NXP Producten

PMN35EN,115

NXP

MOSFET N-CH 30V 5.1A 6TSOP

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 30V
• Current - Continuous Drain (Id) @ 25°C: 5.1A (Ta)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 2.5V @ 250µA
• Gate Charge (Qg) (Max) @ Vgs: 9.3nC @ 10V
• Input Capacitance (Ciss) (Max) @ Vds: 334pF @ 15V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 500mW (Ta)
• Rds On (Max) @ Id, Vgs: 31 mOhm @ 5.1A, 10V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: 6-TSOP
• Package / Case: SC-74, SOT-457

package: SC-74, SOT-457

MRF8S19140HR3

NXP

FET RF 65V 1.96GHZ NI780H

• Transistor Type: LDMOS
• Frequency: 1.96GHz
• Gain: 19.1dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.1A
• Power - Output: 34W
• Voltage - Rated: 65V
• Package / Case: NI-780
• Supplier Device Package: NI-780

package: NI-780

LD6836CX4/27H,315

NXP

IC REG LINEAR 2.7V 300MA 4WLCSP

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 2.7V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.16V @ 300mA
• Current - Output: 300mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 100µA ~ 250µA
• PSRR: 55dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 4-XFBGA, WLCSP
• Supplier Device Package: 4-WLCSP (0.76x0.76)

package: 4-XFBGA, WLCSP

SSL1623PH/N1,112

NXP

IC LED DRIVER OFFLINE 2A 16DIP

• Type: AC DC Offline Switcher
• Topology: Flyback
• Internal Switch(s): Yes
• Number of Outputs: 1
• Voltage - Supply (Min): 80V
• Voltage - Supply (Max): 276V
• Voltage - Output: -
• Current - Output / Channel: 2A
• Frequency: 10kHz ~ 200kHz
• Dimming: -
• Applications: Lighting
• Operating Temperature: -20°C ~ 145°C (TJ)
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

package: 16-DIP (0.300", 7.62mm)

74HCT160PW,118

NXP

IC SYNC BCD DECADE COUNT 16TSSOP

• Logic Type: Counter, Decade
• Direction: Up
• Number of Elements: 1
• Number of Bits per Element: 4
• Reset: Asynchronous
• Timing: Synchronous
• Count Rate: 66MHz
• Trigger Type: Positive Edge
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: 16-TSSOP (0.173", 4.40mm Width)

PC34909AD

NXP

SBC 5V 1CAN 4LIN 6SG HLQFP48

• Applications: -
• Interface: -
• Voltage - Supply: -
• Package / Case: -
• Supplier Device Package: -
• Mounting Type: -

package: -

SAF1761BE/V1,557

NXP

IC USB HOST CTRL HP 128-LQFP

• Protocol: USB
• Function: Controller
• Interface: Parallel
• Standards: USB 2.0, OTG
• Voltage - Supply: 1.8V, 3.3V, 5V
• Current - Supply: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 128-LQFP
• Supplier Device Package: 128-LQFP (14x20)

package: 128-LQFP

NX3DV642GU,115

NXP

IC SWITCH TPDT DIFF XQFN24

• Applications: MIPI
• Multiplexer/Demultiplexer Circuit: -
• Switch Circuit: 3PDT
• Number of Channels: 1
• On-State Resistance (Max): 14 Ohm
• Voltage - Supply, Single (V+): 2.65 V ~ 4.3 V
• Voltage - Supply, Dual (V±): -
• -3db Bandwidth: 950MHz
• Features: Break-Before-Make
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 24-XFQFN
• Supplier Device Package: 24-XQFN (2.5x3.4)

package: 24-XFQFN

P5010NSN1TNB

NXP

IC MPU Q OR IQ 2.0GHZ 1295FCBGA

• Core Processor: PowerPC e5500
• Number of Cores/Bus Width: 1 Core, 64-Bit
• Speed: 2.0GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1 Gbps (5), 10 Gbps (1)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1295-BBGA, FCBGA
• Supplier Device Package: 1295-FCPBGA (37.5x37.5)

package: 1295-BBGA, FCBGA

P1010NSE5HFB

NXP

IC MPU Q OR IQ 1.0GHZ 425TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Security; SEC 4.4
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
• Package / Case: 425-FBGA
• Supplier Device Package: 425-TEPBGA I (19x19)

package: 425-FBGA

S912ZVML64F2VKH

NXP

IC MCU 16BIT 64KB FLASH 64LQFP

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, LIN, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 42
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 9x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP Exposed Pad
• Supplier Device Package: 64-LQFP EP (10x10)

package: 64-LQFP Exposed Pad

S9S12VR64F2VLF

NXP

IC MCU 16BIT 64KB FLASH 48LQFP

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

MC9S08DZ16CLF

NXP

IC MCU 8BIT 16KB FLASH 48LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

MC68HC705C9ACFN

NXP

IC MCU 8BIT 16KB OTP 44PLCC

• Core Processor: HC05
• Core Size: 8-Bit
• Speed: 2.1MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number of I/O: 24
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 352 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (17.525x17.525)

package: 44-LCC (J-Lead)

SPC5746CK1MMJ6R

NXP

IC MCU 32BIT 3MB FLASH 256MAPBGA

• Core Processor: e200z2, e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 80MHz/160MHz
• Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: 178
• Program Memory Size: 3MB (3M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 80x10b, 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-MAPPBGA (17x17)

package: 256-LBGA

SPC5606BK0MLQ6R

NXP

IC MCU 32BIT 1MB FLASH 144LQFP

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 121
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 16
• RAM Size: 80K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 15x10b, 5x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

