Intel Producten

1SX250LU3F50I1VG

Intel

2397-PIN FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 2500K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

1SX280LN3F43E3VG

Intel

1760-PIN FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 2800K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

5ASXFB3H6F40C6N

Intel

IC FPGA 528 I/O 1517FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 64KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 700MHz
• Primary Attributes: FPGA - 350K Logic Elements
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

package: 1517-BBGA, FCBGA

EP2A70B724C9

Intel

IC FPGA 540 I/O 724BGA

• Number of LABs/CLBs: 6720
• Number of Logic Elements/Cells: 67200
• Total RAM Bits: 1146880
• Number of I/O: 540
• Number of Gates: 5250000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 724-BBGA, FCBGA
• Supplier Device Package: 724-BGA (35x35)

package: 724-BBGA, FCBGA

EP2SGX60CF484I4

Intel

IC FPGA 291 I/O 484FBGA

• Number of LABs/CLBs: 3022
• Number of Logic Elements/Cells: 60440
• Total RAM Bits: 2544192
• Number of I/O: 291
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BBGA

EPF10K30RC208-4N

Intel

IC FPGA 147 I/O 208RQFP

• Number of LABs/CLBs: 216
• Number of Logic Elements/Cells: 1728
• Total RAM Bits: 12288
• Number of I/O: 147
• Number of Gates: 69000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 208-BFQFP Exposed Pad
• Supplier Device Package: 208-RQFP (28x28)

package: 208-BFQFP Exposed Pad

EP4SGX530KF43C2

Intel

IC FPGA 880 I/O 1760FBGA

• Number of LABs/CLBs: 21248
• Number of Logic Elements/Cells: 531200
• Total RAM Bits: 28033024
• Number of I/O: 880
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA, FC (42.5x42.5)

package: 1760-BBGA, FCBGA

EP4S40G2F40I2

Intel

IC FPGA 654 I/O 1517FBGA

• Number of LABs/CLBs: 9120
• Number of Logic Elements/Cells: 228000
• Total RAM Bits: 17544192
• Number of I/O: 654
• Number of Gates: -
• Voltage - Supply: 0.92 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

package: 1517-BBGA, FCBGA

10AX032E3F29E2SG

Intel

780-PIN FBGA

• Number of LABs/CLBs: 119900
• Number of Logic Elements/Cells: 320000
• Total RAM Bits: 21040128
• Number of I/O: 360
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

package: 780-BBGA, FCBGA

EP1SGX25DF672C7

Intel

IC FPGA 455 I/O 672FBGA

• Number of LABs/CLBs: 2566
• Number of Logic Elements/Cells: 25660
• Total RAM Bits: 1944576
• Number of I/O: 455
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FBGA (27x27)

package: 672-BBGA, FCBGA

10M40SCE144A7G

Intel

IC FPGA 101 I/O 144EQFP

• Number of LABs/CLBs: 2500
• Number of Logic Elements/Cells: 40000
• Total RAM Bits: 1290240
• Number of I/O: 101
• Number of Gates: -
• Voltage - Supply: 2.85 V ~ 3.465 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 144-LQFP Exposed Pad
• Supplier Device Package: 144-EQFP (20x20)

package: 144-LQFP Exposed Pad

EP1C6F256C6

Intel

IC FPGA 185 I/O 256FBGA

• Number of LABs/CLBs: 598
• Number of Logic Elements/Cells: 5980
• Total RAM Bits: 92160
• Number of I/O: 185
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

package: 256-BGA

EPM7512AEBC256-12

Intel

IC CPLD 512MC 12NS 256BGA

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 12.0ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 32
• Number of Macrocells: 512
• Number of Gates: 10000
• Number of I/O: 212
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 256-LBGA
• Supplier Device Package: 256-BGA (27x27)

package: 256-LBGA

EP2AGX45DF29I3NAD

Intel

IC FPGA 364 I/O 780FBGA

• Number of LABs/CLBs: 1805
• Number of Logic Elements/Cells: 42959
• Total RAM Bits: 3517440
• Number of I/O: 364
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

package: 780-BBGA, FCBGA

EP2AGX190EF29C4G

Intel

IC FPGA 372 I/O 780FBGA

• Number of LABs/CLBs: 7612
• Number of Logic Elements/Cells: 181165
• Total RAM Bits: 10177536
• Number of I/O: 372
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

package: 780-BBGA, FCBGA

AGIB022R31A1I2V

Intel

IC

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.2M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 3184-BFBGA Exposed Pad
• Supplier Device Package: 3184-BGA (56x45)

package: -

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1SG110HN1F43E2VG

Intel

IC FPGA 688 I/O 1760FBGA

• Number of LABs/CLBs: 137500
• Number of Logic Elements/Cells: 1100000
• Total RAM Bits: -
• Number of I/O: 688
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

package: -

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5SGXMB6R2F40C2G

Intel

IC FPGA 432 I/O 1517FBGA

• Number of LABs/CLBs: 225400
• Number of Logic Elements/Cells: 597000
• Total RAM Bits: 53248000
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-FBGA (40x40)
• Supplier Device Package: 1517-FBGA (40x40)

package: -

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EP4SE820F43C4G

Intel

IC FPGA 1120 I/O 1760FBGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: -
• Total RAM Bits: -
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

package: -

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AGFB027R31C2E2V

Intel

IC FPGA AGILEX-F 3184FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.7M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

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WPIXP2350ACT

Intel

WESTPORT NETWORK PROCESSOR

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

package: -

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TE28F008S3150

Intel

IC FLASH 8MBIT PARALLEL 40TSOP

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH - NOR (SLC)
• Memory Size: 8Mbit
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: -
• Access Time: 150 ns
• Voltage - Supply: 2.7V ~ 3.6V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 40-TFSOP (0.724", 18.40mm Width)
• Supplier Device Package: 40-TSOP

package: -

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N82C08-8

Intel

DRAM CONTROLLER, 1M X 8 PQCC68

• Controller Type: Dynamic RAM (DRAM)
• Voltage - Supply: 4.5V ~ 5.5V
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 68-LCC (J-Lead)
• Supplier Device Package: 68-PLCC

package: -

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5SGXMA7K2F35I2WN

Intel

IC FPGA 432 I/O 1152FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 51200000
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

package: -

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1ST085EN3F43E3VG

Intel

IC FPGA 440 I/O 1760FBGA

• Number of LABs/CLBs: 106250
• Number of Logic Elements/Cells: 850000
• Total RAM Bits: -
• Number of I/O: 440
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

package: -

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5SGSMD6N2F45C2G

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 220000
• Number of Logic Elements/Cells: 583000
• Total RAM Bits: 46080000
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

package: -

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5SGSED6N3F45C4G

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 220000
• Number of Logic Elements/Cells: 583000
• Total RAM Bits: 46080000
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

package: -

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5SGSMD4H2F35I3G

Intel

IC FPGA 432 I/O 1152FBGA

• Number of LABs/CLBs: 135840
• Number of Logic Elements/Cells: 360000
• Total RAM Bits: 19456000
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

package: -

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