Xilinx Inc. Producten

XC1765ESO8I

Xilinx Inc.

IC SER CFG PROM 65K 8-SOIC

• Programmable Type: OTP
• Memory Size: 65kb
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

package: 8-SOIC (0.154", 3.90mm Width)

XCZU19EG-3FFVE1924E

Xilinx Inc.

IC FPGA 668 I/O 1924FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1924-FCBGA (45x45)

package: 1924-BBGA, FCBGA

XC7Z030-1SBG485I

Xilinx Inc.

IC SOC CORTEX A-9 ZYNQ7 485BGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 667MHz
• Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-FBGA
• Supplier Device Package: 485-FBGA (19x19)

package: 484-FBGA

XC7Z014S-1CLG484I

Xilinx Inc.

IC FPGA SOC 200I/O 484BGA

• Architecture: MCU, FPGA
• Core Processor: Single ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 667MHz
• Primary Attributes: Artix?-7 FPGA, 65K Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-LFBGA, CSPBGA
• Supplier Device Package: 484-CSPBGA (19x19)

package: 484-LFBGA, CSPBGA

XC3S4000L-4FGG900C

Xilinx Inc.

IC FPGA 633 I/O 900FBGA

• Number of LABs/CLBs: 1728
• Number of Logic Elements/Cells: 62208
• Total RAM Bits: 1769472
• Number of I/O: 633
• Number of Gates: 4000000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 900-BBGA
• Supplier Device Package: 900-FBGA (31x31)

package: 900-BBGA

XCV300-5FG456C

Xilinx Inc.

IC FPGA 312 I/O 456FBGA

• Number of LABs/CLBs: 1536
• Number of Logic Elements/Cells: 6912
• Total RAM Bits: 65536
• Number of I/O: 312
• Number of Gates: 322970
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 456-BBGA
• Supplier Device Package: 456-FBGA (23x23)

package: 456-BBGA

XCS40XL-5PQ240C

Xilinx Inc.

IC FPGA 192 I/O 240QFP

• Number of LABs/CLBs: 784
• Number of Logic Elements/Cells: 1862
• Total RAM Bits: 25088
• Number of I/O: 192
• Number of Gates: 40000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 240-BFQFP
• Supplier Device Package: 240-PQFP (32x32)

package: 240-BFQFP

XC4025E-3HQ240C

Xilinx Inc.

IC FPGA 193 I/O 240HQFP

• Number of LABs/CLBs: 1024
• Number of Logic Elements/Cells: 2432
• Total RAM Bits: 32768
• Number of I/O: 193
• Number of Gates: 25000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 240-BFQFP Exposed Pad
• Supplier Device Package: 240-PQFP (32x32)

package: 240-BFQFP Exposed Pad

XC6VHX380T-2FF1924E

Xilinx Inc.

IC FPGA 640 I/O 1924FCBGA

• Number of LABs/CLBs: 29880
• Number of Logic Elements/Cells: 382464
• Total RAM Bits: 28311552
• Number of I/O: 640
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1924-FCBGA (45x45)

package: 1924-BBGA, FCBGA

XC6VHX380T-1FF1155I

Xilinx Inc.

IC FPGA 440 I/O 1156FCBGA

• Number of LABs/CLBs: 29880
• Number of Logic Elements/Cells: 382464
• Total RAM Bits: 28311552
• Number of I/O: 440
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XC7V585T-L2FFG1761E

Xilinx Inc.

IC FPGA 850 I/O 1761FCBGA

• Number of LABs/CLBs: 45525
• Number of Logic Elements/Cells: 582720
• Total RAM Bits: 29306880
• Number of I/O: 850
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1761-FCBGA (42.5x42.5)

package: 1760-BBGA, FCBGA

XC5VLX220-1FFG1760I

Xilinx Inc.

IC FPGA 800 I/O 1760FBGA

• Number of LABs/CLBs: 17280
• Number of Logic Elements/Cells: 221184
• Total RAM Bits: 7077888
• Number of I/O: 800
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

package: 1760-BBGA, FCBGA

XC5VFX130T-1FF1738I

Xilinx Inc.

IC FPGA 840 I/O 1738FCBGA

• Number of LABs/CLBs: 10240
• Number of Logic Elements/Cells: 131072
• Total RAM Bits: 10985472
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1738-BBGA, FCBGA
• Supplier Device Package: 1738-FCBGA (42.5x42.5)

package: 1738-BBGA, FCBGA

XC7VX415T-1FFG1157I

Xilinx Inc.

IC FPGA 600 I/O 1157FCBGA

• Number of LABs/CLBs: 32200
• Number of Logic Elements/Cells: 412160
• Total RAM Bits: 32440320
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1157-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XC5VLX110-1FF1760I

Xilinx Inc.