MC9S08QD2CSCR

NXP

IC MCU 8BIT 2KB FLASH 8SOIC

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 4
• Program Memory Size: 2KB (2K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

package: 8-SOIC (0.154", 3.90mm Width)

MSC8251SAG1000B

NXP

IC DSP 1X 1GHZ SC3850 783FCBGA

• Type: SC3850 Single Core
• Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
• Clock Rate: 1GHz
• Non-Volatile Memory: ROM (96 kB)
• On-Chip RAM: 576kB
• Voltage - I/O: 2.50V
• Voltage - Core: 1.00V
• Operating Temperature: 0°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

TFF11086HN/N1,111

NXP

IC FREQUENCY GENERATOR 24HVQFN

• PLL: Yes
• Main Purpose: Ku band VSAT applications
• Input: Clock
• Output: Clock
• Number of Circuits: 1
• Ratio - Input:Output: 1:4
• Differential - Input:Output: Yes/No
• Frequency - Max: 8.71GHz
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-HVQFN (4x4)

package: 24-VFQFN Exposed Pad

MMA5148KWR2

NXP

ACCELEROMETER 480G PCM/SPI 16QFN

• Type: Digital
• Axis: Z
• Acceleration Range: ±480g
• Sensitivity (LSB/g): 1
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: PCM, SPI
• Voltage - Supply: 4.2 V ~ 17 V
• Features: Selectable Low Pass Filter
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-QFN Exposed Pad
• Supplier Device Package: 16-QFN (6x6)

package: 16-QFN Exposed Pad

BGX7100HN/1,118

NXP

TRANSMITTER IQ MODULATOR 24HVQFN

• Function: Modulator
• LO Frequency: 400MHz ~ 4GHz
• RF Frequency: 400MHz ~ 4GHz
• P1dB: 12dBm
• Noise Floor: -158dBm/Hz
• Output Power: -0.2dBm
• Current - Supply: 184mA
• Voltage - Supply: 4.75 V ~ 5.25 V
• Test Frequency: 3.5GHz
• Package / Case: 24-VFQFN Exposed Pad

package: 24-VFQFN Exposed Pad

SPC5777CLK3MMO3

NXP

NXP 32-BIT MCU POWER ARCH CORES

• Core Processor: e200z7
• Core Size: 32-Bit Tri-Core
• Speed: 264MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
• Peripherals: DMA, LVD, POR, Zipwire
• Number of I/O: -
• Program Memory Size: 8MB (8M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16b Sigma-Delta, eQADC
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 516-BGA
• Supplier Device Package: 516-MAPBGA (27x27)

package: 516-BGA

MC33771CTP2AER2

NXP

BATTERY CELL CONTROLLER, PREMIUM

• Function: Battery Cell Controller
• Battery Chemistry: Lithium Ion
• Number of Cells: 7 ~ 14
• Fault Protection: Over/Under Voltage
• Interface: SPI
• Operating Temperature: -40°C ~ 105°C (TA)
• Package / Case: 64-LQFP Exposed Pad
• Supplier Device Package: 64-LQFP (10x10)

package: -

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TEA18363T-2J

NXP

IC OFFLINE SWITCH FLYBACK 8SO

• Output Isolation: Isolated
• Internal Switch(s): No
• Voltage - Breakdown: -
• Topology: Flyback
• Voltage - Start Up: 14.9 V
• Voltage - Supply (Vcc/Vdd): 9.9V ~ 30V
• Duty Cycle: -
• Frequency - Switching: 25kHz ~ 132.5kHz
• Power (Watts): 75 W
• Fault Protection: Over Power, Over Temperature, Over Voltage
• Control Features: -
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO
• Mounting Type: Surface Mount

package: -

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MIMXRT1172AVM8A

NXP

IC MCU 32BIT EXT MEM 289MAPBGA

• Core Processor: ARM® Cortex®-M7
• Core Size: 32-Bit Single-Core
• Speed: 800MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
• Number of I/O: 13
• Program Memory Size: -
• Program Memory Type: External Program Memory
• EEPROM Size: -
• RAM Size: 2M x 8
• Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
• Data Converters: A/D 20x12b SAR; D/A 1x12b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 289-LFBGA
• Supplier Device Package: 289-LFBGA (14x14)

package: -

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MPC8248CZQMIBA-NXP

NXP

POWERQUICC 32 BIT POWER ARCHITEC

• Core Processor: PowerPC G2_LE
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: Communications; RISC CPM, Security; SEC
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 516-BBGA
• Supplier Device Package: 516-PBGA (27x27)

package: -

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S32G274AABK0CUCT

NXP

IC MPU AEC-Q100 1GHZ 525FCPBGA

• Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
• Number of Cores/Bus Width: 4 Core, 64-Bit/3 Core, 32-Bit
• Speed: 400MHz, 1GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: MII, RGMII, RMII, SGMII
• SATA: -
• USB: USB OTG (1)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: HSE-H
• Package / Case: 525-FBGA, FCBGA
• Supplier Device Package: 525-FCPBGA (19x19)

package: -

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SAF7753EL-N207ZK

NXP

CAR DSP

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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