Xilinx Inc. Producten

XCMECH-FFG1517

Xilinx Inc.

FFG1517 MECHANICAL SAMPLE

• Type: Mechanical Sample
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

XC18V512VQ44I

Xilinx Inc.

IC PROM SER I-TEMP 3.3V 44-VQFP

• Programmable Type: In System Programmable
• Memory Size: 512kb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-TQFP
• Supplier Device Package: 44-VQFP (10x10)

package: 44-TQFP

XCZU17EG-1FFVD1760I

Xilinx Inc.

IC FPGA 308 I/O 1760FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

package: 1760-BBGA, FCBGA

XCZU5CG-L1SFVC784I

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 784-FCBGA (23x23)

package: 784-BBGA, FCBGA

XC7Z035-1FFG676C

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676BGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 667MHz
• Primary Attributes: Kintex?-7 FPGA, 275K Logic Cells
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XCV600E-7FG900C

Xilinx Inc.

IC FPGA 512 I/O 900FBGA

• Number of LABs/CLBs: 3456
• Number of Logic Elements/Cells: 15552
• Total RAM Bits: 294912
• Number of I/O: 512
• Number of Gates: 985882
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 900-BBGA
• Supplier Device Package: 900-FBGA (31x31)

package: 900-BBGA

XCV50E-7FG256C

Xilinx Inc.

IC FPGA 176 I/O 256FBGA

• Number of LABs/CLBs: 384
• Number of Logic Elements/Cells: 1728
• Total RAM Bits: 65536
• Number of I/O: 176
• Number of Gates: 71693
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

package: 256-BGA

XCV2600E-8FG1156C

Xilinx Inc.

IC FPGA 804 I/O 1156FBGA

• Number of LABs/CLBs: 12696
• Number of Logic Elements/Cells: 57132
• Total RAM Bits: 753664
• Number of I/O: 804
• Number of Gates: 3263755
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1156-BBGA
• Supplier Device Package: 1156-FBGA (35x35)

package: 1156-BBGA

XCV200-4BG352C

Xilinx Inc.

IC FPGA 260 I/O 352MBGA

• Number of LABs/CLBs: 1176
• Number of Logic Elements/Cells: 5292
• Total RAM Bits: 57344
• Number of I/O: 260
• Number of Gates: 236666
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 352-LBGA, Metal
• Supplier Device Package: 352-MBGA (35x35)

package: 352-LBGA, Metal

XCS40XL-4CS280C

Xilinx Inc.

IC FPGA 224 I/O 280CSBGA

• Number of LABs/CLBs: 784
• Number of Logic Elements/Cells: 1862
• Total RAM Bits: 25088
• Number of I/O: 224
• Number of Gates: 40000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 280-TFBGA, CSPBGA
• Supplier Device Package: 280-CSBGA (16x16)

package: 280-TFBGA, CSPBGA

XC4010E-2PG191C

Xilinx Inc.

IC FPGA 160 I/O 191CPGA

• Number of LABs/CLBs: 400
• Number of Logic Elements/Cells: 950
• Total RAM Bits: 12800
• Number of I/O: 160
• Number of Gates: 10000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Through Hole
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 191-BCPGA
• Supplier Device Package: 191-CPGA (47.25x47.25)

package: 191-BCPGA

XCVU125-2FLVD1517I

Xilinx Inc.

IC FPGA 338 I/O 1517FCBGA

• Number of LABs/CLBs: 89520
• Number of Logic Elements/Cells: 1566600
• Total RAM Bits: 90726400
• Number of I/O: 338
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 0.979 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

package: 1517-BBGA, FCBGA

XQ6VSX315T-2RF1759I

Xilinx Inc.

IC FPGA VIRTEX 6 314K 1759-BGA

• Number of LABs/CLBs: 24600
• Number of Logic Elements/Cells: 314880
• Total RAM Bits: 25952256
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1759-FCBGA (42.5x42.5)

package: 1760-BBGA, FCBGA

XC2VP70-6FF1517I

Xilinx Inc.

IC FPGA 964 I/O 1517FCBGA

• Number of LABs/CLBs: 8272
• Number of Logic Elements/Cells: 74448
• Total RAM Bits: 6045696
• Number of I/O: 964
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

package: 1517-BBGA, FCBGA

XC6VLX240T-L1FFG1759C

Xilinx Inc.

IC FPGA 720 I/O 1759FCBGA

• Number of LABs/CLBs: 18840
• Number of Logic Elements/Cells: 241152
• Total RAM Bits: 15335424
• Number of I/O: 720
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1759-FCBGA (42.5x42.5)

package: 1760-BBGA, FCBGA

XQ6VLX130T-L1FFG1156I

Xilinx Inc.

