NXP Producten

BUK952R3-40E,127

NXP

MOSFET N-CH 40V 120A TO220AB

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 40V
• Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
• Vgs(th) (Max) @ Id: 2.1V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 87.8nC @ 5V
• Input Capacitance (Ciss) (Max) @ Vds: 13160pF @ 25V
• Vgs (Max): ±10V
• FET Feature: -
• Power Dissipation (Max): 293W (Tc)
• Rds On (Max) @ Id, Vgs: 2.2 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: TO-220AB
• Package / Case: TO-220-3

package: TO-220-3

NTSX2102GU8X

NXP

IC TRANSLATING TXRX 2B 8XQFN

• Translator Type: Voltage Level
• Channel Type: Bidirectional
• Number of Circuits: 1
• Channels per Circuit: 2
• Voltage - VCCA: 1.65V ~ 5.5V
• Voltage - VCCB: 1.65V ~ 5.5V
• Input Signal: -
• Output Signal: -
• Output Type: Open Drain, Tri-State
• Data Rate: 50Mbps
• Operating Temperature: -40°C ~ 85°C (TA)
• Features: Auto-Direction Sensing
• Mounting Type: Surface Mount
• Package / Case: 8-XFQFN
• Supplier Device Package: 8-XQFN (1.4x1.2)

package: 8-XFQFN

CBTS3384D,112

NXP

IC BUS SWITCH 10BIT 24SOIC

• Type: Bus Switch
• Circuit: 5 x 1:1
• Independent Circuits: 2
• Current - Output High, Low: -
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SO

package: 24-SOIC (0.295", 7.50mm Width)

74LV86N,112

NXP

IC GATE XOR 4CH 2-INP 14-DIP

• Logic Type: XOR (Exclusive OR)
• Number of Circuits: 4
• Number of Inputs: 2
• Features: -
• Voltage - Supply: 1 V ~ 5.5 V
• Current - Quiescent (Max): 40µA
• Current - Output High, Low: 12mA, 12mA
• Logic Level - Low: 0.3 V ~ 0.8 V
• Logic Level - High: 0.9 V ~ 2 V
• Max Propagation Delay @ V, Max CL: 13ns @ 3.3V, 50pF
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Supplier Device Package: 14-DIP
• Package / Case: 14-DIP (0.300", 7.62mm)

package: 14-DIP (0.300", 7.62mm)

74LVC27PW,118

NXP

IC GATE NOR 3CH 3-INP 14-TSSOP

• Logic Type: NOR Gate
• Number of Circuits: 3
• Number of Inputs: 3
• Features: -
• Voltage - Supply: 1.2 V ~ 3.6 V
• Current - Quiescent (Max): 40µA
• Current - Output High, Low: 24mA, 24mA
• Logic Level - Low: 0.7 V ~ 0.8 V
• Logic Level - High: 1.7 V ~ 2 V
• Max Propagation Delay @ V, Max CL: 2.4ns @ 3.3V, 50pF
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-TSSOP
• Package / Case: 14-TSSOP (0.173", 4.40mm Width)

package: 14-TSSOP (0.173", 4.40mm Width)

74ABT16821ADL,512

NXP

IC D-TYPE POS TRG DUAL 56SSOP

• Function: Standard
• Type: D-Type
• Output Type: Tri-State, Non-Inverted
• Number of Elements: 2
• Number of Bits per Element: 10
• Clock Frequency: 250MHz
• Max Propagation Delay @ V, Max CL: 3.3ns @ 5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Iq): 1mA
• Input Capacitance: 3pF
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 56-BSSOP (0.295", 7.50mm Width)

package: 56-BSSOP (0.295", 7.50mm Width)

PCA9600D,118

NXP

IC REDRIVER I2C 1CH 400KHZ 8SO

• Type: Buffer, ReDriver
• Applications: I2C
• Input: 2-Wire Bus
• Output: 2-Wire Bus
• Data Rate (Max): 400kHz
• Number of Channels: 1
• Delay Time: -
• Signal Conditioning: -
• Capacitance - Input: 10pF
• Voltage - Supply: 2.5 V ~ 15 V
• Current - Supply: 5.2mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: -
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

package: 8-SOIC (0.154", 3.90mm Width)

MC33663BLEF

NXP

TXRX DUAL LINCELL 14SOIC

• Type: -
• Protocol: -
• Number of Drivers/Receivers: -
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

MC8641DVU1000NE

NXP

IC MPU MPC86XX 1.0GHZ 1023FCCBGA

• Core Processor: PowerPC e600
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1023-BCBGA, FCCBGA
• Supplier Device Package: 1023-FCCBGA (33x33)

package: 1023-BCBGA, FCCBGA

MPC8544ECVTAQG

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Signal Processing; SPE, Security; SEC
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

MPC8358EZQADDDA

NXP

IC MPU MPC83XX 266MHZ 668BGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 668-BBGA Exposed Pad
• Supplier Device Package: 668-PBGA-PGE (29x29)

package: 668-BBGA Exposed Pad

KMPC8347VRAGDB

NXP

IC MPU MPC83XX 266MHZ 620BGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 620-BBGA Exposed Pad
• Supplier Device Package: 620-PBGA (29x29)

package: 620-BBGA Exposed Pad

MPC8540VTAQFC

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 784-BBGA, FCBGA

P2020NXE2KFC

NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: Security; SEC 3.3
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

package: 689-BBGA Exposed Pad

P89LPC9103FTK,115

NXP

IC MCU 8BIT 1KB FLASH 10HVSON

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 18MHz
• Connectivity: UART/USART
• Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
• Number of I/O: 8
• Program Memory Size: 1KB (1K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 10-VFDFN Exposed Pad
• Supplier Device Package: 10-HVSON (3x3)

package: 10-VFDFN Exposed Pad

MC908AP64CFAE

NXP

IC MCU 8BIT 64KB FLASH 48LQFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: I2C, IRSCI, SCI, SPI
• Peripherals: LED, LVD, POR, PWM
• Number of I/O: 32
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

