FPGA 182 I/O 256UBGA

• Number of LABs/CLBs: 321
• Number of Logic Elements/Cells: 5136
• Total RAM Bits: 423936
• Number of I/O: 182
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LFBGA
• Supplier Device Package: 256-UBGA (14x14)

package: 256-LFBGA

EP1K50TC144-1

Intel

IC FPGA 102 I/O 144TQFP

• Number of LABs/CLBs: 360
• Number of Logic Elements/Cells: 2880
• Total RAM Bits: 40960
• Number of I/O: 102
• Number of Gates: 199000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

package: 144-LQFP

EP4SGX230FF35C2X

Intel

IC FPGA 564 I/O 1152FBGA

• Number of LABs/CLBs: 9120
• Number of Logic Elements/Cells: 228000
• Total RAM Bits: 17544192
• Number of I/O: 564
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

package: 1152-BBGA, FCBGA

EP4SGX180HF35C4

Intel

IC FPGA 564 I/O 1152FBGA

• Number of LABs/CLBs: 7030
• Number of Logic Elements/Cells: 175750
• Total RAM Bits: 13954048
• Number of I/O: 564
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

package: 1152-BBGA, FCBGA

5AGXFB5K4F40I3N

Intel

IC FPGA 704 I/O 1517FBGA

• Number of LABs/CLBs: 19811
• Number of Logic Elements/Cells: 420000
• Total RAM Bits: 23625728
• Number of I/O: 704
• Number of Gates: -
• Voltage - Supply: 1.12 V ~ 1.18 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA
• Supplier Device Package: 1517-FBGA (40x40)

package: 1517-BBGA

10AX048K2F35E2SG

Intel

1152-PIN FBGA

• Number of LABs/CLBs: 183590
• Number of Logic Elements/Cells: 480000
• Total RAM Bits: 5664768
• Number of I/O: 396
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

package: 1152-BBGA, FCBGA

5SGXMA7K1F40C2LN

Intel

IC FPGA 696 I/O 1517FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 59939840
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

package: 1517-BBGA, FCBGA

EP3SE50F780C2N

Intel

IC FPGA 488 I/O 780FBGA

• Number of LABs/CLBs: 1900
• Number of Logic Elements/Cells: 47500
• Total RAM Bits: 5760000
• Number of I/O: 488
• Number of Gates: -
• Voltage - Supply: 0.86 V ~ 1.15 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

package: 780-BBGA, FCBGA

EP4CE115F29C8

Intel

IC FPGA 528 I/O 780FBGA

• Number of LABs/CLBs: 7155
• Number of Logic Elements/Cells: 114480
• Total RAM Bits: 3981312
• Number of I/O: 528
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BGA
• Supplier Device Package: 780-FBGA (29x29)

package: 780-BGA

10CL006YU256I7G

Intel

IC FPGA 176 I/O 256 UBGA

• Number of LABs/CLBs: 392
• Number of Logic Elements/Cells: 6272
• Total RAM Bits: 276480
• Number of I/O: 176
• Number of Gates: -
• Voltage - Supply: 1.2V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-LFBGA
• Supplier Device Package: 256-UBGA (14x14)

package: 256-LFBGA

EP4CE40F23C9L

Intel

IC FPGA 328 I/O 484FBGA

• Number of LABs/CLBs: 2475
• Number of Logic Elements/Cells: 39600
• Total RAM Bits: 1161216
• Number of I/O: 328
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BGA

EP3C5U256C7N

Intel

IC FPGA 182 I/O 256UBGA

• Number of LABs/CLBs: 321
• Number of Logic Elements/Cells: 5136
• Total RAM Bits: 423936
• Number of I/O: 182
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LFBGA
• Supplier Device Package: 256-UBGA (14x14)

package: 256-LFBGA

5AGXBB3D4F31I5G

Intel

IC FPGA 384 I/O 896FBGA

• Number of LABs/CLBs: 17110
• Number of Logic Elements/Cells: 362000
• Total RAM Bits: 19822592
• Number of I/O: 384
• Number of Gates: -
• Voltage - Supply: 1.07V ~ 1.13V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 896-BBGA, FCBGA
• Supplier Device Package: 896-FBGA (31x31)

package: 896-BBGA, FCBGA

5AGXMA7D6F27C6G

Intel

IC FPGA 336 I/O 672FBGA

• Number of LABs/CLBs: 11460
• Number of Logic Elements/Cells: 242000
• Total RAM Bits: 15470592
• Number of I/O: 336
• Number of Gates: -
• Voltage - Supply: 1.07V ~ 1.13V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FBGA (27x27)

package: 672-BBGA, FCBGA

AGIB019R31B2E2V

Intel

IC FPGA AGILEX-I 3184FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.9M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 3184-BFBGA Exposed Pad
• Supplier Device Package: 3184-BGA (56x45)

package: -

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AGIB027R29B1E2V

Intel

IC

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.7M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

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5SGXMB5R3F43C4G

Intel

IC FPGA 600 I/O 1760FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 41984000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

package: -

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5SGSMD5K2F40I2NCV

Intel

IC FPGA 696 I/O 1517FBGA

• Number of LABs/CLBs: 172600
• Number of Logic Elements/Cells: 457000
• Total RAM Bits: 39936000
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

package: -

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AGFB014R24C2I1VB

Intel

IC FPGA AGILEX-F 2340BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.4M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2340-BFBGA Exposed Pad
• Supplier Device Package: 2340-BGA (45x42)

package: -

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1ST280EY2F55I1VGAS

Intel

IC FPGA 296 I/O 2912BGA

• Number of LABs/CLBs: 350000
• Number of Logic Elements/Cells: 2800000
• Total RAM Bits: -
• Number of I/O: 296
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2912-BBGA, FCBGA
• Supplier Device Package: 2912-FBGA, FC (55x55)

package: -

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DA28F320J5A120

Intel

IC FLASH 32MBIT CFI 56SSOP

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH
• Memory Size: 32Mbit
• Memory Interface: CFI
• Clock Frequency: -
• Write Cycle Time - Word, Page: -
• Access Time: 120 ns
• Voltage - Supply: 4.5V ~ 5.5V
• Operating Temperature: -20°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 56-SOP
• Supplier Device Package: 56-SSOP

package: -

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AGIB027R31A1E2V

Intel

IC

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.7M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 3184-BFBGA Exposed Pad
• Supplier Device Package: 3184-BGA (56x45)

package: -

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5SGXEA9K2H40I2CV

Intel

IC FPGA 696 I/O 1517HBGA

• Number of LABs/CLBs: 317000
• Number of Logic Elements/Cells: 840000
• Total RAM Bits: 53248000
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-HBGA (45x45)

package: -

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QG6311

Intel

INTEL 6311 - I/O CONTROLLER HUB

• Applications: -
• Core Processor: -
• Program Memory Type: -
• Controller Series: -
• RAM Size: -
• Interface: -
• Number of I/O: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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