Xilinx Inc. Producten

XC1736EPC20C

Xilinx Inc.

IC PROM SER C-TEMP 36K 20-PLCC

• Programmable Type: OTP
• Memory Size: 36kb
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 20-LCC (J-Lead)
• Supplier Device Package: 20-PLCC (9x9)

package: 20-LCC (J-Lead)

XCZU15EG-3FFVB1156E

Xilinx Inc.

IC FPGA 328 I/O 1156FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 747K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XCZU7EV-2FFVC1156E

Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XCZU7EV-1FFVF1517I

Xilinx Inc.

IC FPGA 464 I/O 1517FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

package: 1517-BBGA, FCBGA

XCZU9CG-1FFVC900E

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

package: 900-BBGA, FCBGA

XCV800-5BG560I

Xilinx Inc.

IC FPGA 404 I/O 560MBGA

• Number of LABs/CLBs: 4704
• Number of Logic Elements/Cells: 21168
• Total RAM Bits: 114688
• Number of I/O: 404
• Number of Gates: 888439
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 560-LBGA, Metal
• Supplier Device Package: 560-MBGA (42.5x42.5)

package: 560-LBGA, Metal

XCV800-4FG676I

Xilinx Inc.

IC FPGA 444 I/O 676FBGA

• Number of LABs/CLBs: 4704
• Number of Logic Elements/Cells: 21168
• Total RAM Bits: 114688
• Number of I/O: 444
• Number of Gates: 888439
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XCV1600E-6FG1156C

Xilinx Inc.

IC FPGA 724 I/O 1156FBGA

• Number of LABs/CLBs: 7776
• Number of Logic Elements/Cells: 34992
• Total RAM Bits: 589824
• Number of I/O: 724
• Number of Gates: 2188742
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1156-BBGA
• Supplier Device Package: 1156-FBGA (35x35)

package: 1156-BBGA

XC4036XL-2HQ304C

Xilinx Inc.

IC FPGA 256 I/O 304HQFP

• Number of LABs/CLBs: 1296
• Number of Logic Elements/Cells: 3078
• Total RAM Bits: 41472
• Number of I/O: 256
• Number of Gates: 36000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 304-BFQFP Exposed Pad
• Supplier Device Package: 304-PQFP (40x40)

package: 304-BFQFP Exposed Pad

XC4013E-4BG225I

Xilinx Inc.

IC FPGA 192 I/O 225BGA

• Number of LABs/CLBs: 576
• Number of Logic Elements/Cells: 1368
• Total RAM Bits: 18432
• Number of I/O: 192
• Number of Gates: 13000
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 225-BBGA
• Supplier Device Package: 225-PBGA (27x27)

package: 225-BBGA

XC4010XL-2PQ208I

Xilinx Inc.

IC FPGA 160 I/O 208QFP

• Number of LABs/CLBs: 400
• Number of Logic Elements/Cells: 950
• Total RAM Bits: 12800
• Number of I/O: 160
• Number of Gates: 10000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

package: 208-BFQFP

XC4010XL-1PC84C

Xilinx Inc.

IC FPGA 61 I/O 84PLCC

• Number of LABs/CLBs: 400
• Number of Logic Elements/Cells: 950
• Total RAM Bits: 12800
• Number of I/O: 61
• Number of Gates: 10000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 84-LCC (J-Lead)
• Supplier Device Package: 84-PLCC (29.31x29.31)

package: 84-LCC (J-Lead)

XC4006E-3PC84I

Xilinx Inc.

IC FPGA 61 I/O 84PLCC

• Number of LABs/CLBs: 256
• Number of Logic Elements/Cells: 608
• Total RAM Bits: 8192
• Number of I/O: 61
• Number of Gates: 6000
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 84-LCC (J-Lead)
• Supplier Device Package: 84-PLCC (29.31x29.31)

package: 84-LCC (J-Lead)

XCS40XL-4PQ240C

Xilinx Inc.

IC FPGA 192 I/O 240QFP

• Number of LABs/CLBs: 784
• Number of Logic Elements/Cells: 1862
• Total RAM Bits: 25088
• Number of I/O: 192
• Number of Gates: 40000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 240-BFQFP
• Supplier Device Package: 240-PQFP (32x32)

package: 240-BFQFP

XC6VLX760-1FFG1760I

Xilinx Inc.

IC FPGA 1200 I/O 1760FBGA

• Number of LABs/CLBs: 59280
• Number of Logic Elements/Cells: 758784
• Total RAM Bits: 26542080
• Number of I/O: 1200
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

package: 1760-BBGA, FCBGA

XC6VHX380T-1FFG1924I

Xilinx Inc.

