Xilinx Inc. Producten

XC17S20XLVOG8C

Xilinx Inc.

IC PROM SERIAL 3.3V 200K 8-SOIC

• Programmable Type: OTP
• Memory Size: 200kb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-TSOP

package: 8-SOIC (0.154", 3.90mm Width)

XCZU7CG-L2FFVF1517E

Xilinx Inc.

IC FPGA 464 I/O 1517FCBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

package: 1517-BBGA, FCBGA

XCZU7EV-L2FBVB900E

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

package: 900-BBGA, FCBGA

XCZU7CG-2FFVC1156E

Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XCZU6CG-L2FFVC900E

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 469K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

package: 900-BBGA, FCBGA

XC4028XL-09BG256C

Xilinx Inc.

IC FPGA 205 I/O 256BGA

• Number of LABs/CLBs: 1024
• Number of Logic Elements/Cells: 2432
• Total RAM Bits: 32768
• Number of I/O: 205
• Number of Gates: 28000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (27x27)

package: 256-BBGA

XC6VLX760-2FFG1760C

Xilinx Inc.

IC FPGA 1200 I/O 1760FBGA

• Number of LABs/CLBs: 59280
• Number of Logic Elements/Cells: 758784
• Total RAM Bits: 26542080
• Number of I/O: 1200
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

package: 1760-BBGA, FCBGA

XC6VSX475T-2FFG1759C

Xilinx Inc.

IC FPGA 840 I/O 1759FCBGA

• Number of LABs/CLBs: 37200
• Number of Logic Elements/Cells: 476160
• Total RAM Bits: 39223296
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1759-FCBGA (42.5x42.5)

package: 1760-BBGA, FCBGA

XC5VTX150T-1FFG1759I

Xilinx Inc.

IC FPGA 680 I/O 1759FCBGA

• Number of LABs/CLBs: 11600
• Number of Logic Elements/Cells: 148480
• Total RAM Bits: 8404992
• Number of I/O: 680
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1759-FCBGA (42.5x42.5)

package: 1760-BBGA, FCBGA

XC5VSX95T-2FF1136I

Xilinx Inc.

IC FPGA 640 I/O 1136FCBGA

• Number of LABs/CLBs: 7360
• Number of Logic Elements/Cells: 94208
• Total RAM Bits: 8994816
• Number of I/O: 640
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1136-BBGA, FCBGA
• Supplier Device Package: 1136-FCBGA (35x35)

package: 1136-BBGA, FCBGA

XC5VLX155T-2FFG1136I

Xilinx Inc.

IC FPGA 640 I/O 1136FCBGA

• Number of LABs/CLBs: 12160
• Number of Logic Elements/Cells: 155648
• Total RAM Bits: 7815168
• Number of I/O: 640
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1136-BBGA, FCBGA
• Supplier Device Package: 1136-FCBGA (35x35)

package: 1136-BBGA, FCBGA

XC7K480T-L2FFG1156I

Xilinx Inc.

IC FPGA 400 I/O 1156FCBGA

• Number of LABs/CLBs: 37325
• Number of Logic Elements/Cells: 477760
• Total RAM Bits: 35205120
• Number of I/O: 400
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XCKU115-1FLVA2104C

Xilinx Inc.

IC FPGA 832 I/O 2104FCBGA

• Number of LABs/CLBs: 82920
• Number of Logic Elements/Cells: 1451100
• Total RAM Bits: 77721600
• Number of I/O: 832
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 0.979 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (47.5x47.5)

package: 2104-BBGA, FCBGA

XC7K410T-L2FBG676E

Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

• Number of LABs/CLBs: 31775
• Number of Logic Elements/Cells: 406720
• Total RAM Bits: 29306880
• Number of I/O: 400
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XC4VFX60-11FFG672I

Xilinx Inc.

IC FPGA 352 I/O 672FCBGA

• Number of LABs/CLBs: 6320
• Number of Logic Elements/Cells: 56880
• Total RAM Bits: 4276224
• Number of I/O: 352
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FCBGA (27x27)

package: 672-BBGA, FCBGA

XC6VCX75T-2FFG484I

Xilinx Inc.

