NXP Producten

PHB23NQ10LT,118

NXP

MOSFET N-CH 100V 23A D2PAK

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 100V
• Current - Continuous Drain (Id) @ 25°C: 23A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
• Vgs(th) (Max) @ Id: 2V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 49nC @ 10V
• Input Capacitance (Ciss) (Max) @ Vds: 1704pF @ 25V
• Vgs (Max): ±15V
• FET Feature: -
• Power Dissipation (Max): 98W (Tc)
• Rds On (Max) @ Id, Vgs: 72 mOhm @ 10A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: D2PAK
• Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

package: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

MRF6V12500HSR3

NXP

FET RF 110V 1.03GHZ NI780HS

• Transistor Type: LDMOS
• Frequency: 1.03GHz
• Gain: 19.7dB
• Voltage - Test: 50V
• Current Rating: -
• Noise Figure: -
• Current - Test: 200mA
• Power - Output: 500W
• Voltage - Rated: 110V
• Package / Case: NI-780S
• Supplier Device Package: NI-780S

package: NI-780S

PZM20NB,115

NXP

DIODE ZENER 20V 300MW SMT3

• Voltage - Zener (Nom) (Vz): 20V
• Tolerance: ±5%
• Power - Max: 300mW
• Impedance (Max) (Zzt): 20 Ohms
• Current - Reverse Leakage @ Vr: 70nA @ 15V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

package: TO-236-3, SC-59, SOT-23-3

74ALVT16501DL,512

NXP

IC 18BIT UNVRSL BUS TXRX 56-SSOP

• Logic Type: Universal Bus Transceiver
• Number of Circuits: 18-Bit
• Current - Output High, Low: 8mA, 24mA; 32mA, 64mA
• Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 56-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 56-TSSOP

package: 56-TFSOP (0.240", 6.10mm Width)

74AHC240PW,112

NXP

IC BUFFER/LINEDVR 3ST 20TSSOP

• Logic Type: Buffer, Inverting
• Number of Elements: 2
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 8mA, 8mA
• Voltage - Supply: 2 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

package: 20-TSSOP (0.173", 4.40mm Width)

SCC68681E1N40,112

NXP

IC DUART 40DIP

• Features: Configurable GPIO, Internal Oscillator, Timer/Counter
• Number of Channels: 2, DUART
• FIFO's: -
• Protocol: -
• Data Rate (Max): 1Mbps
• Voltage - Supply: 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: Yes
• With Modem Control: -
• Mounting Type: Through Hole
• Package / Case: 40-DIP (0.600", 15.24mm)
• Supplier Device Package: 40-DIP

package: 40-DIP (0.600", 15.24mm)

KMPC8323EZQAFDC

NXP

IC MPU MPC83XX 333MHZ 516BGA

• Core Processor: PowerPC e300c2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 333MHz
• Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

package: 516-BBGA

KMPC8270VRMIBA

NXP

IC MPU MPC82XX 266MHZ 516BGA

• Core Processor: PowerPC G2_LE
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

package: 516-BBGA

LS1012ASE7EKA

NXP

QORIQ 64-BIT ARM MPU 600MHZ STD

• Core Processor: ARM? Cortex?-A53
• Number of Cores/Bus Width: 1 Core, 64-Bit
• Speed: 800MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3L
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: SATA 6Gbps (1)
• USB: USB 2.0 (1), USB 3.0 + PHY
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: ARM TZ
• Package / Case: 211-VFLGA
• Supplier Device Package: 211-FCLGA (9.6x9.6)

package: 211-VFLGA

MC68L11D0FNE2

NXP

IC MCU 8BIT ROMLESS 44PLCC

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 2MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number of I/O: 26
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 192 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (17.525x17.525)

package: 44-LCC (J-Lead)

MC9S12DG256BMPV

NXP

IC MCU 16BIT 256KB FLASH 112LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: PWM, WDT
• Number of I/O: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

package: 112-LQFP

MC68HC908QY4VDT

NXP

IC MCU 8BIT 4KB FLASH 16TSSOP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM
• Number of I/O: 13
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: 16-TSSOP (0.173", 4.40mm Width)

MC908AS60ACFU

NXP

IC MCU 8BIT 60KB FLASH 64QFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8.4MHz
• Connectivity: CAN, SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 52
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 15x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

package: 64-QFP

P89V52X2FN,112

NXP

IC MCU 8BIT 8KB FLASH 40DIP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: UART/USART
• Peripherals: POR
• Number of I/O: 32
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 192 x 8
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 40-DIP (0.600", 15.24mm)
• Supplier Device Package: 40-DIP

package: 40-DIP (0.600", 15.24mm)

LPC4076FET180K

NXP

IC MCU 32BIT 256KB FLASH 180BGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 80K x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 8x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 180-TFBGA
• Supplier Device Package: 180-TFBGA (12x12)

package: 180-TFBGA

MK11DN512AVLK5

NXP

IC MCU 32BIT 512KB FLASH 80LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 60
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 24x16b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (12x12)

package: 80-LQFP

MK40DN512VLL10

NXP

IC MCU 32BIT 512KB FLASH 100LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
• Number of I/O: 64
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 34x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: 100-LQFP