TDA8444T/N4/G1,512

NXP

IC OCTUPLE DAC 6BIT 12V 16-SOIC

• Number of Bits: 6
• Number of D/A Converters: 6
• Settling Time: -
• Output Type: Voltage - Buffered
• Differential Output: No
• Data Interface: I2C
• Reference Type: External
• Voltage - Supply, Analog: 4.5 V ~ 13.2 V
• Voltage - Supply, Digital: 4.5 V ~ 13.2 V
• INL/DNL (LSB): ±0.5 (Max), ±0.5 (Max)
• Architecture: -
• Operating Temperature: -20°C ~ 70°C
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SO
• Mounting Type: -

package: 16-SOIC (0.295", 7.50mm Width)

ADC1210S065HN/C1,5

NXP

ADC 12BIT SPI 65MSPS 40HVQFN

• Number of Bits: 12
• Sampling Rate (Per Second): 65M
• Number of Inputs: 1
• Input Type: Differential, Single Ended
• Data Interface: LVDS - Parallel, Parallel
• Configuration: S/H-ADC
• Ratio - S/H:ADC: 1:1
• Number of A/D Converters: 1
• Architecture: Pipelined
• Reference Type: External, Internal
• Voltage - Supply, Analog: 2.85 V ~ 3.4 V
• Voltage - Supply, Digital: 2.85 V ~ 3.4 V
• Features: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-HVQFN (6x6)
• Mounting Type: -

package: 40-VFQFN Exposed Pad

MPX2102GP

NXP

SENSOR GAUGE PRESS 14.5PSI MAX

• Pressure Type: Vented Gauge
• Operating Pressure: 14.5 PSI (100 kPa)
• Output Type: Wheatstone Bridge
• Output: 0 mV ~ 40 mV (10V)
• Accuracy: -0.6% ~ 0.4%
• Voltage - Supply: 10 V ~ 16 V
• Port Size: Male - 0.19" (4.93mm) Tube
• Port Style: No Port
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 58.02 PSI (400 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 4-SIP Module
• Supplier Device Package: -

package: 4-SIP Module

MMA2737WR2

NXP

ACCELEROMETER 375G PCM/SPI 16QFN

• Type: Digital
• Axis: X
• Acceleration Range: ±375g
• Sensitivity (LSB/g): 1.365
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: PCM, SPI
• Voltage - Supply: 4 V ~ 20 V
• Features: Selectable Low Pass Filter
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-QFN
• Supplier Device Package: 16-QFN (6x6)

package: 16-QFN

OM23221ARD

NXP

EVAL BOARD FOR NT3H2111 NT3H2211

• Type: Near Field Communication
• Frequency: 13.56MHz
• For Use With/Related Products: NT3H2111, NT3H2211
• Supplied Contents: Board

package: -

SA615DK/01,118

NXP

IC MIXER 500MHZ UP CONVRT 20SSOP

• RF Type: Cellular, ASK, FSK, UHF, VHF
• Frequency: 500MHz
• Number of Mixers: 3
• Gain: 13dB
• Noise Figure: 5dB
• Secondary Attributes: Up Converter
• Current - Supply: 7.4mA
• Voltage - Supply: 4.5 V ~ 8 V
• Package / Case: 20-LSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-SSOP

package: 20-LSSOP (0.173", 4.40mm Width)

1321XCSK-BDM

NXP

KIT STARTER FOR MC1321X

• Type: Transceiver; 802.15.4 (ZigBee?)
• Frequency: 2.4GHz
• For Use With/Related Products: MC1321x
• Supplied Contents: 2 Boards, Cables, Power Supply

package: -

MW7IC2040GNR1

NXP

IC PWR AMP RF 1990MHZ TO-270-16

• Frequency: 100MHz ~ 1GHz
• P1dB: 40.4dBm (11W)
• Gain: 23.5dB
• Noise Figure: -
• RF Type: General Purpose
• Voltage - Supply: 32V
• Current - Supply: 75mA
• Test Frequency: 100MHz
• Package / Case: TO-270-16 Variant, Gull Wing
• Supplier Device Package: TO-270 WBL-16 GULL

package: TO-270-16 Variant, Gull Wing

SPC5746CBK1AMKU6

NXP

DUAL CORE 3M FLASH 384K RAM F

• Core Processor: e200z2, e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 80MHz/160MHz
• Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: 129
• Program Memory Size: 3MB (3M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 80x10b, 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP Exposed Pad
• Supplier Device Package: 176-LQFP (24x24)

package: 176-LQFP Exposed Pad

MPF7100BMMA0ES

NXP

PF7100 PMIC OTP

• Applications: i.MX Processors
• Current - Supply: 10µA
• Voltage - Supply: 2.5V ~ 5.5V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-HVQFN (7x7)

package: -

LPC1115FBD48-303EL

NXP

IC MCU 32BIT 64KB FLASH 48LQFP

• Core Processor: ARM® Cortex®-M0
• Core Size: 32-Bit Single-Core
• Speed: 50MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 42
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 8x10b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: -

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SAF7771EL-203Z100K

NXP

IC

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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