NXP Producten

PSMN8R5-108ESQ

NXP

MOSFET N-CH 108V 100A I2PAK

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 108V
• Current - Continuous Drain (Id) @ 25°C: 100A (Tj)
• Drive Voltage (Max Rds On, Min Rds On): 10V
• Vgs(th) (Max) @ Id: 4V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 111nC @ 10V
• Input Capacitance (Ciss) (Max) @ Vds: 5512pF @ 50V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 263W (Tc)
• Rds On (Max) @ Id, Vgs: 8.5 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: I2PAK
• Package / Case: TO-262-3 Long Leads, I2Pak, TO-262AA

package: TO-262-3 Long Leads, I2Pak, TO-262AA

74LV08PW/AUJ

NXP

IC GATE AND 4CH 2-INP 14-TSSOP

• Logic Type: AND Gate
• Number of Circuits: 4
• Number of Inputs: 2
• Features: -
• Voltage - Supply: 1 V ~ 5.5 V
• Current - Quiescent (Max): 20µA
• Current - Output High, Low: 12mA, 12mA
• Logic Level - Low: 0.3 V ~ 0.8 V
• Logic Level - High: 0.9 V ~ 2 V
• Max Propagation Delay @ V, Max CL: 11ns @ 5V, 50pF
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-TSSOP
• Package / Case: 14-TSSOP (0.173", 4.40mm Width)

package: 14-TSSOP (0.173", 4.40mm Width)

74LVC245APW/AUJ

NXP

IC BUS TXRX 3-ST OCTAL 20TSSOP

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

package: 20-TSSOP (0.173", 4.40mm Width)

74ABT2244DB,118

NXP

IC BUFF/DVR TRI-ST DUAL 20SSOP

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 2
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 12mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

package: 20-SSOP (0.209", 5.30mm Width)

N74F07N,602

NXP

IC BUFFER/DRIVER HEX 14DIP

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 6
• Number of Bits per Element: 1
• Input Type: -
• Output Type: Open Collector
• Current - Output High, Low: -, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Through Hole
• Package / Case: 14-DIP (0.300", 7.62mm)
• Supplier Device Package: 14-DIP

package: 14-DIP (0.300", 7.62mm)

SC16C554IB64,157

NXP

IC UART QUAD W/FIFO 64-LQFP

• Features: -
• Number of Channels: 4, QUART
• FIFO's: 16 Byte
• Protocol: -
• Data Rate (Max): 5Mbps
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

NX3L1G3157GM-Q100X

NXP

IC ANLG SWITCH SPDT 6XSON

• Switch Circuit: SPDT
• Multiplexer/Demultiplexer Circuit: 2:1
• Number of Circuits: 1
• On-State Resistance (Max): 750 mOhm
• Channel-to-Channel Matching (ΔRon): 20 mOhm
• Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 25ns, 10ns
• -3db Bandwidth: 60MHz
• Charge Injection: 15pC
• Channel Capacitance (CS(off), CD(off)): 35pF
• Current - Leakage (IS(off)) (Max): 10nA
• Crosstalk: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 6-XFDFN
• Supplier Device Package: 6-XSON, SOT886 (1.45x1)

package: 6-XFDFN

MC68060RC50

NXP

IC MPU M680X0 50MHZ 206PGA

• Core Processor: 68060
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 50MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 206-BEPGA
• Supplier Device Package: 206-PGA (47.25x47.25)

package: 206-BEPGA

MCF5270CAB100

NXP

IC MCU 32BIT ROMLESS 160QFP

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
• Peripherals: DMA, WDT
• Number of I/O: 39
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 160-BQFP
• Supplier Device Package: 160-QFP (28x28)

package: 160-BQFP

MK20DX256ZVMC10

NXP

IC MCU 32BIT 256KB FLASH 121BGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 86
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 38x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 121-LFBGA
• Supplier Device Package: 121-MAPBGA (8x8)

package: 121-LFBGA

S9S08SG16E1CTJ

NXP

IC MCU 8BIT 16KB FLASH 20TSSOP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

package: 20-TSSOP (0.173", 4.40mm Width)

LPC1114FHI33/302,5

NXP

IC MCU 32BIT 32KB FLASH 33HVQFN

• Core Processor: ARM? Cortex?-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 28
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

package: 32-VFQFN Exposed Pad

SAC57D54HCVLT

NXP

IC MCU 32BIT 4MB FLASH 208LQFP

• Core Processor: ARM? Cortex?-A5, -M4, -M0+
• Core Size: 32-Bit Tri-Core
• Speed: 80MHz, 160MHz, 320MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, LIN, SPI
• Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 4MB (4M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2.3M x 8
• Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 208-LQFP Exposed Pad
• Supplier Device Package: 208-LQFP (28x28)

package: 208-LQFP Exposed Pad

LPC2214FBD144/01,5

NXP

IC MCU 32BIT 256KB FLASH 144LQFP

• Core Processor: ARM7?
• Core Size: 16/32-Bit
• Speed: 60MHz
• Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 112
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.65 V ~ 1.95 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

