Xilinx Inc. Producten

XCMECH-FF1152

Xilinx Inc.

FF1152 MECHANICAL SAMPLE

• Type: Mechanical Sample
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

XC17S10PD8C

Xilinx Inc.

IC PROM PROG C-TEMP 3.3V 8-DIP

• Programmable Type: OTP
• Memory Size: 100kb
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

package: 8-DIP (0.300", 7.62mm)

XCZU9EG-1FFVB1156E

Xilinx Inc.

IC FPGA 328 I/O 1156FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XCZU5EG-1SFVC784E

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 784-FCBGA (23x23)

package: 784-BBGA, FCBGA

XCZU2CG-L1SFVC784I

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 784-FCBGA (23x23)

package: 784-BBGA, FCBGA

XC2V1500-4BG575I

Xilinx Inc.

IC FPGA 392 I/O 575BGA

• Number of LABs/CLBs: 1920
• Number of Logic Elements/Cells: -
• Total RAM Bits: 884736
• Number of I/O: 392
• Number of Gates: 1500000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 575-BBGA
• Supplier Device Package: 575-BGA (31x31)

package: 575-BBGA

XC2V8000-5FFG1517I

Xilinx Inc.

IC FPGA 1108 I/O 1517FCBGA

• Number of LABs/CLBs: 11648
• Number of Logic Elements/Cells: -
• Total RAM Bits: 3096576
• Number of I/O: 1108
• Number of Gates: 8000000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

package: 1517-BBGA, FCBGA

XC2V500-5FGG256C

Xilinx Inc.

IC FPGA 172 I/O 256FBGA

• Number of LABs/CLBs: 768
• Number of Logic Elements/Cells: -
• Total RAM Bits: 589824
• Number of I/O: 172
• Number of Gates: 500000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

package: 256-BGA

XCV100E-6FG256I

Xilinx Inc.

IC FPGA 176 I/O 256FBGA

• Number of LABs/CLBs: 600
• Number of Logic Elements/Cells: 2700
• Total RAM Bits: 81920
• Number of I/O: 176
• Number of Gates: 128236
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

package: 256-BGA

XCS05-3VQ100I

Xilinx Inc.

IC FPGA 77 I/O 100VQFP

• Number of LABs/CLBs: 100
• Number of Logic Elements/Cells: 238
• Total RAM Bits: 3200
• Number of I/O: 77
• Number of Gates: 5000
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 100-TQFP
• Supplier Device Package: 100-VQFP (14x14)

package: 100-TQFP

XC4036XL-1BG432C

Xilinx Inc.

IC FPGA 288 I/O 432MBGA

• Number of LABs/CLBs: 1296
• Number of Logic Elements/Cells: 3078
• Total RAM Bits: 41472
• Number of I/O: 288
• Number of Gates: 36000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 432-LBGA, Metal
• Supplier Device Package: 432-MBGA (40x40)

package: 432-LBGA, Metal

XC6VLX365T-3FF1156C

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

• Number of LABs/CLBs: 28440
• Number of Logic Elements/Cells: 364032
• Total RAM Bits: 15335424
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XC6VSX315T-3FF1156C

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

• Number of LABs/CLBs: 24600
• Number of Logic Elements/Cells: 314880
• Total RAM Bits: 25952256
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XQ5VLX110-1EF676I

Xilinx Inc.

IC FPGA VIRTEX-5FX 110K 676-FBGA

• Number of LABs/CLBs: 8640
• Number of Logic Elements/Cells: 110592
• Total RAM Bits: 4718592
• Number of I/O: 440
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XC4VLX60-12FF668C

Xilinx Inc.

IC FPGA 448 I/O 668FCBGA

• Number of LABs/CLBs: 6656
• Number of Logic Elements/Cells: 59904
• Total RAM Bits: 2949120
• Number of I/O: 448
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 668-BBGA, FCBGA
• Supplier Device Package: 668-FCBGA (27x27)

package: 668-BBGA, FCBGA

XC2VP20-5FGG676C

Xilinx Inc.

IC FPGA 404 I/O 676FBGA

• Number of LABs/CLBs: 2320
• Number of Logic Elements/Cells: 20880
• Total RAM Bits: 1622016
• Number of I/O: 404
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BGA
• Supplier Device Package: 676-FBGA (27x27)

package: 676-BGA

XC4VLX15-12SF363C

Xilinx Inc.

