NXP Producten

PH4025L,115

NXP

MOSFET N-CH 25V 99A LFPAK

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 25V
• Current - Continuous Drain (Id) @ 25°C: 99A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 2.15V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 21.3nC @ 4.5V
• Input Capacitance (Ciss) (Max) @ Vds: 2601pF @ 12V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 46.4W (Tc)
• Rds On (Max) @ Id, Vgs: 4 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: LFPAK56, Power-SO8
• Package / Case: SC-100, SOT-669

package: SC-100, SOT-669

BF909,235

NXP

MOSFET N-CH 7V 40MA SOT143

• Transistor Type: N-Channel Dual Gate
• Frequency: 800MHz
• Gain: -
• Voltage - Test: 5V
• Current Rating: 40mA
• Noise Figure: 2dB
• Current - Test: 15mA
• Power - Output: -
• Voltage - Rated: 7V
• Package / Case: TO-253-4, TO-253AA
• Supplier Device Package: SOT-143B

package: TO-253-4, TO-253AA

PZM3.6NB2A,115

NXP

DIODE ZENER 3.6V 220MW SMT3

• Voltage - Zener (Nom) (Vz): 3.6V
• Tolerance: ±3%
• Power - Max: 220mW
• Impedance (Max) (Zzt): 90 Ohms
• Current - Reverse Leakage @ Vr: 5µA @ 1V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

package: TO-236-3, SC-59, SOT-23-3

MC34PF3000A1EP

NXP

IC POWER MANAGEMENT 48QFN

• Applications: Processor
• Current - Supply: -
• Voltage - Supply: 2.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN (7x7)

package: 48-VFQFN Exposed Pad

TDA19997HL/C1,518

NXP

IC DVI/HDMI SWITCH 100LQFP

• Type: HDMI 1.4
• Applications: HDMI, DVI, Receivers
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: 100-LQFP

MCZ33905BD5EKR2

NXP

IC SBC CAN HS 5.0V 54SOIC

• Applications: System Basis Chip
• Interface: CAN, LIN
• Voltage - Supply: 5.5 V ~ 28 V
• Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 54-SOICW-EP
• Mounting Type: Surface Mount

package: 54-SSOP (0.295", 7.50mm Width) Exposed Pad

GTL2009PW,118

NXP

IC 3-BIT FREQ COMPARATOR 16TSSOP

• Applications: Compares FSB Frequency Inputs
• Interface: GTL, TTL
• Voltage - Supply: 3 V ~ 3.6 V
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP
• Mounting Type: Surface Mount

package: 16-TSSOP (0.173", 4.40mm Width)

MC33972ATEK

NXP

IC SWITCH DETECT SPI 32-SOIC

• Applications: Switch Monitoring
• Interface: SPI Serial
• Voltage - Supply: 3.1 V ~ 5.25 V
• Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP
• Mounting Type: Surface Mount

package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

PCA9621D,118

NXP

IC BUS OUTPUT PORT 2WIRE 16SOIC

• Number of I/O: 8
• Interface: I2C, SMBus
• Interrupt Output: No
• Features: -
• Output Type: Open Drain
• Current - Output Source/Sink: 65mA
• Clock Frequency: 1MHz
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

package: 16-SOIC (0.154", 3.90mm Width)

MC8640HX1250HE

NXP

IC MPU MPC86XX 1.25GHZ 994FCCBGA

• Core Processor: PowerPC e600
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.25GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 994-BCBGA, FCCBGA
• Supplier Device Package: 994-FCCBGA (33x33)

package: 994-BCBGA, FCCBGA

MPC8572PXAULB

NXP

IC MPU MPC85XX 1.333GHZ 1023BGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1023-BFBGA, FCBGA
• Supplier Device Package: 1023-FCPBGA (33x33)

package: 1023-BFBGA, FCBGA

MPC8313VRAGDB

NXP

IC MPU MPC83XX 400MHZ 516BGA

• Core Processor: PowerPC e300c3
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 516-BBGA Exposed Pad
• Supplier Device Package: 516-TEPBGA (27x27)

package: 516-BBGA Exposed Pad

KMPC8560PX667LC

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DDR, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 784-BBGA, FCBGA

