NXP Producten

BLP8G10S-45PJ

NXP

TRANS LDMOS 45W 4HSOPF

• Transistor Type: LDMOS (Dual)
• Frequency: 952.5MHz ~ 957.5MHz
• Gain: 20.8dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 224mA
• Power - Output: 2.5W
• Voltage - Rated: 65V
• Package / Case: SOT-1223-1
• Supplier Device Package: 4-HSOPF

package: SOT-1223-1

BFG520/X,235

NXP

TRANS RF NPN 9GHZ 15V SOT143B

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 15V
• Frequency - Transition: 9GHz
• Noise Figure (dB Typ @ f): 1.1dB ~ 2.1dB @ 900MHz
• Gain: -
• Power - Max: 300mW
• DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 20mA, 6V
• Current - Collector (Ic) (Max): 70mA
• Operating Temperature: 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: TO-253-4, TO-253AA
• Supplier Device Package: SOT-143B

package: TO-253-4, TO-253AA

MC34717EP

NXP

IC CONVERTER DDR 26QFN

• Applications: Converter, DDR
• Voltage - Input: 3 V ~ 6 V
• Number of Outputs: 2
• Voltage - Output: 0.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 26-VFQFN Exposed Pad
• Supplier Device Package: 26-QFN-EP (5x5)

package: 26-VFQFN Exposed Pad

MC33882FC

NXP

IC SW LO SIDE 6-OUTPUT 32-QFN

• Switch Type: General Purpose
• Number of Outputs: 6
• Ratio - Input:Output: 1:1
• Output Configuration: Low Side
• Output Type: N-Channel
• Interface: SPI, Parallel
• Voltage - Load: 8 V ~ 25 V
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Current - Output (Max): -
• Rds On (Typ): 400 mOhm
• Input Type: -
• Features: -
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 32-VQFN Exposed Pad
• Supplier Device Package: 32-QFN-EP (7x7)

package: 32-VQFN Exposed Pad

BUK110-50GL,118

NXP

MOSFET N-CH 50V 45A D2PAK

• Switch Type: General Purpose
• Number of Outputs: 1
• Ratio - Input:Output: 1:1
• Output Configuration: Low Side
• Output Type: N-Channel
• Interface: On/Off
• Voltage - Load: 50V (Max)
• Voltage - Supply (Vcc/Vdd): Not Required
• Current - Output (Max): 45A
• Rds On (Typ): 30 mOhm
• Input Type: Non-Inverting
• Features: -
• Fault Protection: Over Temperature, Over Voltage
• Operating Temperature: 150°C (TJ)
• Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
• Supplier Device Package: D2PAK

package: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

NVT2010PW,118

NXP

IC TRANSLATOR BIDIR VOLT 24TSSOP

• Translator Type: Voltage Level
• Channel Type: Bidirectional
• Number of Circuits: 1
• Channels per Circuit: 10
• Voltage - VCCA: 1V ~ 3.6V
• Voltage - VCCB: 1.8V ~ 5.5V
• Input Signal: -
• Output Signal: -
• Output Type: Open Drain, Push-Pull
• Data Rate: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Features: Auto-Direction Sensing
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 24-TSSOP

package: 24-TSSOP (0.173", 4.40mm Width)

NTB0104BQ-Q100X

NXP

IC TXRX TRANSLATING 4B 14DHVQFN

• Translator Type: Voltage Level
• Channel Type: Bidirectional
• Number of Circuits: 1
• Channels per Circuit: 4
• Voltage - VCCA: 1.2V ~ 3.6V
• Voltage - VCCB: 1.65V ~ 5.5V
• Input Signal: -
• Output Signal: -
• Output Type: Tri-State, Non-Inverted
• Data Rate: 100Mbps
• Operating Temperature: -40°C ~ 125°C (TA)
• Features: Auto-Direction Sensing
• Mounting Type: Surface Mount
• Package / Case: 14-VFQFN Exposed Pad
• Supplier Device Package: 14-DHVQFN (2.5x3)

package: 14-VFQFN Exposed Pad

74HC240N,652

NXP

IC BUFFER/LINE DVR OCT 20DIP

• Logic Type: Buffer, Inverting
• Number of Elements: 2
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 7.8mA, 7.8mA
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Through Hole
• Package / Case: 20-DIP (0.300", 7.62mm)
• Supplier Device Package: 20-DIP

package: 20-DIP (0.300", 7.62mm)

TDF8599TH/N2,518

NXP

IC AMP AUDIO PWR 85W D 36HSOP

• Type: Class D
• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 85W x 1 @ 1 Ohm; 70W x 2 @ 2 Ohm
• Voltage - Supply: 8 V ~ 18 V
• Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 36-HSOP
• Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad

package: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad

PX1012A-EL1/G,551

NXP

IC PCI-EXPRESS X1 PHY 81-LFBGA

• Applications: PCI Express MAX to PCI Express PHY
• Interface: IEEE 1149.1
• Voltage - Supply: 1.2V
• Package / Case: 81-LFBGA
• Supplier Device Package: 81-LFBGA (9x9)
• Mounting Type: Surface Mount

package: 81-LFBGA

MC33989DWR2

NXP

IC SYSTEM BASE W/CAN 28-SOIC

• Applications: Automotive
• Interface: CAN
• Voltage - Supply: 5.5 V ~ 18 V
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC
• Mounting Type: Surface Mount

package: 28-SOIC (0.295", 7.50mm Width)

