Xilinx Inc. Producten

XC17S30PD8I

Xilinx Inc.

IC PROM PROG I-TEMP 5V 8-DIP

• Programmable Type: OTP
• Memory Size: 300kb
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

package: 8-DIP (0.300", 7.62mm)

XCZU19EG-L1FFVE1924I

Xilinx Inc.

IC FPGA 668 I/O 1924FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1924-FCBGA (45x45)

package: 1924-BBGA, FCBGA

XCZU7EV-1FFVC1156E

Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

5962-9957201NNA

Xilinx Inc.

IC FPGA 2.5V HIREL VIRTEX 300

• Number of LABs/CLBs: 1536
• Number of Logic Elements/Cells: 6912
• Total RAM Bits: 65536
• Number of I/O: 260
• Number of Gates: 322970
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: -55°C ~ 125°C (TJ)
• Package / Case: 352-LBGA, Metal
• Supplier Device Package: 352-MBGA (35x35)

package: 352-LBGA, Metal

XC2V8000-5FF1517I

Xilinx Inc.

IC FPGA 1108 I/O 1517FCBGA

• Number of LABs/CLBs: 11648
• Number of Logic Elements/Cells: -
• Total RAM Bits: 3096576
• Number of I/O: 1108
• Number of Gates: 8000000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

package: 1517-BBGA, FCBGA

XC2V250-5FG256I

Xilinx Inc.

IC FPGA 172 I/O 256FBGA

• Number of LABs/CLBs: 384
• Number of Logic Elements/Cells: -
• Total RAM Bits: 442368
• Number of I/O: 172
• Number of Gates: 250000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

package: 256-BGA

XC2V250-5CSG144I

Xilinx Inc.

IC FPGA 92 I/O 144CSBGA

• Number of LABs/CLBs: 384
• Number of Logic Elements/Cells: -
• Total RAM Bits: 442368
• Number of I/O: 92
• Number of Gates: 250000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 144-TFBGA, CSPBGA
• Supplier Device Package: 144-LCSBGA (12x12)

package: 144-TFBGA, CSPBGA

XCV1000E-6FG1156I

Xilinx Inc.

IC FPGA 660 I/O 1156FBGA

• Number of LABs/CLBs: 6144
• Number of Logic Elements/Cells: 27648
• Total RAM Bits: 393216
• Number of I/O: 660
• Number of Gates: 1569178
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA
• Supplier Device Package: 1156-FBGA (35x35)

package: 1156-BBGA

XCV1000E-6FG1156C

Xilinx Inc.

IC FPGA 660 I/O 1156FBGA

• Number of LABs/CLBs: 6144
• Number of Logic Elements/Cells: 27648
• Total RAM Bits: 393216
• Number of I/O: 660
• Number of Gates: 1569178
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1156-BBGA
• Supplier Device Package: 1156-FBGA (35x35)

package: 1156-BBGA

XC4020E-4PG223I

Xilinx Inc.

IC FPGA 192 I/O 223CPGA

• Number of LABs/CLBs: 784
• Number of Logic Elements/Cells: 1862
• Total RAM Bits: 25088
• Number of I/O: 192
• Number of Gates: 20000
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Through Hole
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 223-BCPGA
• Supplier Device Package: 223-CPGA (47.25x47.25)

package: 223-BCPGA

XC4010XL-3TQ144I

Xilinx Inc.

IC FPGA 113 I/O 144TQFP

• Number of LABs/CLBs: 400
• Number of Logic Elements/Cells: 950
• Total RAM Bits: 12800
• Number of I/O: 113
• Number of Gates: 10000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

package: 144-LQFP

XCVU095-2FFVA2104E

Xilinx Inc.

IC FPGA 832 I/O 2104FCBGA

• Number of LABs/CLBs: 67200
• Number of Logic Elements/Cells: 1176000
• Total RAM Bits: 62259200
• Number of I/O: 832
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 0.979 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (47.5x47.5)

package: 2104-BBGA, FCBGA

XCKU095-1FFVB1760I

Xilinx Inc.

IC FPGA 702 I/O 1760FCBGA

• Number of LABs/CLBs: 67200
• Number of Logic Elements/Cells: 1176000
• Total RAM Bits: 60518400
• Number of I/O: 702
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 0.979 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

package: 1760-BBGA, FCBGA

XC7VX690T-1FFG1158C

Xilinx Inc.

IC FPGA 350 I/O 1158FCBGA

• Number of LABs/CLBs: 54150
• Number of Logic Elements/Cells: 693120
• Total RAM Bits: 54190080
• Number of I/O: 350
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1158-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XC6VSX315T-1FF1759C

Xilinx Inc.