IC FPGA 800 I/O 1760FBGA

• Number of LABs/CLBs: 8640
• Number of Logic Elements/Cells: 110592
• Total RAM Bits: 4718592
• Number of I/O: 800
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

package: 1760-BBGA, FCBGA

XC2VP40-5FG676I

Xilinx Inc.

IC FPGA 416 I/O 676FBGA

• Number of LABs/CLBs: 4848
• Number of Logic Elements/Cells: 43632
• Total RAM Bits: 3538944
• Number of I/O: 416
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XC6VCX130T-1FF484C

Xilinx Inc.

IC FPGA 240 I/O 484FCBGA

• Number of LABs/CLBs: 10000
• Number of Logic Elements/Cells: 128000
• Total RAM Bits: 9732096
• Number of I/O: 240
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA, FCBGA
• Supplier Device Package: 484-FCBGA (23x23)

package: 484-BBGA, FCBGA

XC4VLX40-10FF1148C

Xilinx Inc.

IC FPGA 640 I/O 1148FCBGA

• Number of LABs/CLBs: 4608
• Number of Logic Elements/Cells: 41472
• Total RAM Bits: 1769472
• Number of I/O: 640
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1148-BBGA, FCBGA
• Supplier Device Package: 1148-FCPBGA (35x35)

package: 1148-BBGA, FCBGA

XC2VP4-5FF672I

Xilinx Inc.

IC FPGA 348 I/O 672FCBGA

• Number of LABs/CLBs: 752
• Number of Logic Elements/Cells: 6768
• Total RAM Bits: 516096
• Number of I/O: 348
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FCBGA (27x27)

package: 672-BBGA, FCBGA

XQ6SLX75T-2CS484I

Xilinx Inc.

IC FPGA SPARTAN 6 75K 484BGA

• Number of LABs/CLBs: 5831
• Number of Logic Elements/Cells: 74637
• Total RAM Bits: 3170304
• Number of I/O: 292
• Number of Gates: -
• Voltage - Supply: 1.2 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-FBGA, CSPBGA
• Supplier Device Package: 484-CSPBGA (19x19)

package: 484-FBGA, CSPBGA

XC6SLX100-2FGG676I

Xilinx Inc.

IC FPGA 480 I/O 676FBGA

• Number of LABs/CLBs: 7911
• Number of Logic Elements/Cells: 101261
• Total RAM Bits: 4939776
• Number of I/O: 480
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BGA
• Supplier Device Package: 676-FBGA (27x27)

package: 676-BGA

XA7A50T-1CPG236Q

Xilinx Inc.

IC FPGA 106 I/O 236BGA

• Number of LABs/CLBs: 4075
• Number of Logic Elements/Cells: 52160
• Total RAM Bits: 2764800
• Number of I/O: 106
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 238-LFBGA, CSPBGA
• Supplier Device Package: 236-CSBGA (10x10)

package: 238-LFBGA, CSPBGA

XC3S1400A-5FTG256C

Xilinx Inc.

IC FPGA 161 I/O 256FTBGA

• Number of LABs/CLBs: 2816
• Number of Logic Elements/Cells: 25344
• Total RAM Bits: 589824
• Number of I/O: 161
• Number of Gates: 1400000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

package: 256-LBGA

XC3S200A-4FTG256I

Xilinx Inc.

IC FPGA 195 I/O 256FTBGA

• Number of LABs/CLBs: 448
• Number of Logic Elements/Cells: 4032
• Total RAM Bits: 294912
• Number of I/O: 195
• Number of Gates: 200000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

package: 256-LBGA

XC95216-10BG352I

Xilinx Inc.

IC CPLD 216MC 10NS 352BGA

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 4.5 V ~ 5.5 V
• Number of Logic Elements/Blocks: 12
• Number of Macrocells: 216
• Number of Gates: 4800
• Number of I/O: 166
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 352-LBGA, Metal
• Supplier Device Package: 352-MBGA (35x35)

package: 352-LBGA, Metal

XCR3064XL-7CPG56C

Xilinx Inc.

IC CPLD 64MC 7NS 56CSP

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 7.0ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 64
• Number of Gates: 1500
• Number of I/O: 48
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 56-LFBGA, CSPBGA
• Supplier Device Package: 56-CSBGA (6x6)

package: 56-LFBGA, CSPBGA

XC7S15-2FTGB196C

Xilinx Inc.

XC7S15-2FTGB196C

• Number of LABs/CLBs: 1000
• Number of Logic Elements/Cells: 12800
• Total RAM Bits: 368640
• Number of I/O: 100
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 196-LBGA, CSPBGA
• Supplier Device Package: 196-CSBGA (15x15)

package: 196-LBGA, CSPBGA

XCKU095-1FFVA1156I

Xilinx Inc.

IC FPGA KINTEX-U 1156FCBGA

• Number of LABs/CLBs: 67200
• Number of Logic Elements/Cells: 1176000
• Total RAM Bits: 60518400
• Number of I/O: 520
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 0.979 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA