Intel Producten

10AS066K4F40I3SG

Intel

IC SOC FPGA 696 I/O 1517FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 660K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

package: 1517-BBGA, FCBGA

5CSEMA6U23C8N

Intel

IC FPGA 145 I/O 672UBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 64KB
• Peripherals: DMA, POR, WDT
• Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz
• Primary Attributes: FPGA - 110K Logic Elements
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 672-FBGA
• Supplier Device Package: 672-UBGA (23x23)

package: 672-FBGA

HC1S60F1020CA

Intel

IC FPGA APEX 1020FBGA

• Number of LABs/CLBs: 5712
• Number of Logic Elements/Cells: 57120
• Total RAM Bits: 5215104
• Number of I/O: 782
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -
• Package / Case: 1020-BBGA
• Supplier Device Package: 1020-FBGA (33x33)

package: 1020-BBGA

10AX027E2F27E1SG

Intel

IC FPGA 240 I/O 672FBGA

• Number of LABs/CLBs: 101620
• Number of Logic Elements/Cells: 270000
• Total RAM Bits: 17870848
• Number of I/O: 240
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FBGA (27x27)

package: 672-BBGA, FCBGA

EP20K200EBC356-1N

Intel

IC FPGA 271 I/O 356BGA

• Number of LABs/CLBs: 832
• Number of Logic Elements/Cells: 8320
• Total RAM Bits: 106496
• Number of I/O: 271
• Number of Gates: 526000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 356-LBGA
• Supplier Device Package: 356-BGA (35x35)

package: 356-LBGA

EP1S40F1508C5N

Intel

IC FPGA 822 I/O 1508FBGA

• Number of LABs/CLBs: 4125
• Number of Logic Elements/Cells: 41250
• Total RAM Bits: 3423744
• Number of I/O: 822
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1508-BBGA, FCBGA
• Supplier Device Package: 1508-FBGA (30x30)

package: 1508-BBGA, FCBGA

EP1S20F780C7N

Intel

IC FPGA 586 I/O 780FBGA

• Number of LABs/CLBs: 1846
• Number of Logic Elements/Cells: 18460
• Total RAM Bits: 1669248
• Number of I/O: 586
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

package: 780-BBGA, FCBGA

EP4CGX30BF14C8N

Intel

IC FPGA 72 I/O 169FBGA

• Number of LABs/CLBs: 1840
• Number of Logic Elements/Cells: 29440
• Total RAM Bits: 1105920
• Number of I/O: 72
• Number of Gates: -
• Voltage - Supply: 1.16 V ~ 1.24 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 169-LBGA
• Supplier Device Package: 169-FBGA (14x14)

package: 169-LBGA

5SGTMC7K2F40C1N

Intel

IC FPGA 600 I/O 1517FBGA

• Number of LABs/CLBs: 234750
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 59938816
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

package: 1517-BBGA, FCBGA

5SGXMB6R2F40I3LN

Intel

IC FPGA 432 I/O 1517FBGA

• Number of LABs/CLBs: 225400
• Number of Logic Elements/Cells: 597000
• Total RAM Bits: 61688832
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

package: 1517-BBGA, FCBGA

EP4SE360H29C3

Intel

IC FPGA 488 I/O 780HBGA

• Number of LABs/CLBs: 14144
• Number of Logic Elements/Cells: 353600
• Total RAM Bits: 23105536
• Number of I/O: 488
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-HBGA (33x33)

package: 780-BBGA, FCBGA

EP4SGX180KF40I3

Intel

IC FPGA 744 I/O 1517FBGA

• Number of LABs/CLBs: 7030
• Number of Logic Elements/Cells: 175750
• Total RAM Bits: 13954048
• Number of I/O: 744
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

package: 1517-BBGA, FCBGA

5CGTFD9A5U19A7N

Intel

IC FPGA 240 I/O 484UBGA

• Number of LABs/CLBs: 113560
• Number of Logic Elements/Cells: 301000
• Total RAM Bits: 14251008
• Number of I/O: 240
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 484-FBGA
• Supplier Device Package: 484-UBGA (19x19)

package: 484-FBGA

EP4CE115F23I8L

Intel

IC FPGA 280 I/O 484FBGA

• Number of LABs/CLBs: 7155
• Number of Logic Elements/Cells: 114480
• Total RAM Bits: 3981312
• Number of I/O: 280
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BGA