XPC850DSLVR50BU

NXP

IC MPU MPC8XX 50MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 50MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

package: 256-BBGA

MCIMX6G3CVK05AB

NXP

IC MPU I.MX6UL 272BGA

• Core Processor: ARM? Cortex?-A7
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 528MHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: LCD, LVDS
• Ethernet: 10/100 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
• Package / Case: -
• Supplier Device Package: -

package: -

MC9S08DZ32MLC

NXP

IC MCU 8BIT 32KB FLASH 32LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

package: 32-LQFP

MC68P11E1CFNE2R

NXP

IC MCU 8BIT ROMLESS 52PLCC

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 2MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number of I/O: 38
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: 512 x 8
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 52-LCC (J-Lead)
• Supplier Device Package: 52-PLCC (19.1x19.1)

package: 52-LCC (J-Lead)

S912XHY256F0MLM

NXP

IC MCU 16BIT 256KB FLASH 112LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
• Peripherals: LCD, Motor control PWM, POR, PWM, WDT
• Number of I/O: 88
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 8K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

package: 112-LQFP

MC9S08AC48CFUE

NXP

IC MCU 8BIT 48KB FLASH 64QFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

package: 64-QFP

ADC1003S030TS/C1'1

NXP

IC ADC 10BIT 30MSPS SGL 28SSOP

• Number of Bits: 10
• Sampling Rate (Per Second): 30M
• Number of Inputs: 1
• Input Type: Single Ended
• Data Interface: Parallel
• Configuration: ADC
• Ratio - S/H:ADC: -
• Number of A/D Converters: 1
• Architecture: -
• Reference Type: Internal
• Voltage - Supply, Analog: 5V
• Voltage - Supply, Digital: 5V
• Features: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP
• Mounting Type: -

package: 28-SSOP (0.209", 5.30mm Width)

MMA5112KW

NXP

ACCELEROMETER 120G PCM/SPI 16QFN

• Type: Digital
• Axis: Z
• Acceleration Range: ±120g
• Sensitivity (LSB/g): 4
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: PCM, SPI
• Voltage - Supply: 4.2 V ~ 17 V
• Features: Selectable Low Pass Filter
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-QFN Exposed Pad
• Supplier Device Package: 16-QFN (6x6)

package: 16-QFN Exposed Pad

BGA3031J

NXP

IC MMIC 20HVQFN

• Frequency: 5MHz ~ 85MHz
• P1dB: -
• Gain: 34dB
• Noise Figure: 3.5dB
• RF Type: CATV
• Voltage - Supply: 5V
• Current - Supply: 325mA
• Test Frequency: -
• Package / Case: 20-VQFN Exposed Pad
• Supplier Device Package: 20-HVQFN (5x5)

package: 20-VQFN Exposed Pad

BGU8004Z

NXP

IC MMIC AMP LNA WLCSP6

• Frequency: 1.559GHz ~ 1.61GHz
• P1dB: -
• Gain: 19dB
• Noise Figure: 0.6dB
• RF Type: Galileo, GLONASS, GPS
• Voltage - Supply: 1.5 V ~ 3.1 V
• Current - Supply: 7.5mA
• Test Frequency: -
• Package / Case: 6-XFBGA, WLCSP
• Supplier Device Package: 6-WLCSP (0.65x0.44)

package: 6-XFBGA, WLCSP

TFA9891UK/N1AZ

NXP

SMART AUDIO AMPLIFIER

• Type: Class D
• Output Type: 1-Channel (Mono)
• Max Output Power x Channels @ Load: 3.6W x 1 @ 8 Ohm
• Voltage - Supply: 2.7 V ~ 5.5 V
• Features: Depop, Short-Circuit and Thermal Protection
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 49-WLCSP (3.43x2.98)
• Package / Case: 49-UFBGA, WLCSP

package: 49-UFBGA, WLCSP

SAF7755HN/N208ZMP

NXP

CAR RADIO TUNER & AUDIO DSP

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

MC9S08SH8MWJ

NXP

S08SH 8-BIT MCU S08 CORE 8KB F

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 17
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

package: 20-SOIC (0.295", 7.50mm Width)

S9S12G96J0CLHR

NXP

IC MCU 16BIT 96KB FLASH 64LQFP

• Core Processor: S12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 3K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: -

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LS2084ASE7V17B

NXP

LAYERSCAPE 64-BIT ARM CORTEX-A72

• Core Processor: ARM® Cortex®-A72
• Number of Cores/Bus Width: 8 Core, 64-Bit
• Speed: 2GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR4, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16)
• SATA: SATA 6Gbps (2)
• USB: USB 3.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Secure Boot, TrustZone®
• Package / Case: 1292-BBGA, FCBGA
• Supplier Device Package: 1292-FCPBGA (37.5x37.5)

package: -

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