IC FPGA 240 I/O 363FCBGA

• Number of LABs/CLBs: 1536
• Number of Logic Elements/Cells: 13824
• Total RAM Bits: 884736
• Number of I/O: 240
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 363-FBGA, FCBGA
• Supplier Device Package: 363-FCBGA (17x17)

package: 363-FBGA, FCBGA

XC6SLX100T-3FG676I

Xilinx Inc.

IC FPGA 376 I/O 676FCBGA

• Number of LABs/CLBs: 7911
• Number of Logic Elements/Cells: 101261
• Total RAM Bits: 4939776
• Number of I/O: 376
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XC3S1600E-4FGG400I

Xilinx Inc.

IC FPGA 304 I/O 400FBGA

• Number of LABs/CLBs: 3688
• Number of Logic Elements/Cells: 33192
• Total RAM Bits: 663552
• Number of I/O: 304
• Number of Gates: 1600000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 400-BGA
• Supplier Device Package: 400-FBGA (21x21)

package: 400-BGA

XC3SD1800A-5FGG676C

Xilinx Inc.

IC FPGA 519 I/O 676FBGA

• Number of LABs/CLBs: 4160
• Number of Logic Elements/Cells: 37440
• Total RAM Bits: 1548288
• Number of I/O: 519
• Number of Gates: 1800000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BGA
• Supplier Device Package: 676-FBGA (27x27)

package: 676-BGA

XC3S1600E-4FG320I

Xilinx Inc.

IC FPGA 250 I/O 320FBGA

• Number of LABs/CLBs: 3688
• Number of Logic Elements/Cells: 33192
• Total RAM Bits: 663552
• Number of I/O: 250
• Number of Gates: 1600000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 320-BGA
• Supplier Device Package: 320-FBGA (19x19)

package: 320-BGA

XA3S700A-4FGG400I

Xilinx Inc.

IC FPGA 311 I/O 400FBGA

• Number of LABs/CLBs: 1472
• Number of Logic Elements/Cells: 13248
• Total RAM Bits: 368640
• Number of I/O: 311
• Number of Gates: 700000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 400-BGA
• Supplier Device Package: 400-FBGA (21x21)

package: 400-BGA

XC3S50-4VQ100I

Xilinx Inc.

IC FPGA 63 I/O 100VQFP

• Number of LABs/CLBs: 192
• Number of Logic Elements/Cells: 1728
• Total RAM Bits: 73728
• Number of I/O: 63
• Number of Gates: 50000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 100-TQFP
• Supplier Device Package: 100-VQFP (14x14)

package: 100-TQFP

XC3S1400A-4FTG256C

Xilinx Inc.

IC FPGA 161 I/O 256FTBGA

• Number of LABs/CLBs: 2816
• Number of Logic Elements/Cells: 25344
• Total RAM Bits: 589824
• Number of I/O: 161
• Number of Gates: 1400000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

package: 256-LBGA

XC3S200-4VQG100I

Xilinx Inc.

IC FPGA 63 I/O 100VQFP

• Number of LABs/CLBs: 480
• Number of Logic Elements/Cells: 4320
• Total RAM Bits: 221184
• Number of I/O: 63
• Number of Gates: 200000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 100-TQFP
• Supplier Device Package: 100-VQFP (14x14)

package: 100-TQFP

XC9572XV-7VQ44C

Xilinx Inc.

IC CPLD 72MC 7.5NS 44VQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 2.37 V ~ 2.62 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 72
• Number of Gates: 1600
• Number of I/O: 34
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-VQFP (10x10)

package: 44-TQFP

XCR3128XL-6CSG144C

Xilinx Inc.

IC CPLD 128MC 144BGA

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 5.5ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 8
• Number of Macrocells: 128
• Number of Gates: 3000
• Number of I/O: 108
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-TFBGA, CSPBGA
• Supplier Device Package: 144-LCSBGA (12x12)

package: 144-TFBGA, CSPBGA

XCDAISY-CPG196

Xilinx Inc.

IC 196 BALL CHIP-SCALE BGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: -
• Total RAM Bits: -
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

package: -