NXP Producten

74HC109N,652

NXP

IC JK TYPE POS TRG DUAL 16DIP

• Function: Set(Preset) and Reset
• Type: JK Type
• Output Type: Differential
• Number of Elements: 2
• Number of Bits per Element: 1
• Clock Frequency: 81MHz
• Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 5.2mA, 5.2mA
• Voltage - Supply: 2 V ~ 6 V
• Current - Quiescent (Iq): 4µA
• Input Capacitance: 3.5pF
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)

package: 16-DIP (0.300", 7.62mm)

N74F240D,623

NXP

IC BUFF INVERT 8BIT 5.5V 20SOIC

• Logic Type: Buffer, Inverting
• Number of Elements: 2
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 15mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SO

package: 20-SOIC (0.295", 7.50mm Width)

TDA8567Q/N3C,112

NXP

IC AMP AUDIO PWR 35W QUAD 23SIL

• Type: Class B
• Output Type: 4-Channel (Quad)
• Max Output Power x Channels @ Load: 35W x 4 @ 4 Ohm
• Voltage - Supply: 6 V ~ 18 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Through Hole
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: DBS23P
• Package / Case: 23-SIP Formed Leads

package: 23-SIP Formed Leads

PTN36241GHXZ

NXP

IC REDRIVER USB 3.0 12X2QFN

• Type: Buffer, ReDriver
• Applications: USB 3.0
• Input: -
• Output: -
• Data Rate (Max): 5Gbps
• Number of Channels: 1
• Delay Time: 1.0ns
• Signal Conditioning: Input Equalization, Output De-Emphasis
• Capacitance - Input: -
• Voltage - Supply: 3 V ~ 3.6 V
• Current - Supply: 100mA
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: -
• Package / Case: 12-XFQFN
• Supplier Device Package: 12-X2QFN (1.25x2.10)

package: 12-XFQFN

UJA1023T/2R04,512

NXP

IC CAN/LIN I/O SLAVE 16SOIC

• Protocol: LIN
• Function: I/O Slave
• Interface: LIN
• Standards: LIN 2.0
• Voltage - Supply: 6.5 V ~ 27 V
• Current - Supply: 45µA
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

package: 16-SOIC (0.154", 3.90mm Width)

MPC8379CVRALG

NXP

IC MPU MPC83XX 667MHZ 689TEBGA

• Core Processor: PowerPC e300c4s
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (4)
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TA)
• Security Features: -
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

package: 689-BBGA Exposed Pad

MC94MX21DVKN3

NXP

IC MPU I.MX21 350MHZ 289MAPBGA

• Core Processor: ARM926EJ-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 350MHz
• Co-Processors/DSP: -
• RAM Controllers: SDRAM
• Graphics Acceleration: Yes
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: USB 1.x (2)
• Voltage - I/O: 1.8V, 3.0V
• Operating Temperature: -30°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 289-LFBGA
• Supplier Device Package: -

package: 289-LFBGA

MPC8358VRAGDGA

NXP

IC MPU MPC83XX 400MHZ 668BGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 668-BBGA Exposed Pad
• Supplier Device Package: 668-PBGA-PGE (29x29)

package: 668-BBGA Exposed Pad

MC68HC908MR32CB

NXP

IC MCU 8BIT 32KB FLASH 56PSDIP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 36
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 768 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 56-SDIP (0.600", 15.24mm)
• Supplier Device Package: 56-PSDIP

package: 56-SDIP (0.600", 15.24mm)

MC68HC908GZ8CFA

NXP

IC MCU 8BIT 8KB FLASH 48LQFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: CAN, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 37
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

