NXP Producten

MRF281ZR1

NXP

FET RF 65V 1.93GHZ NI-200Z

• Transistor Type: LDMOS
• Frequency: 1.93GHz
• Gain: 12.5dB
• Voltage - Test: 26V
• Current Rating: -
• Noise Figure: -
• Current - Test: 25mA
• Power - Output: 4W
• Voltage - Rated: 65V
• Package / Case: NI-200Z
• Supplier Device Package: NI-200Z

package: NI-200Z

N74F139D,623

NXP

IC DECODER/DEMUX 2-4LINE 16SOIC

• Type: Decoder/Demultiplexer
• Circuit: 1 x 2:4
• Independent Circuits: 2
• Current - Output High, Low: 1mA, 20mA
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

package: 16-SOIC (0.154", 3.90mm Width)

74AHC74PW/AUJ

NXP

IC FLIP-FLOP DUAL D POS 14TSSOP

• Function: Set(Preset) and Reset
• Type: D-Type
• Output Type: Differential
• Number of Elements: 2
• Number of Bits per Element: 1
• Clock Frequency: 115MHz
• Max Propagation Delay @ V, Max CL: 9.3ns @ 5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 8mA, 8mA
• Voltage - Supply: 2 V ~ 5.5 V
• Current - Quiescent (Iq): 2µA
• Input Capacitance: 3pF
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 14-TSSOP (0.173", 4.40mm Width)

package: 14-TSSOP (0.173", 4.40mm Width)

TDA19989AET/C189,5

NXP

IC HDMI INTERFACE 1.3A 64TFBGA

• Type: HDMI Transmitter
• Applications: Cameras, Cell Phones, Media Players
• Mounting Type: Surface Mount
• Package / Case: 64-TFBGA
• Supplier Device Package: 64-TFBGA (4.5x4.5)

package: 64-TFBGA

MPC8548ECVTAQGD

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Signal Processing; SPE, Security; SEC
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

MPC8535BVTATHA

NXP

IC MPU MPC85XX 1.25GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.25GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (1)
• USB: USB 2.0 (2)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

MCE360CZQ25LR2

NXP

IC MPU M683XX 25MHZ 357BGA

• Core Processor: CPU32+
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 25MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

package: 357-BBGA

KMPC8541EVTALF

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

MPC859TCVR100A

NXP

IC MPU MPC8XX 100MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 100MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1), 10/100 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 100°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

package: 357-BBGA

MC68711E20MFNE2

NXP

IC MCU 8BIT 20KB OTP 52PLCC

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number of I/O: 38
• Program Memory Size: 20KB (20K x 8)
• Program Memory Type: OTP
• EEPROM Size: 512 x 8
• RAM Size: 768 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 52-LCC (J-Lead)
• Supplier Device Package: 52-PLCC (19.1x19.1)

package: 52-LCC (J-Lead)

MCR908JK3ECPE

NXP

IC MCU 8BIT 4KB FLASH 20DIP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LED, LVD, POR, PWM
• Number of I/O: 15
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V
• Data Converters: A/D 12x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-DIP (0.300", 7.62mm)
• Supplier Device Package: 20-DIP

package: 20-DIP (0.300", 7.62mm)

P89C51RC2BBD/01,55

NXP

IC MCU 8BIT 32KB FLASH 44LQFP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 33MHz
• Connectivity: UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 32
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

package: 44-LQFP

S912XHZ512F1VAL

NXP

IC MCU 16BIT 512KB FLASH 112LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
• Peripherals: LCD, Motor control PWM, POR, PWM, WDT
• Number of I/O: 85
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 16x8/10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

package: 112-LQFP

MC9RS08KA4CWG

NXP

IC MCU 8BIT 4KB FLASH 16SOIC

• Core Processor: RS08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 14
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 126 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

package: 16-SOIC (0.295", 7.50mm Width)

DSP56303VF100

NXP

IC DSP 24BIT 100MHZ 196-BGA

• Type: Fixed Point
• Interface: Host Interface, SSI, SCI
• Clock Rate: 100MHz
• Non-Volatile Memory: ROM (576 B)
• On-Chip RAM: 24kB
• Voltage - I/O: 3.30V
• Voltage - Core: 3.30V
• Operating Temperature: -40°C ~ 100°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 196-LBGA
• Supplier Device Package: 196-MAPBGA (15x15)

package: 196-LBGA

MWCT1001AVLHR

NXP

5W MULTI-COIL AUTO 5V STANDAR

• Applications: Wireless Power Transmitter
• Current - Supply: -
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

