Xilinx Inc. Producten

XCZU17EG-L1FFVE1924I

Xilinx Inc.

IC FPGA 668 I/O 1924FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1924-FCBGA (45x45)

package: 1924-BBGA, FCBGA

XCZU11EG-L2FFVB1517E

Xilinx Inc.

IC FPGA 488 I/O 1517FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

package: 1517-BBGA, FCBGA

XCZU11EG-2FFVB1517I

Xilinx Inc.

IC FPGA 488 I/O 1517FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

package: 1517-BBGA, FCBGA

XC7Z030-2FBG676E

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 800MHz
• Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XC5VLX50-1FFG676CES

Xilinx Inc.

IC FPGA 440 I/O 676FCBGA

• Number of LABs/CLBs: 3600
• Number of Logic Elements/Cells: 46080
• Total RAM Bits: 1769472
• Number of I/O: 440
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

package: 676-BBGA, FCBGA

XCV2000E-8FG1156C

Xilinx Inc.

IC FPGA 804 I/O 1156FBGA

• Number of LABs/CLBs: 9600
• Number of Logic Elements/Cells: 43200
• Total RAM Bits: 655360
• Number of I/O: 804
• Number of Gates: 2541952
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1156-BBGA
• Supplier Device Package: 1156-FBGA (35x35)

package: 1156-BBGA

XC4008E-4PC84I

Xilinx Inc.

IC FPGA 61 I/O 84PLCC

• Number of LABs/CLBs: 324
• Number of Logic Elements/Cells: 770
• Total RAM Bits: 10368
• Number of I/O: 61
• Number of Gates: 8000
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 84-LCC (J-Lead)
• Supplier Device Package: 84-PLCC (29.31x29.31)

package: 84-LCC (J-Lead)

XC4006E-2TQ144I

Xilinx Inc.

IC FPGA 113 I/O 144TQFP

• Number of LABs/CLBs: 256
• Number of Logic Elements/Cells: 608
• Total RAM Bits: 8192
• Number of I/O: 113
• Number of Gates: 6000
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

package: 144-LQFP

XC4VFX140-11FFG1517C

Xilinx Inc.

IC FPGA 768 I/O 1517FCBGA

• Number of LABs/CLBs: 15792
• Number of Logic Elements/Cells: 142128
• Total RAM Bits: 10174464
• Number of I/O: 768
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

package: 1517-BBGA, FCBGA

XC2VP100-5FFG1696C

Xilinx Inc.

IC FPGA 1164 I/O 1696FCBGA

• Number of LABs/CLBs: 11024
• Number of Logic Elements/Cells: 99216
• Total RAM Bits: 8183808
• Number of I/O: 1164
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1696-BBGA, FCBGA
• Supplier Device Package: 1696-FCBGA (42.5x42.5)

package: 1696-BBGA, FCBGA

XC7VX690T-2FFG1158C

Xilinx Inc.

IC FPGA 350 I/O 1158FCBGA

• Number of LABs/CLBs: 54150
• Number of Logic Elements/Cells: 693120
• Total RAM Bits: 54190080
• Number of I/O: 350
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1158-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XC6VHX255T-3FF1923C

Xilinx Inc.

IC FPGA 480 I/O 1923FCBGA

• Number of LABs/CLBs: 19800
• Number of Logic Elements/Cells: 253440
• Total RAM Bits: 19021824
• Number of I/O: 480
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1924-FCBGA (45x45)

package: 1924-BBGA, FCBGA

XC4VLX160-11FFG1513C

Xilinx Inc.

IC FPGA 960 I/O 1513FCBGA

• Number of LABs/CLBs: 16896
• Number of Logic Elements/Cells: 152064
• Total RAM Bits: 5308416
• Number of I/O: 960
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1513-BBGA, FCBGA
• Supplier Device Package: 1513-FCBGA (40x40)

package: 1513-BBGA, FCBGA

XC7K420T-2FFG1156C

Xilinx Inc.

IC FPGA 400 I/O 1156FCBGA

• Number of LABs/CLBs: 32575
• Number of Logic Elements/Cells: 416960
• Total RAM Bits: 30781440
• Number of I/O: 400
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

package: 1156-BBGA, FCBGA

XC2VP50-6FFG1152C

Xilinx Inc.

IC FPGA 692 I/O 1152FCBGA

• Number of LABs/CLBs: 5904
• Number of Logic Elements/Cells: 53136
• Total RAM Bits: 4276224
• Number of I/O: 692
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FCBGA (35x35)

package: 1152-BBGA, FCBGA

XCKU9P-1FFVE900I

Xilinx Inc.