SC18IM700IPW,128

NXP

IC CTRL I2CW/UART 16TSSOP

• Protocol: I2C
• Function: Controller
• Interface: UART
• Standards: -
• Voltage - Supply: 2.4 V ~ 3.6 V
• Current - Supply: 9mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: 16-TSSOP (0.173", 4.40mm Width)

NX3L2267GM,115

NXP

IC ANALOG SWITCH SPDT 10XQFN

• Switch Circuit: SPDT
• Multiplexer/Demultiplexer Circuit: 2:1
• Number of Circuits: 2
• On-State Resistance (Max): 750 mOhm
• Channel-to-Channel Matching (ΔRon): 90 mOhm
• Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 40ns, 20ns
• -3db Bandwidth: 60MHz
• Charge Injection: 37pC
• Channel Capacitance (CS(off), CD(off)): 35pF
• Current - Leakage (IS(off)) (Max): 10nA
• Crosstalk: -90dB @ 100kHz
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 10-XFQFN
• Supplier Device Package: 10-XQFN (1.55x2)

package: 10-XFQFN

MC68MH360ZQ33LR2

NXP

IC MPU M683XX 33MHZ 357BGA

• Core Processor: CPU32+
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 33MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

package: 357-BBGA

KMPC8245LZU350D

NXP

IC MPU MPC82XX 350MHZ 352TBGA

• Core Processor: PowerPC 603e
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 350MHz
• Co-Processors/DSP: -
• RAM Controllers: SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 352-LBGA
• Supplier Device Package: 352-TBGA (35x35)

package: 352-LBGA

MCF51AC128ACPUE

NXP

IC MCU 32BIT 128KB FLASH 64LQFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 20x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

S9S12XS128J1VAA

NXP

IC MCU 16BIT 128KB FLASH 80QFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: CAN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 59
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

package: 80-QFP

MCF51QM32VHS

NXP

IC MCU 32BIT 32KB FLASH 44MAPLGA

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: EBI/EMI, I2C, SPI, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 31
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 2x16b, 11x16b, D/A 1x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 44-VFLGA
• Supplier Device Package: 44-MAPLGA (5x5)

package: 44-VFLGA

MKL26Z256VLH4

NXP

IC MCU 32BIT 256KB FLASH 64LQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 50
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D - 16bit, D/A - 12bit
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

KTY83/120,113

NXP

IC TEMP SENSOR DO34

• Resistance in Ohms @ 25°C: 1k
• Resistance Tolerance: -
• Operating Temperature: -55°C ~ 175°C
• Power - Max: -
• Mounting Type: Through Hole
• Package / Case: DO-204AG, DO-34, Axial
• Supplier Device Package: DO-34

package: DO-204AG, DO-34, Axial

KTY81/122,112

NXP

IC TEMP SENSOR SOD70

• Resistance in Ohms @ 25°C: 1.01k
• Resistance Tolerance: -
• Operating Temperature: -55°C ~ 150°C
• Power - Max: -
• Mounting Type: Through Hole
• Package / Case: TO-226-2, TO-92-2 (TO-226AC)
• Supplier Device Package: PBCYT2

package: TO-226-2, TO-92-2 (TO-226AC)

CLRC66301HN,551

NXP

IC NFC CONTACTLESS TXRX 32HVQFN

• Type: RFID Reader
• Frequency: 13.56MHz
• Standards: ISO 14443, ISO 15693, 18000-3, MIFARE, NFC
• Interface: I2C, SPI, UART
• Voltage - Supply: 3 V ~ 5.5 V
• Operating Temperature: -25°C ~ 85°C
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

package: 32-VFQFN Exposed Pad

MCIMX6Y2CVM05AAR

NXP

I.MX 32-BIT MPU, ARM CORTEX-A7 C

• Core Processor: ARM® Cortex®-A7
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 528MHz
• Co-Processors/DSP: Multimedia; NEON™ MPE
• RAM Controllers: LPDDR2, DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: Electrophoretic, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 OTG + PHY (2)
• Voltage - I/O: 1.8V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
• Package / Case: 289-LFBGA
• Supplier Device Package: 289-MAPBGA (14x14)

package: 289-LFBGA

P1025NXE5DFB

NXP

IC MPU 533MHZ 561-TEPBGA1

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: 561-FBGA
• Supplier Device Package: 561-TEPBGA I (23x23)

package: 561-FBGA

PCA9460AUKZ

NXP

POWER MANAGE IC (PMIC) FOR I.MX

• Applications: Microcontroller, MCU
• Current - Supply: -
• Voltage - Supply: 2.7V ~ 5.5V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 42-UFBGA, WLCSP
• Supplier Device Package: 42-WLCSP (2.86x2.46)

package: -

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PCA9958HNY

NXP

IC

• Translator Type: -
• Channel Type: -
• Number of Circuits: -
• Channels per Circuit: -
• Voltage - VCCA: -
• Voltage - VCCB: -
• Input Signal: -
• Output Signal: -
• Output Type: -
• Data Rate: -
• Operating Temperature: -
• Features: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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LPC5534JBD64MP

NXP

IC MCU 32BIT 128KB FLASH 64HTQFP

• Core Processor: ARM® Cortex®-M33
• Core Size: 32-Bit Single-Core
• Speed: 150MHz
• Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 13x16b; D/A 1x12b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP Exposed Pad
• Supplier Device Package: 64-HTQFP (10x10)

package: -

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SPC5743PK1AMLQ9

NXP

IC MCU 32BIT 2MB FLASH 144LQFP

• Core Processor: e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 200MHz
• Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: -
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
• Data Converters: A/D 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

package: -

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