IC FPGA VIRTEX 6 128K 1156-BGA

• Number of LABs/CLBs: 10000
• Number of Logic Elements/Cells: 128000
• Total RAM Bits: 9732096
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.91 V ~ 0.97 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XC5VLX50T-2FF1136C

Xilinx Inc.

IC FPGA 480 I/O 1136FCBGA

• Number of LABs/CLBs: 3600
• Number of Logic Elements/Cells: 46080
• Total RAM Bits: 2211840
• Number of I/O: 480
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1136-BBGA, FCBGA
• Supplier Device Package: 1136-FCBGA (35x35)

package: 1136-BBGA, FCBGA

XC3S4000-5FG900C

Xilinx Inc.

IC FPGA 633 I/O 900FBGA

• Number of LABs/CLBs: 6912
• Number of Logic Elements/Cells: 62208
• Total RAM Bits: 1769472
• Number of I/O: 633
• Number of Gates: 4000000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 900-BBGA
• Supplier Device Package: 900-FBGA (31x31)

package: 900-BBGA

XC3S5000-4FGG676I

Xilinx Inc.

IC FPGA 489 I/O 676FBGA

• Number of LABs/CLBs: 8320
• Number of Logic Elements/Cells: 74880
• Total RAM Bits: 1916928
• Number of I/O: 489
• Number of Gates: 5000000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BGA
• Supplier Device Package: 676-FBGA (27x27)

package: 676-BGA

XC3S500E-4FG320C

Xilinx Inc.

IC FPGA 232 I/O 320FBGA

• Number of LABs/CLBs: 1164
• Number of Logic Elements/Cells: 10476
• Total RAM Bits: 368640
• Number of I/O: 232
• Number of Gates: 500000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 320-BGA
• Supplier Device Package: 320-FBGA (19x19)

package: 320-BGA

XA6SLX16-2CSG324I

Xilinx Inc.

IC FPGA 232 I/O 324CSGBGA

• Number of LABs/CLBs: 1139
• Number of Logic Elements/Cells: 14579
• Total RAM Bits: 589824
• Number of I/O: 232
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 324-LFBGA, CSPBGA
• Supplier Device Package: 324-CSPBGA (15x15)

package: 324-LFBGA, CSPBGA

XC3S400A-5FTG256C

Xilinx Inc.

IC FPGA 195 I/O 256FTBGA

• Number of LABs/CLBs: 896
• Number of Logic Elements/Cells: 8064
• Total RAM Bits: 368640
• Number of I/O: 195
• Number of Gates: 400000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

package: 256-LBGA

XC7K410T-1FBG676C

Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

• Number of LABs/CLBs: 31775
• Number of Logic Elements/Cells: 406720
• Total RAM Bits: 29306880
• Number of I/O: 400
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XC9536-5VQ44C

Xilinx Inc.

IC CPLD 36MC 5NS 44VQFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 5.0ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 36
• Number of Gates: 800
• Number of I/O: 34
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-VQFP (10x10)

package: 44-TQFP

XC2C512-7FTG256I

Xilinx Inc.

IC CPLD 512MC 7.1NS 256FTBGA

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 7.1ns
• Voltage Supply - Internal: 1.7 V ~ 1.9 V
• Number of Logic Elements/Blocks: 32
• Number of Macrocells: 512
• Number of Gates: 12000
• Number of I/O: 212
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

package: 256-LBGA

XCR3064XL-10CS48C

Xilinx Inc.

IC CPLD 64MC 9.1NS 48CSP

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 9.1ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 64
• Number of Gates: 1500
• Number of I/O: 40
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-FBGA, CSPBGA
• Supplier Device Package: 48-CSBGA (7x7)

package: 48-FBGA, CSPBGA

XCR3032XL-10CS48I

Xilinx Inc.

IC CPLD 32MC 9.1NS 48CSP

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 9.1ns
• Voltage Supply - Internal: 2.7 V ~ 3.6 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 32
• Number of Gates: 750
• Number of I/O: 36
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-FBGA, CSPBGA
• Supplier Device Package: 48-CSBGA (7x7)

package: 48-FBGA, CSPBGA

XAZU3EG-1SFVA625Q

Xilinx Inc.

XAZU3EG-1SFVA625Q

• Architecture: -
• Core Processor: -
• Flash Size: -
• RAM Size: -
• Peripherals: -
• Connectivity: -
• Speed: -
• Primary Attributes: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

package: -