IC FPGA 640 I/O 1924FCBGA

• Number of LABs/CLBs: 29880
• Number of Logic Elements/Cells: 382464
• Total RAM Bits: 28311552
• Number of I/O: 640
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1924-FCBGA (45x45)

package: 1924-BBGA, FCBGA

XC5VLX50T-1FFG665I

Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

• Number of LABs/CLBs: 3600
• Number of Logic Elements/Cells: 46080
• Total RAM Bits: 2211840
• Number of I/O: 360
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 665-BBGA, FCBGA
• Supplier Device Package: 665-FCBGA (27x27)

package: 665-BBGA, FCBGA

XC4VLX40-11FFG668C

Xilinx Inc.

IC FPGA 448 I/O 668FCBGA

• Number of LABs/CLBs: 4608
• Number of Logic Elements/Cells: 41472
• Total RAM Bits: 1769472
• Number of I/O: 448
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 668-BBGA, FCBGA
• Supplier Device Package: 668-FCBGA (27x27)

package: 668-BBGA, FCBGA

XC6SLX150-3CSG484I

Xilinx Inc.

IC FPGA 338 I/O 484CSBGA

• Number of LABs/CLBs: 11519
• Number of Logic Elements/Cells: 147443
• Total RAM Bits: 4939776
• Number of I/O: 338
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-FBGA, CSPBGA
• Supplier Device Package: 484-CSPBGA (19x19)

package: 484-FBGA, CSPBGA

XC6SLX100-3FG484I

Xilinx Inc.

IC FPGA 326 I/O 484FBGA

• Number of LABs/CLBs: 7911
• Number of Logic Elements/Cells: 101261
• Total RAM Bits: 4939776
• Number of I/O: 326
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BBGA

XC6SLX45-L1CSG324I

Xilinx Inc.

IC FPGA 218 I/O 324CSBGA

• Number of LABs/CLBs: 3411
• Number of Logic Elements/Cells: 43661
• Total RAM Bits: 2138112
• Number of I/O: 218
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 324-LFBGA, CSPBGA
• Supplier Device Package: 324-CSPBGA (15x15)

package: 324-LFBGA, CSPBGA

XC7A35T-L1CSG325I

Xilinx Inc.

IC FPGA 150 I/O 325CSBGA

• Number of LABs/CLBs: 2600
• Number of Logic Elements/Cells: 33208
• Total RAM Bits: 1843200
• Number of I/O: 150
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 324-LFBGA, CSPBGA
• Supplier Device Package: 325-CSBGA (15x15)

package: 324-LFBGA, CSPBGA

XC7S50-2CSGA324C

Xilinx Inc.

XC7S50-2CSGA324C

• Number of LABs/CLBs: 4075
• Number of Logic Elements/Cells: 52160
• Total RAM Bits: 2764800
• Number of I/O: 210
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: -
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 324-LFBGA, CSPBGA
• Supplier Device Package: 324-CSPBGA (15x15)

package: 324-LFBGA, CSPBGA

XC95288XL-7FGG256I

Xilinx Inc.

IC CPLD 288MC 7.5NS 256FBGA

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 288
• Number of Gates: 6400
• Number of I/O: 192
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

package: 256-BGA

XA2C32A-7VQG44Q

Xilinx Inc.

IC CPLD 32MC 5.5NS 44VQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 5.5ns
• Voltage Supply - Internal: 1.7 V ~ 1.9 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 32
• Number of Gates: 750
• Number of I/O: 33
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-VQFP (10x10)

package: 44-TQFP

XC2C32A-6QFG32I

Xilinx Inc.

IC CPLD 32MC 5.5NS 32QFN

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 5.5ns
• Voltage Supply - Internal: 1.7 V ~ 1.9 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 32
• Number of Gates: 750
• Number of I/O: 21
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN (5x5)

package: 32-VFQFN Exposed Pad

XCVU095-H1FFVC1517E

Xilinx Inc.

IC FPGA VIRTEX-U 1517FCBGA

• Number of LABs/CLBs: 67200
• Number of Logic Elements/Cells: 1176000
• Total RAM Bits: 62259200
• Number of I/O: 520
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 1.030 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

package: 1517-BBGA, FCBGA

XCKU15P-2FFVE1760E

Xilinx Inc.

XCKU15P-2FFVE1760E

• Number of LABs/CLBs: 65340
• Number of Logic Elements/Cells: 1143450
• Total RAM Bits: 82329600
• Number of I/O: 668
• Number of Gates: -
• Voltage - Supply: 0.825 V ~ 0.876 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

package: 1760-BBGA, FCBGA