MC9S12DP512CPVE

NXP

IC MCU 16BIT 512KB FLASH 112LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: PWM, WDT
• Number of I/O: 91
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

package: 112-LQFP

MM912H634CM1AER2

NXP

IC 64KS12 LIN2XLS/HS ISENSE

• Applications: Automotive
• Core Processor: S12
• Program Memory Type: FLASH (64 kB)
• Controller Series: HCS12
• RAM Size: 6K x 8
• Interface: LIN, SCI
• Number of I/O: 9
• Voltage - Supply: 2.25 V ~ 5.25 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP-EP (7x7)

package: 48-LQFP Exposed Pad

ADC1010S065HN/C1,5

NXP

ADC 10BIT SPI 65MSPS 40HVQFN

• Number of Bits: 10
• Sampling Rate (Per Second): 65M
• Number of Inputs: 1
• Input Type: Differential, Single Ended
• Data Interface: LVDS - Parallel, Parallel
• Configuration: S/H-ADC
• Ratio - S/H:ADC: 1:1
• Number of A/D Converters: 1
• Architecture: Pipelined
• Reference Type: External, Internal
• Voltage - Supply, Analog: 2.85 V ~ 3.4 V
• Voltage - Supply, Digital: 1.65 V ~ 3.6 V
• Features: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-HVQFN (6x6)
• Mounting Type: -

package: 40-VFQFN Exposed Pad

PCKV857DGV,118

NXP

IC CLK BUF DDR 190MHZ 1CIRC

• PLL: Yes
• Main Purpose: Memory, DDR, SDRAM
• Input: SSTL-2
• Output: SSTL-2
• Number of Circuits: 1
• Ratio - Input:Output: 1:10
• Differential - Input:Output: Yes/Yes
• Frequency - Max: 190MHz
• Voltage - Supply: 2.3 V ~ 2.7 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 48-TFSOP (0.173", 4.40mm Width)
• Supplier Device Package: 48-TSSOP

package: 48-TFSOP (0.173", 4.40mm Width)

MMA6851BKWR2

NXP

ACCELEROMETER 25G 16QFN

• Type: Digital
• Axis: X
• Acceleration Range: ±25g
• Sensitivity (LSB/g): 20.48
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: SPI
• Voltage - Supply: 3.135 V ~ 5.25 V
• Features: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 16-QFN Exposed Pad
• Supplier Device Package: 16-QFN-EP (6x6)

package: 16-QFN Exposed Pad

MF1PLUS6031DUD/03,

NXP

IC SMART CARD 2KB FFC UNCASED

• Type: -
• Frequency: -
• Standards: -
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

package: -

SA616DK/02,118

NXP

IC MIXR 150MHZ RSSI EQUIP 20SSOP

• RF Type: Cellular, ASK, FSK
• Frequency: 150MHz
• Number of Mixers: 2
• Gain: 17dB
• Noise Figure: 6.8dB
• Secondary Attributes: RSSI Equipped
• Current - Supply: 3.5mA
• Voltage - Supply: 2.7 V ~ 7 V
• Package / Case: 20-LSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-SSOP

package: 20-LSSOP (0.173", 4.40mm Width)

TDA18204HN/C1,551

NXP

CABLE PREPROCESSOR LP TUNER

• Function: -
• Interface: -
• Number of Circuits: -
• Voltage - Supply: -
• Current - Supply: -
• Power (Watts): -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

T2080NXN8T1B

NXP

QORIQ 64B POWERARCH8X 1.8GHZ T

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

package: -

S912XEP768W1MAG

NXP

16-BIT MCU S12X CORE 768KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 119
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 48K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: 144-LQFP

S912ZVC96F0MLFR

NXP

MAGNIV 16-BIT MCU S12Z CORE 96

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: CANbus, I²C, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
• Data Converters: A/D 10x10b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

MC35FS4508CAER2

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: 1V ~ 5V
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-HLQFP (7x7)

package: -

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MIMX8ML6CVNKZAB

NXP

IC MPU I.MX8ML 1.8GHZ 548LFBGA

• Core Processor: ARM® Cortex®-A53
• Number of Cores/Bus Width: 4 Core, 64-Bit
• Speed: 1.8GHz
• Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
• RAM Controllers: DDR4, LPDDR4
• Graphics Acceleration: Yes
• Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
• Ethernet: GbE (2)
• SATA: -
• USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TJ)
• Security Features: ARM TZ, CAAM, RDC
• Package / Case: 548-LFBGA
• Supplier Device Package: 548-LFBGA (15x15)

package: -

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MC908QB4CDWE-NXP

NXP

MICROCONTROLLER, 8 BIT, HC08/S08

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 13
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

package: -

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