MM908E626AVEK

NXP

IC STEPPER MOTOR DRIVER 54-SOIC

• Applications: Automotive Mirror Control
• Core Processor: HC08
• Program Memory Type: FLASH (16 kB)
• Controller Series: 908E
• RAM Size: 512 x 8
• Interface: SCI, SPI
• Number of I/O: 13
• Voltage - Supply: 8 V ~ 18 V
• Operating Temperature: -40°C ~ 115°C
• Mounting Type: Surface Mount
• Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 54-SOICW-EP

package: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad

ADC0804S040TS/C1'1

NXP

ADC 8BIT PAR 40MHZ 28-SSOP

• Number of Bits: 8
• Sampling Rate (Per Second): 40M
• Number of Inputs: 1
• Input Type: Single Ended
• Data Interface: Parallel
• Configuration: ADC
• Ratio - S/H:ADC: -
• Number of A/D Converters: 1
• Architecture: -
• Reference Type: External
• Voltage - Supply, Analog: 5V
• Voltage - Supply, Digital: 5V
• Features: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP
• Mounting Type: -

package: 28-SSOP (0.209", 5.30mm Width)

PRTR5V0U2D,115

NXP

TVS DIODE 5.5VWM 6TSOP

• Type: Steering (Rail to Rail)
• Unidirectional Channels: 2
• Bidirectional Channels: -
• Voltage - Reverse Standoff (Typ): 5.5V (Max)
• Voltage - Breakdown (Min): 6V
• Voltage - Clamping (Max) @ Ipp: -
• Current - Peak Pulse (10/1000µs): -
• Power - Peak Pulse: -
• Power Line Protection: Yes
• Applications: Automotive
• Capacitance @ Frequency: 1pF @ 1MHz
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: SC-74, SOT-457
• Supplier Device Package: 6-TSOP

package: SC-74, SOT-457

MMA1212EGR2

NXP

ACCELEROMETER 225G ANALOG 16SOIC

• Type: Analog
• Axis: Z
• Acceleration Range: ±225g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 10
• Bandwidth: 400Hz
• Output Type: Analog Voltage
• Voltage - Supply: 4.75 V ~ 5.25 V
• Features: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

package: 16-SOIC (0.295", 7.50mm Width)

MMA2301KEGR2

NXP

ACCELEROMETER 225G ANALOG 16SOIC

• Type: Analog
• Axis: X
• Acceleration Range: ±225g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 10
• Bandwidth: 400Hz
• Output Type: Analog Voltage
• Voltage - Supply: 4.75 V ~ 5.25 V
• Features: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

package: 16-SOIC (0.295", 7.50mm Width)

NT2L1211G0DUDV

NXP

IC SMART TAG NFC TYPE2 UNCASED

• Type: RFID Transponder
• Frequency: 13.56MHz
• Standards: ISO 14443
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -25°C ~ 70°C
• Package / Case: Die
• Supplier Device Package: Wafer

package: Die

SPC5744BK1AMMH2R

NXP

SINGLE CORE 1.5M FLASH 192K RA

• Core Processor: e200z4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
• Peripherals: DMA, I²S, POR, WDT
• Number of I/O: -
• Program Memory Size: 1.5MB (1.5M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 192K x 8
• Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
• Data Converters: A/D 36x10b, 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 100-LBGA
• Supplier Device Package: 100-MAPBGA (11x11)

package: 100-LBGA

MIMXRT555SFFOCR

NXP

IC MCU 32BIT 192KB ROM 249FOWLP

• Core Processor: ARM® Cortex®-M33
• Core Size: 32-Bit Dual-Core
• Speed: 200MHz
• Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
• Peripherals: DMA, I2S, LCD, POR, PWM, WDT
• Number of I/O: 136
• Program Memory Size: 192KB (192K x 8)
• Program Memory Type: ROM
• EEPROM Size: -
• RAM Size: 5M x 8
• Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
• Data Converters: A/D 10x12b
• Oscillator Type: External, Internal
• Operating Temperature: -20°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 249-WFBGA
• Supplier Device Package: 249-FOWLP (7x7)

package: -

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SAF7751HV-N208W-HK

NXP

CAR DISP

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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SPC5607BAVLL6

NXP

IC MCU 32BIT 1.5MB FLASH 100LQFP

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, I2C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 149
• Program Memory Size: 1.5MB (1.5M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 16
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
• Data Converters: A/D 50x10/12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: -

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LS2048ASE7QQB

NXP

IC MPU QORIQ 1.6GHZ 1292FCPBGA

• Core Processor: ARM® Cortex®-A72
• Number of Cores/Bus Width: 4 Core, 64-Bit
• Speed: 1.6GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR4
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (1)
• SATA: SATA 6Gbps (2)
• USB: USB 3.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Secure Boot, TrustZone®
• Package / Case: 1292-BBGA, FCBGA
• Supplier Device Package: 1292-FCPBGA (37.5x37.5)

package: -

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