Intel Producten

10AS057N4F40I3LG

Intel

IC SOC FPGA 588 I/O 1517FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 570K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

package: 1517-BBGA, FCBGA

5ASXBB5D4F35C4N

Intel

IC FPGA 350 I/O 1152FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 64KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 925MHz
• Primary Attributes: FPGA - 462K Logic Elements
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

package: 1152-BBGA, FCBGA

10AS022E3F27E2SG

Intel

672-PIN FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 220K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

EPF8820ARC208-2

Intel

IC FPGA 152 I/O 208RQFP

• Number of LABs/CLBs: 84
• Number of Logic Elements/Cells: 672
• Total RAM Bits: -
• Number of I/O: 152
• Number of Gates: 8000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 208-BFQFP Exposed Pad
• Supplier Device Package: 208-RQFP (28x28)

package: 208-BFQFP Exposed Pad

EP1M120F484I6

Intel

IC FPGA 303 I/O 484FBGA

• Number of LABs/CLBs: 480
• Number of Logic Elements/Cells: 4800
• Total RAM Bits: 49152
• Number of I/O: 303
• Number of Gates: 120000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA, FCBGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BBGA, FCBGA

EP1C3T144C6N

Intel

IC FPGA 104 I/O 144TQFP

• Number of LABs/CLBs: 291
• Number of Logic Elements/Cells: 2910
• Total RAM Bits: 59904
• Number of I/O: 104
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

package: 144-LQFP

5SGXEA9N1F45C2L

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 317000
• Number of Logic Elements/Cells: 840000
• Total RAM Bits: 64210944
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

package: 1932-BBGA, FCBGA

5SGXEA7H3F35I4

Intel

IC FPGA 552 I/O 1152FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 59939840
• Number of I/O: 552
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

package: 1152-BBGA, FCBGA

5SGXEA4K1F35C2N

Intel

IC FPGA 432 I/O 1152FBGA

• Number of LABs/CLBs: 158500
• Number of Logic Elements/Cells: 420000
• Total RAM Bits: 43983872
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

package: 1152-BBGA, FCBGA

EP4SGX110HF35I3N

Intel

IC FPGA 488 I/O 1152FBGA

• Number of LABs/CLBs: 4224
• Number of Logic Elements/Cells: 105600
• Total RAM Bits: 9793536
• Number of I/O: 488
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

package: 1152-BBGA, FCBGA

5CEBA7F23C7N

Intel

IC FPGA 240 I/O 484FBGA

• Number of LABs/CLBs: 56480
• Number of Logic Elements/Cells: 149500
• Total RAM Bits: 7880704
• Number of I/O: 240
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BGA

EP4CGX22BF14C6

Intel

IC FPGA 72 I/O 169FBGA

• Number of LABs/CLBs: 1330
• Number of Logic Elements/Cells: 21280
• Total RAM Bits: 774144
• Number of I/O: 72
• Number of Gates: -
• Voltage - Supply: 1.16 V ~ 1.24 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 169-LBGA
• Supplier Device Package: 169-FBGA (14x14)

package: 169-LBGA

EPM7512BTC144-10

Intel

IC CPLD 512MC 10NS 144TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 2.375 V ~ 2.625 V
• Number of Logic Elements/Blocks: 32
• Number of Macrocells: 512
• Number of Gates: 10000
• Number of I/O: 120
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

package: 144-LQFP

EP3SL70F780C4LG

Intel

IC FPGA 488 I/O 780FBGA

• Number of LABs/CLBs: 2700
• Number of Logic Elements/Cells: 67500
• Total RAM Bits: 2699264
• Number of I/O: 488
• Number of Gates: -
• Voltage - Supply: 0.86V ~ 1.15V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

package: 780-BBGA, FCBGA

EP3SL70F484C4G

Intel

IC FPGA 296 I/O 484FBGA

• Number of LABs/CLBs: 2700
• Number of Logic Elements/Cells: 67500
• Total RAM Bits: 2699264
• Number of I/O: 296
• Number of Gates: -
• Voltage - Supply: 0.86V ~ 1.15V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA, FCBGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BBGA, FCBGA

5AGXFA5H6F35C6G

Intel

IC FPGA 544 I/O 1152FBGA

• Number of LABs/CLBs: 8962
• Number of Logic Elements/Cells: 190000
• Total RAM Bits: 13284352
• Number of I/O: 544
• Number of Gates: -
• Voltage - Supply: 1.07V ~ 1.13V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

package: 1152-BBGA, FCBGA

1SD110PJ1F43E1VG

Intel

IC FPGA 528 I/O 1760FBGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: 1325000
• Total RAM Bits: 112197632
• Number of I/O: 528
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

package: -

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1ST165EU2F50E2VG

Intel

IC FPGA 440 I/O 2397BGA

• Number of LABs/CLBs: 206250
• Number of Logic Elements/Cells: 1650000
• Total RAM Bits: -
• Number of I/O: 440
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2397-BBGA, FCBGA
• Supplier Device Package: 2397-FBGA, FC (50x50)

package: -

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5SGXMA5K2F35I2LG

Intel

IC FPGA 432 I/O 1152FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 46080000
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

package: -

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AGFA012R24C2E2V

Intel

IC FPGA AGILEX-F 2340FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.2M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

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1SX085HN3F43I2VG

Intel

IC FPGA STRATIX 10 1760FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 850K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

package: -

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1ST280EU1F50E2LG

Intel

IC FPGA 440 I/O 2397BGA

• Number of LABs/CLBs: 350000
• Number of Logic Elements/Cells: 2800000
• Total RAM Bits: -
• Number of I/O: 440
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2397-BBGA, FCBGA
• Supplier Device Package: 2397-FBGA, FC (50x50)

package: -

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5SGXEA5N3F40C4G

Intel

IC FPGA 600 I/O 1517FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 46080000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

package: -

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RN80532KC056512

Intel

IC MPU INTEL XEON 2.4GHZ 603PPGA

• Core Processor: Intel® Xeon® Processor
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 2.4GHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.475V
• Operating Temperature: 74°C (TC)
• Security Features: -
• Package / Case: 603-PGA
• Supplier Device Package: 603-PPGA

package: -

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5SGXEA3K2F35C1G

Intel

IC FPGA 432 I/O 1152FBGA

• Number of LABs/CLBs: 128300
• Number of Logic Elements/Cells: 340000
• Total RAM Bits: 19456000
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

package: -

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AN87C196JQ

Intel

16-BIT, OTPROM, 8096 CPU, 8MHZ

• Core Processor: 87C196JQ
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: SSIO, UART/USART
• Peripherals: -
• Number of I/O: 41
• Program Memory Size: 12KB (12K x 8)
• Program Memory Type: EPROM
• EEPROM Size: -
• RAM Size: 488 x 8
• Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
• Data Converters: A/D 6x10b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 52-LCC (J-Lead)
• Supplier Device Package: 52-PLCC

package: -

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5SGXMA4K2F35C2LG

Intel

IC FPGA 600 I/O 1152FBGA

• Number of LABs/CLBs: 158500
• Number of Logic Elements/Cells: 420000
• Total RAM Bits: 37888000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

package: -

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5SGXMB9R2H43C2G

Intel

IC FPGA 600 I/O 1760HBGA

• Number of LABs/CLBs: 317000
• Number of Logic Elements/Cells: 840000
• Total RAM Bits: 53248000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-HBGA (45x45)

package: -

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