XCKU9P-1FFVE900I

• Number of LABs/CLBs: 34260
• Number of Logic Elements/Cells: 599550
• Total RAM Bits: 32870400
• Number of I/O: 304
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: -
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

package: -

XC5VFX30T-3FFG665C

Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

• Number of LABs/CLBs: 2560
• Number of Logic Elements/Cells: 32768
• Total RAM Bits: 2506752
• Number of I/O: 360
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 665-BBGA, FCBGA
• Supplier Device Package: 665-FCBGA (27x27)

package: 665-BBGA, FCBGA

XC6SLX100T-N3FGG676C

Xilinx Inc.

IC FPGA 376 I/O 676FBGA

• Number of LABs/CLBs: 7911
• Number of Logic Elements/Cells: 101261
• Total RAM Bits: 4939776
• Number of I/O: 376
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BGA
• Supplier Device Package: 676-FBGA (27x27)

package: 676-BGA

XA6SLX75-2FGG484I

Xilinx Inc.

IC FPGA 280 I/O 484FBGA

• Number of LABs/CLBs: 5831
• Number of Logic Elements/Cells: 74637
• Total RAM Bits: 3170304
• Number of I/O: 280
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

package: 484-BBGA

XC3S400-5FGG456C

Xilinx Inc.

IC FPGA 264 I/O 456FBGA

• Number of LABs/CLBs: 896
• Number of Logic Elements/Cells: 8064
• Total RAM Bits: 294912
• Number of I/O: 264
• Number of Gates: 400000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 456-BBGA
• Supplier Device Package: 456-FBGA (23x23)

package: 456-BBGA

XC6SLX9-L1CSG324I

Xilinx Inc.

IC FPGA 200 I/O 324CSBGA

• Number of LABs/CLBs: 715
• Number of Logic Elements/Cells: 9152
• Total RAM Bits: 589824
• Number of I/O: 200
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 324-LFBGA, CSPBGA
• Supplier Device Package: 324-CSPBGA (15x15)

package: 324-LFBGA, CSPBGA

XC2S30-6VQG100C

Xilinx Inc.

IC FPGA 60 I/O 100VQFP

• Number of LABs/CLBs: 216
• Number of Logic Elements/Cells: 972
• Total RAM Bits: 24576
• Number of I/O: 60
• Number of Gates: 30000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 100-TQFP
• Supplier Device Package: 100-VQFP (14x14)

package: 100-TQFP

XC3S50-5VQ100C

Xilinx Inc.

IC FPGA 63 I/O 100VQFP

• Number of LABs/CLBs: 192
• Number of Logic Elements/Cells: 1728
• Total RAM Bits: 73728
• Number of I/O: 63
• Number of Gates: 50000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 100-TQFP
• Supplier Device Package: 100-VQFP (14x14)

package: 100-TQFP

XC95216-20BG352I

Xilinx Inc.

IC CPLD 216MC 20NS 352BGA

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 20.0ns
• Voltage Supply - Internal: 4.5 V ~ 5.5 V
• Number of Logic Elements/Blocks: 12
• Number of Macrocells: 216
• Number of Gates: 4800
• Number of I/O: 166
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 352-LBGA, Metal
• Supplier Device Package: 352-MBGA (35x35)

package: 352-LBGA, Metal

XC9536XL-7VQG44C

Xilinx Inc.

IC CPLD 36MC 7.5NS 44VQFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 36
• Number of Gates: 800
• Number of I/O: 34
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-VQFP (10x10)

package: 44-TQFP

XCR3032XL-10VQG44C

Xilinx Inc.

IC CPLD 32MC 9.1NS 44VQFP

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 9.1ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 32
• Number of Gates: 750
• Number of I/O: 36
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-VQFP (10x10)

package: 44-TQFP

XCVU13P-3FHGA2104E

Xilinx Inc.

XCVU13P-3FHGA2104E

• Number of LABs/CLBs: 216000
• Number of Logic Elements/Cells: 3780000
• Total RAM Bits: 514867200
• Number of I/O: 832
• Number of Gates: -
• Voltage - Supply: 0.873 V ~ 0.927 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (52.5x52.5)

package: 2104-BBGA, FCBGA

XCKU3P-L2SFVB784E

Xilinx Inc.

XCKU3P-L2SFVB784E

• Number of LABs/CLBs: 20340
• Number of Logic Elements/Cells: 355950
• Total RAM Bits: 31641600
• Number of I/O: 256
• Number of Gates: -
• Voltage - Supply: 0.698 V ~ 0.876 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 784-FCBGA (23x23)

package: 784-BBGA, FCBGA