TJA1057GTK/3Z

NXP

HIGH-SPEED CAN TRANSCEIVER

• Type: Transceiver
• Protocol: CANbus
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 300mV
• Data Rate: -
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 8-VDFN Exposed Pad
• Supplier Device Package: 8-HVSON (3x3)

package: 8-VDFN Exposed Pad

MCIMX6QP5EVT2AA

NXP

I.MX 6QUADPLUS MPU 4X ARM CORTE

• Core Processor: ARM® Cortex®-A9
• Number of Cores/Bus Width: 4 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: Multimedia; NEON™ SIMD
• RAM Controllers: LPDDR2, DDR3L, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
• Ethernet: 10/100/1000 Mbps (1)
• SATA: SATA 3Gbps (1)
• USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -20°C ~ 105°C (TJ)
• Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
• Package / Case: 624-FBGA, FCBGA
• Supplier Device Package: 624-FCBGA (21x21)

package: 624-FBGA, FCBGA

MCIMX6Q5EZK08AD

NXP

I.MX 6 SERIES 32-BIT MPU DUAL A

• Core Processor: ARM® Cortex®-A9
• Number of Cores/Bus Width: 4 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Multimedia; NEON™ SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (1)
• SATA: SATA 3Gbps (1)
• USB: USB 2.0 + PHY (4)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -20°C ~ 105°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 569-LFBGA
• Supplier Device Package: 569-MAPBGA (12x12)

package: 569-LFBGA

SPC5777CSK3MMO3R

NXP

NXP 32-BIT MCU POWER ARCH CORES

• Core Processor: e200z7
• Core Size: 32-Bit Tri-Core
• Speed: 264MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
• Peripherals: DMA, LVD, POR, Zipwire
• Number of I/O: -
• Program Memory Size: 8MB (8M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16b Sigma-Delta, eQADC
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 416-BGA
• Supplier Device Package: 416-MAPBGA (27x27)

package: 416-BGA

S9S12P128J0VLH

NXP

16-BIT MCU S12 CORE 128KB FLAS

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: CANbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 49
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 6K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

MFS8622BMBA0ES

NXP

IC FS86 SYSTEM BASIS CHIP ASIL

• Applications: Camera
• Current - Supply: -
• Voltage - Supply: 4.5V ~ 36V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN (7x7)

package: -

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A3T23H450W23SR6

NXP

RF MOSFET LDMOS

• Transistor Type: -
• Frequency: -
• Gain: -
• Voltage - Test: -
• Current Rating: -
• Noise Figure: -
• Current - Test: -
• Power - Output: -
• Voltage - Rated: -
• Package / Case: -
• Supplier Device Package: -

package: -

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S32K328GHT1VPCSR

NXP

IC

• Core Processor: ARM® Cortex®-M7
• Core Size: 32-Bit Dual-Core
• Speed: 240MHz
• Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
• Peripherals: DMA, I2S, WDT
• Number of I/O: 142
• Program Memory Size: 8MB (8M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 128K x 8
• RAM Size: 1.125M x 8
• Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
• Data Converters: A/D 24x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 172-QFP Exposed Pad
• Supplier Device Package: 172-QFP-EP

package: -

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FS32R372SDK0MMVT

NXP

IC MCU 32B 1.3MB FLASH 141MAPBGA

• Core Processor: e200z7260
• Core Size: 32-Bit Dual-Core
• Speed: 240MHz
• Connectivity: CANbus, I2C, LINbus, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 1.3MB (1.3M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 32K x 8
• RAM Size: 1M x 8
• Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
• Data Converters: A/D 16x12b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 141-LFBGA
• Supplier Device Package: 141-MAPBGA (10x10)

package: -

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MC56F81746VLF

NXP

IC DSC 64KB/12KB LQPF48

• Type: -
• Interface: I2C, SCI, SPI
• Clock Rate: 100MHz
• Non-Volatile Memory: FLASH (64kB)
• On-Chip RAM: 12kB
• Voltage - I/O: 3.30V
• Voltage - Core: 3.30V
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: -

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MCXA152VFM

NXP

IC MCX 96MHZ SGL CORE 64KB QFN32

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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LPC5502JBD64K

NXP

IC MCU 32BIT 64KB FLASH 64TQFP

• Core Processor: ARM® Cortex®-M33
• Core Size: 32-Bit Single-Core
• Speed: 96MHz
• Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
• Number of I/O: 45
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 48K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 9x16b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP Exposed Pad
• Supplier Device Package: 64-HTQFP (10x10)

package: -

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