NXP Producten

PHM21NQ15T,518

NXP

MOSFET N-CH 150V 22.2A 8HVSON

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 150V
• Current - Continuous Drain (Id) @ 25°C: 22.2A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
• Vgs(th) (Max) @ Id: 4V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 36.2nC @ 10V
• Input Capacitance (Ciss) (Max) @ Vds: 2080pF @ 25V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 62.5W (Tc)
• Rds On (Max) @ Id, Vgs: 55 mOhm @ 15A, 10V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: 8-HVSON (6x5)
• Package / Case: 8-VDFN Exposed Pad

package: 8-VDFN Exposed Pad

AFT26H050W26SR3

NXP

FET RF 2CH 65V 2.69GHZ NI780-4

• Transistor Type: LDMOS
• Frequency: 2.69GHz
• Gain: 14.2dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 100mA
• Power - Output: 9W
• Voltage - Rated: 65V
• Package / Case: NI-780S-4L4L-8
• Supplier Device Package: NI-780S-4L4L-8

package: NI-780S-4L4L-8

BZX284-C4V3,115

NXP

DIODE ZENER 4.3V 400MW SOD2

• Voltage - Zener (Nom) (Vz): 4.3V
• Tolerance: ±5%
• Power - Max: 400mW
• Impedance (Max) (Zzt): 90 Ohms
• Current - Reverse Leakage @ Vr: 3µA @ 1V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: SOD-110
• Supplier Device Package: SOD110

package: SOD-110

MMPF0200NPANESR2

NXP

IC PWR MGMT I.MX6 56QFN

• Applications: Converter, i.MX6
• Voltage - Input: 2.8 V ~ 4.5 V
• Number of Outputs: 11
• Voltage - Output: Multiple
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-QFN (8x8)

package: 56-VFQFN Exposed Pad

74ALVT16501DL,518

NXP

IC UNIV BUS TXRX 18BIT 56SSOP

• Logic Type: Universal Bus Transceiver
• Number of Circuits: 18-Bit
• Current - Output High, Low: 8mA, 24mA; 32mA, 64mA
• Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 56-BSSOP (0.295", 7.50mm Width)
• Supplier Device Package: 56-SSOP

package: 56-BSSOP (0.295", 7.50mm Width)

CBT6820DGG,118

NXP

IC BUS SWITCH 20BIT 48TSSOP

• Type: Bus Switch
• Circuit: 10 x 1:1
• Independent Circuits: 1
• Current - Output High, Low: -
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 48-TSSOP

package: 48-TFSOP (0.240", 6.10mm Width)

N74F521D,602

NXP

IC COMPARATOR IDENTITY 8B 20SOIC

• Type: Identity Comparator
• Number of Bits: 8
• Output: Active Low
• Output Function: A=B
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Output High, Low: 1mA, 20mA
• Max Propagation Delay @ V, Max CL: 9.5ns @ 5V, 50pF
• Current - Quiescent (Iq): -
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Mounting Type: Surface Mount

package: 20-SOIC (0.295", 7.50mm Width)

SAF7167AHW/V1,157

NXP

IC DAC YUV TO RGB 48HTQFP

• Type: RGB Video Amplifier
• Applications: Video
• Mounting Type: Surface Mount
• Package / Case: 48-TQFP Exposed Pad
• Supplier Device Package: 48-HTQFP

package: 48-TQFP Exposed Pad

SA5211D/01,112

NXP

IC OPAMP TRANSIMP 180MHZ 14SO

• Amplifier Type: Transimpedance
• Number of Circuits: 1
• Output Type: Differential
• Slew Rate: -
• Gain Bandwidth Product: -
• -3db Bandwidth: 180MHz
• Current - Input Bias: -
• Voltage - Input Offset: -
• Current - Supply: 26mA
• Current - Output / Channel: 4mA
• Voltage - Supply, Single/Dual (±): 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

package: 14-SOIC (0.154", 3.90mm Width)

PCA9673BS,118

NXP

IC I/O EXPANDER I2C 16B 24HVQFN

• Number of I/O: 16
• Interface: I2C
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 100µA, 25mA
• Clock Frequency: 1MHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-HVQFN (4x4)

package: 24-VFQFN Exposed Pad

KMPC8360EZUAJDGA

NXP

IC MPU MPC83XX 533MHZ 740TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 533MHz
• Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 740-LBGA
• Supplier Device Package: 740-TBGA (37.5x37.5)

package: 740-LBGA

MC68E360ZP25VLR2

NXP

IC MPU M683XX 25MHZ 357BGA

• Core Processor: CPU32+
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 25MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 357-BGA
• Supplier Device Package: 357-PBGA (25x25)