IC FPGA 240 I/O 484FCBGA

• Number of LABs/CLBs: 5820
• Number of Logic Elements/Cells: 74496
• Total RAM Bits: 5750784
• Number of I/O: 240
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BBGA

XC2VP7-5FF896C

Xilinx Inc.

IC FPGA 396 I/O 896FCBGA

• Number of LABs/CLBs: 1232
• Number of Logic Elements/Cells: 11088
• Total RAM Bits: 811008
• Number of I/O: 396
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 896-BBGA, FCBGA
• Supplier Device Package: 896-FCBGA (31x31)

package: 896-BBGA, FCBGA

XC7A50T-2FG484I

Xilinx Inc.

IC FPGA 250 I/O 484FCBGA

• Number of LABs/CLBs: 4075
• Number of Logic Elements/Cells: 52160
• Total RAM Bits: 2764800
• Number of I/O: 250
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BBGA

XA6SLX45-3CSG484I

Xilinx Inc.

IC FPGA 320 I/O 484BGA

• Number of LABs/CLBs: 3411
• Number of Logic Elements/Cells: 43661
• Total RAM Bits: 2138112
• Number of I/O: 320
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-FBGA, CSPBGA
• Supplier Device Package: 484-CSPBGA (19x19)

package: 484-FBGA, CSPBGA

XA3S250E-4FTG256Q

Xilinx Inc.

IC FPGA 172 I/O 256FTBGA

• Number of LABs/CLBs: 612
• Number of Logic Elements/Cells: 5508
• Total RAM Bits: 221184
• Number of I/O: 172
• Number of Gates: 250000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

package: 256-LBGA

XA3S200-4FTG256I

Xilinx Inc.

IC FPGA 173 I/O 256FTBGA

• Number of LABs/CLBs: 480
• Number of Logic Elements/Cells: 4320
• Total RAM Bits: 221184
• Number of I/O: 173
• Number of Gates: 200000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

package: 256-LBGA

XC3S200AN-4FT256C

Xilinx Inc.

IC FPGA 195 I/O 256FTBGA

• Number of LABs/CLBs: 448
• Number of Logic Elements/Cells: 4032
• Total RAM Bits: 294912
• Number of I/O: 195
• Number of Gates: 200000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

package: 256-LBGA

XC7K410T-2FFG900I

Xilinx Inc.

IC FPGA 500 I/O 900FCBGA

• Number of LABs/CLBs: 31775
• Number of Logic Elements/Cells: 406720
• Total RAM Bits: 29306880
• Number of I/O: 500
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

package: 900-BBGA, FCBGA

XC7K70T-1FBG676C

Xilinx Inc.

IC FPGA 300 I/O 676FCBGA

• Number of LABs/CLBs: 5125
• Number of Logic Elements/Cells: 65600
• Total RAM Bits: 4976640
• Number of I/O: 300
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XC9536XL-7VQG64I

Xilinx Inc.

IC CPLD 36MC 7.5NS 64VQFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 36
• Number of Gates: 800
• Number of I/O: 36
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP
• Supplier Device Package: 64-VQFP (10x10)

package: 64-TQFP

XC95288XL-10PQG208C

Xilinx Inc.

IC CPLD 288MC 10NS 208QFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 288
• Number of Gates: 6400
• Number of I/O: 168
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

package: 208-BFQFP

XC7A25T-2CPG238C

Xilinx Inc.

XC7A25T-2CPG238C

• Number of LABs/CLBs: 1825
• Number of Logic Elements/Cells: 23360
• Total RAM Bits: 1658880
• Number of I/O: 112
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 238-LFBGA, CSPBGA
• Supplier Device Package: 236-CSBGA (10x10)

package: 238-LFBGA, CSPBGA

XCKU5P-3FFVD900E

Xilinx Inc.

XCKU5P-3FFVD900E

• Number of LABs/CLBs: 20340
• Number of Logic Elements/Cells: 355950
• Total RAM Bits: 31641600
• Number of I/O: 304
• Number of Gates: -
• Voltage - Supply: 0.873 V ~ 0.927 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

package: 900-BBGA, FCBGA