EP1AGX35CF484C6N

Intel

IC FPGA 230 I/O 484FBGA

• Number of LABs/CLBs: 1676
• Number of Logic Elements/Cells: 33520
• Total RAM Bits: 1348416
• Number of I/O: 230
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BBGA

10CX105YU484I5G

Intel

484-PIN UBGA

• Number of LABs/CLBs: 38000
• Number of Logic Elements/Cells: 104000
• Total RAM Bits: 8641536
• Number of I/O: 188
• Number of Gates: -
• Voltage - Supply: 0.9V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BFBGA, FCBGA
• Supplier Device Package: 484-UBGA (19x19)

package: 484-BFBGA, FCBGA

EP3C40F324C7N

Intel

IC FPGA 195 I/O 324FBGA

• Number of LABs/CLBs: 2475
• Number of Logic Elements/Cells: 39600
• Total RAM Bits: 1161216
• Number of I/O: 195
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 324-BGA
• Supplier Device Package: 324-FBGA (19x19)

package: 324-BGA

EPM7256BTC144-7N

Intel

IC CPLD 256MC 7.5NS 144TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 2.375 V ~ 2.625 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 256
• Number of Gates: 5000
• Number of I/O: 120
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

package: 144-LQFP

EPM7064LI68-15

Intel

IC CPLD 64MC 15NS 68PLCC

• Programmable Type: EE PLD
• Delay Time tpd(1) Max: 15.0ns
• Voltage Supply - Internal: 4.5 V ~ 5.5 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 64
• Number of Gates: 1250
• Number of I/O: 52
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 68-LCC (J-Lead)
• Supplier Device Package: 68-PLCC (24x24)

package: 68-LCC (J-Lead)

EPM7064BTC44-3

Intel

IC CPLD 64MC 3.5NS 44TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 3.5ns
• Voltage Supply - Internal: 2.375 V ~ 2.625 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 64
• Number of Gates: 1250
• Number of I/O: 36
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

package: 44-TQFP

EPM7064STI44-7N

Intel

IC CPLD 64MC 7.5NS 44TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 4.5 V ~ 5.5 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 64
• Number of Gates: 1250
• Number of I/O: 36
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

package: 44-TQFP

EPM7256AETC144-5

Intel

IC CPLD 256MC 5.5NS 144TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 5.5ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 256
• Number of Gates: 5000
• Number of I/O: 120
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

package: 144-LQFP

5AGXMB3G6F35C6G

Intel

IC FPGA 544 I/O 1152FBGA

• Number of LABs/CLBs: 17110
• Number of Logic Elements/Cells: 362000
• Total RAM Bits: 19822592
• Number of I/O: 544
• Number of Gates: -
• Voltage - Supply: 1.07V ~ 1.13V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

package: 1152-BBGA, FCBGA

AGFB006R24C2I2VB

Intel

IC FPGA AGILEX-F 2340BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 573K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2340-BFBGA Exposed Pad
• Supplier Device Package: 2340-BGA (45x42)

package: -

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5SGXMA5N2F40I3LG

Intel

IC FPGA 600 I/O 1517FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 46080000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

package: -

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AGFB008R24C2E1V

Intel

IC FPGA AGILEX-F 2340FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 764K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

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AGFB008R24C2I1V

Intel

IC FPGA AGILEX-F 2340FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 764K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

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NE80546QG0882MM

Intel

IC MPU INTEL XEON 3.2GHZ 604PPGA

• Core Processor: Intel® Xeon® Processor
• Number of Cores/Bus Width: 1 Core, 64-Bit
• Speed: 3.2GHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.25V, 1.388V
• Operating Temperature: 72°C (TC)
• Security Features: -
• Package / Case: 604-PGA
• Supplier Device Package: 604-PPGA (42.5x42.5)

package: -

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