package: 357-BGA

MPC862TCVR50B

NXP

IC MPU MPC8XX 50MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 50MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (4), 10/100 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 115°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

package: 357-BBGA

P2020NSN2NHC

NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 125°C (TA)
• Security Features: -
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

package: 689-BBGA Exposed Pad

MCF5253VM140J

NXP

IC MCU 32BIT ROMLESS 225MAPBGA

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 140MHz
• Connectivity: CAN, EBI/EMI, I2C, QSPI, UART/USART, USB OTG
• Peripherals: DMA, WDT
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.08 V ~ 1.32 V
• Data Converters: A/D 6x12b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 225-LFBGA
• Supplier Device Package: 225-MAPBGA (13x13)

package: 225-LFBGA

LPC2157FBD100,551

NXP

IC MCU 32BIT 512KB FLASH 100LQFP

• Core Processor: ARM7?
• Core Size: 16/32-Bit
• Speed: 60MHz
• Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT
• Number of I/O: 38
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: 100-LQFP

MKL02Z32VFG4

NXP

IC MCU 32BIT 32KB FLASH 16QFN

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number of I/O: 14
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 6x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 16-WFQFN Exposed Pad
• Supplier Device Package: 16-QFN (3x3)

package: 16-WFQFN Exposed Pad

ADC1012D105HN/C1,5

NXP

IC ADC 105MHZ SOT804-3

• Number of Bits: -
• Sampling Rate (Per Second): -
• Number of Inputs: -
• Input Type: -
• Data Interface: -
• Configuration: -
• Ratio - S/H:ADC: -
• Number of A/D Converters: -
• Architecture: -
• Reference Type: -
• Voltage - Supply, Analog: -
• Voltage - Supply, Digital: -
• Features: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -
• Mounting Type: -

package: -

SA56004ETK,118

NXP

SENSOR TEMP I2C/SMBUS 8HVSON

• Sensor Type: Digital, Local/Remote
• Sensing Temperature - Local: -40°C ~ 125°C
• Sensing Temperature - Remote: -40°C ~ 125°C
• Output Type: I2C/SMBus
• Voltage - Supply: 3 V ~ 5.5 V
• Resolution: 10 b
• Features: Output Switch, Programmable Limit
• Accuracy - Highest (Lowest): ±2°C (±3°C)
• Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-VDFN Exposed Pad
• Supplier Device Package: 8-HVSON (3x3)

package: 8-VDFN Exposed Pad

T1023NXE7KQA

NXP

QORIQ 2XCPU 64-BIT PWR ARCH 1.

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

package: -

MKL81Z128VLK7

NXP

KINETIS KL81: 72MHZ CORTEX-M0+ S

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: I²C, SPI, UART/USART, USB OTG
• Peripherals: DMA, I²S, LVD, POR, PWM, WDT
• Number of I/O: 56
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 12x16b, D/A 1x6b, 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 80-LQFP
• Supplier Device Package: 80-FQFP (12x12)

package: 80-LQFP

SPC5646CCK0VMJ1

NXP

NXP 32-BIT MCU DUAL POWER ARCH

• Core Processor: e200z4d, e200z0h
• Core Size: 32-Bit Dual-Core
• Speed: 80MHz/120MHz
• Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 199
• Program Memory Size: 3MB (3M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 33x10b, 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-MAPBGA

package: 256-LBGA

SM912F634DV2AER2

NXP

MAGNIV S12 RELAY DRIVER 2X HS/L

• Core Processor: S12
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: LINbus, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 3
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 15x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

MC33GD3100BEKR2

NXP

GATE DRIVERS HV ISOLATED GATE DR

• Driven Configuration: Half-Bridge
• Channel Type: Single
• Number of Drivers: 1
• Gate Type: IGBT, N-Channel MOSFET
• Voltage - Supply: 5V
• Logic Voltage - VIL, VIH: -
• Current - Peak Output (Source, Sink): 15A, 15A
• Input Type: -
• High Side Voltage - Max (Bootstrap): -
• Rise / Fall Time (Typ): -
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-BSSOP (0.295", 7.50mm Width)
• Supplier Device Package: 32-SOIC

package: -

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SAF7753HV-N207WY

NXP

CAR DISP

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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SAF775DHV-N208Q-KK

NXP

CAR RADIO TUNER & AUDIO DSP

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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MC33FS4508CAER2

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: 1V ~ 5V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-HLQFP (7x7)

package: -

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SAF7770EL-101S13AY

NXP

SOFTWARE DEFINED RADIO

• Type: Audio, Car Signal Processor
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 364-LFBGA
• Supplier Device Package: 364-LFBGA (15x15)

package: -

Request a Quote