IC FPGA 720 I/O 1759FCBGA

• Number of LABs/CLBs: 24600
• Number of Logic Elements/Cells: 314880
• Total RAM Bits: 25952256
• Number of I/O: 720
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1759-FCBGA (42.5x42.5)

package: 1760-BBGA, FCBGA

XC2VP40-7FF1152C

Xilinx Inc.

IC FPGA 692 I/O 1152FCBGA

• Number of LABs/CLBs: 4848
• Number of Logic Elements/Cells: 43632
• Total RAM Bits: 3538944
• Number of I/O: 692
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-CFCBGA (35x35)

package: 1152-BBGA, FCBGA

XC7K325T-L2FFG676I

Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

• Number of LABs/CLBs: 25475
• Number of Logic Elements/Cells: 326080
• Total RAM Bits: 16404480
• Number of I/O: 400
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XC5VLX110-1FF676C

Xilinx Inc.

IC FPGA 440 I/O 676FCBGA

• Number of LABs/CLBs: 8640
• Number of Logic Elements/Cells: 110592
• Total RAM Bits: 4718592
• Number of I/O: 440
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XC2VP20-7FF1152C

Xilinx Inc.

IC FPGA 564 I/O 1152FCBGA

• Number of LABs/CLBs: 2320
• Number of Logic Elements/Cells: 20880
• Total RAM Bits: 1622016
• Number of I/O: 564
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-CFCBGA (35x35)

package: 1152-BBGA, FCBGA

XC4VFX12-11SF363C

Xilinx Inc.

IC FPGA 240 I/O 363FCBGA

• Number of LABs/CLBs: 1368
• Number of Logic Elements/Cells: 12312
• Total RAM Bits: 663552
• Number of I/O: 240
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 363-FBGA, FCBGA
• Supplier Device Package: 363-FCBGA (17x17)

package: 363-FBGA, FCBGA

XC2VP4-5FG256I

Xilinx Inc.

IC FPGA 140 I/O 256FGBGA

• Number of LABs/CLBs: 752
• Number of Logic Elements/Cells: 6768
• Total RAM Bits: 516096
• Number of I/O: 140
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

package: 256-BGA

XA3S1600E-4FGG484I

Xilinx Inc.

IC FPGA 376 I/O 1484FBGA

• Number of LABs/CLBs: 3688
• Number of Logic Elements/Cells: 33192
• Total RAM Bits: 663552
• Number of I/O: 376
• Number of Gates: 1600000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BBGA

XC3S2000-4FGG900I

Xilinx Inc.

IC FPGA 565 I/O 900FBGA

• Number of LABs/CLBs: 5120
• Number of Logic Elements/Cells: 46080
• Total RAM Bits: 737280
• Number of I/O: 565
• Number of Gates: 2000000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 900-BBGA
• Supplier Device Package: 900-FBGA (31x31)

package: 900-BBGA

XA3S200A-4FTG256I

Xilinx Inc.

IC FPGA 195 I/O 256FBGA

• Number of LABs/CLBs: 448
• Number of Logic Elements/Cells: 4032
• Total RAM Bits: 294912
• Number of I/O: 195
• Number of Gates: 200000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

package: 256-LBGA

XA6SLX9-3CSG225Q

Xilinx Inc.

IC FPGA 160 I/O 225CSGBGA

• Number of LABs/CLBs: 715
• Number of Logic Elements/Cells: 9152
• Total RAM Bits: 589824
• Number of I/O: 160
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 225-LFBGA, CSPBGA
• Supplier Device Package: 225-CSPBGA (13x13)

package: 225-LFBGA, CSPBGA

XC9572-7PC44C

Xilinx Inc.

IC CPLD 72MC 7.5NS 44PLCC

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 72
• Number of Gates: 1600
• Number of I/O: 34
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

package: 44-LCC (J-Lead)

XC95288-15HQ208I

Xilinx Inc.

IC CPLD 288MC 15NS 208HQFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 15.0ns
• Voltage Supply - Internal: 4.5 V ~ 5.5 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 288
• Number of Gates: 6400
• Number of I/O: 168
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 208-BFQFP Exposed Pad
• Supplier Device Package: 208-PQFP (28x28)

package: 208-BFQFP Exposed Pad

XCVU9P-2FLGA2577E

Xilinx Inc.

IC FPGA VIRTEX-UP 2577FCBGA

• Number of LABs/CLBs: 147780
• Number of Logic Elements/Cells: 2586150
• Total RAM Bits: 391168000
• Number of I/O: 448
• Number of Gates: -
• Voltage - Supply: 0.825 V ~ 0.876 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2577-BBGA, FCBGA
• Supplier Device Package: 2577-FCBGA (52.5x52.5)

package: 2577-BBGA, FCBGA