SPC5668GK0VMGR

NXP

IC MCU 32BIT 2MB FLASH 208MAPBGA

• Core Processor: e200z650
• Core Size: 32-Bit
• Speed: 116MHz
• Connectivity: CAN, Ethernet, I2C, LIN, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 155
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 592K x 8
• Voltage - Supply (Vcc/Vdd): 3.3 V ~ 5 V
• Data Converters: A/D 36x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 208-BGA
• Supplier Device Package: 208-MAPBGA (17x17)

package: 208-BGA

S912B32E4CFUE8R

NXP

IC MCU 8BIT 32KB FLASH 80QFP

• Core Processor: CPU12
• Core Size: 16-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 63
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 768 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

package: 80-QFP

MC9S08AC60MPUE

NXP

IC MCU 8BIT 60KB FLASH 64LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

S9S12G128F0VLH

NXP

IC MCU 16BIT 128KB FLASH 64LQFP

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

MCHC908QT4VDWER

NXP

IC MCU 8BIT 4KB FLASH 8SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM
• Number of I/O: 5
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 8-SOIC (0.209", 5.30mm Width)
• Supplier Device Package: 8-SOIC

package: 8-SOIC (0.209", 5.30mm Width)

MKL03Z32VFG4

NXP

IC MCU 32BIT 32KB FLASH 16QFN

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number of I/O: 14
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 7x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 16-WFQFN Exposed Pad
• Supplier Device Package: 16-QFN (3x3)

package: 16-WFQFN Exposed Pad

S9S12G96F0MLL

NXP

IC MCU 16BIT 96KB FLASH 100LQFP

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 86
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 3K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: 100-LQFP

MSC8144EVT1000B

NXP

ENCRYPTION PACSUN R2.1 783FCBGA

• Type: SC3400 Core
• Interface: Ethernet, I2C, SPI, TDM, UART, UTOPIA
• Clock Rate: 1GHz
• Non-Volatile Memory: External
• On-Chip RAM: 10.5MB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.00V
• Operating Temperature: 0°C ~ 90°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

MPX5700A

NXP

SENSOR ABS PRESS 101.5PSI MAX

• Pressure Type: Absolute
• Operating Pressure: 2.18 PSI ~ 101.53 PSI (15 kPa ~ 700 kPa)
• Output Type: Analog Voltage
• Output: 0.2 V ~ 4.7 V
• Accuracy: ±2.5%
• Voltage - Supply: 4.75 V ~ 5.25 V
• Port Size: -
• Port Style: No Port
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 406.11 PSI (2800 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 6-SIP Module
• Supplier Device Package: -

package: 6-SIP Module

MMA2260D

NXP

ACCELEROMETER 1.5G ANALOG 16SOIC

• Type: Analog
• Axis: X
• Acceleration Range: ±1.5g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 1200
• Bandwidth: 50Hz
• Output Type: Analog Voltage
• Voltage - Supply: 4.75 V ~ 5.25 V
• Features: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

package: 16-SOIC (0.295", 7.50mm Width)

MPC8308-NSG

NXP

REF DESIGN SMART GATEWAY MPC8308

• Type: Gateway
• Frequency: -
• For Use With/Related Products: MPC8308
• Supplied Contents: Board, Cables, Power Supply

package: -

MC33FS4500LAE

NXP

SYSTEM BASIS CHIP LINEAR 0.5A V

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: -1.0 V ~ 40 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP Exposed Pad

UJA1079ATW/3V3/WDJ

NXP

IC SBC LIN

• Applications: Automotive
• Interface: SPI Serial
• Voltage - Supply: 4.5 V ~ 28 V
• Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
• Supplier Device Package: 32-HTSSOP
• Mounting Type: Surface Mount

package: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

SPC5605BK0MLQ4R

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 121
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 15x10b, 5x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

PNX9531E/V140,518

NXP

IC MEDIA PROCESSOR

• Applications: Multimedia
• Core Processor: TriMedia™
• Program Memory Type: -
• Controller Series: Nexperia
• RAM Size: -
• Interface: GPIO, Host Interface, I²C, PCI, USB, XIO
• Number of I/O: 8
• Voltage - Supply: 1.16V ~ 1.24V, 3.15V ~ 3.6V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 456-BGA
• Supplier Device Package: 456-PBGA (27x27)

package: 456-BGA

SC900570CVW1

NXP

IC

• Type: -
• Protocol: -
• Number of Drivers/Receivers: -
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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S912ZVL96F0VLFR

NXP

IC MCU 16BIT 96KB FLASH 48LQFP

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 34
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: -

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FS32K146UAT0VLHR

NXP

IC MCU 32BIT 1MB FLASH 64LQFP

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit Single-Core
• Speed: 112MHz
• Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 58
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 24x12b SAR; D/A1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: -

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