NXP Producten

BUK952R8-60E,127

NXP

MOSFET N-CH 60V 120A TO220AB

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 60V
• Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
• Vgs(th) (Max) @ Id: 2.1V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 120nC @ 5V
• Input Capacitance (Ciss) (Max) @ Vds: 17450pF @ 25V
• Vgs (Max): ±10V
• FET Feature: -
• Power Dissipation (Max): 349W (Tc)
• Rds On (Max) @ Id, Vgs: 2.6 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: TO-220AB
• Package / Case: TO-220-3

package: TO-220-3

PDTC124TK,115

NXP

TRANS PREBIAS NPN 250MW SMT3

• Transistor Type: NPN - Pre-Biased
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Resistor - Base (R1) (Ohms): 22k
• Resistor - Emitter Base (R2) (Ohms): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
• Current - Collector Cutoff (Max): 1µA
• Frequency - Transition: -
• Power - Max: 250mW
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

package: TO-236-3, SC-59, SOT-23-3

74ALVT162240DGG:51

NXP

IC BUFF DVR TRI-ST 16BIT 48TSSOP

• Logic Type: Buffer, Inverting
• Number of Elements: 4
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 12mA, 12mA
• Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 48-TSSOP

package: 48-TFSOP (0.240", 6.10mm Width)

TDA8571J/N2S,112

NXP

IC AMP CLASS B OUTPUT DBS23

• Type: Class B
• Output Type: 4-Channel (Quad)
• Max Output Power x Channels @ Load: 45W x 4 @ 4 Ohm
• Voltage - Supply: 6 V ~ 18 V
• Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Through Hole
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: DBS23P
• Package / Case: 23-SIP Formed Leads

package: 23-SIP Formed Leads

SC16C554BIBM,151

NXP

IC UART QUAD W/FIFO 64-LQFP

• Features: -
• Number of Channels: 4, QUART
• FIFO's: 16 Byte
• Protocol: -
• Data Rate (Max): 5Mbps
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (7x7)

package: 64-LQFP

PCA9535CD,112

NXP

IC I/O EXPANDER I2C 16B 24SOIC

• Number of I/O: 16
• Interface: I2C, SMBus
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 10mA, 25mA
• Clock Frequency: 400kHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SO

package: 24-SOIC (0.295", 7.50mm Width)

PCF8574TS/3,118

NXP

IC I/O EXPANDER I2C 8B 20SSOP

• Number of I/O: 8
• Interface: I2C
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 300µA, 25mA
• Clock Frequency: 100kHz
• Voltage - Supply: 2.5 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-LSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-SSOP

package: 20-LSSOP (0.173", 4.40mm Width)

CBTU04083BS,518

NXP

IC MUX/DEMUX 2X1 42QFN

• Applications: DisplayPort, PCIe, USB, Video
• Multiplexer/Demultiplexer Circuit: 2:1
• Switch Circuit: -
• Number of Channels: 4
• On-State Resistance (Max): -
• Voltage - Supply, Single (V+): 1.62 V ~ 1.98 V
• Voltage - Supply, Dual (V±): -
• -3db Bandwidth: 4.3GHz
• Features: SATA
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 42-VFQFN Exposed Pad
• Supplier Device Package: 42-HVQFN

package: 42-VFQFN Exposed Pad

MPC8536ECVTATHA

NXP

IC MPU MPC85XX 1.25GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.25GHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 (3)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

MPC857TVR50B

NXP

IC MPU MPC8XX 50MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 50MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1), 10/100 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

package: 357-BBGA

P4080NXE7MMC

NXP

IC MPU Q OR IQ 1.5GHZ 1295FCBGA

• Core Processor: PowerPC e500mc
• Number of Cores/Bus Width: 8 Core, 32-Bit
• Speed: 1.5GHz
• Co-Processors/DSP: Security; SEC 4.0
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1 Gbps (8), 10 Gbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
• Package / Case: 1295-BBGA, FCBGA
• Supplier Device Package: 1295-FCPBGA (37.5x37.5)

package: 1295-BBGA, FCBGA

MPC850DECVR50BU

NXP

IC MPU MPC8XX 50MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 50MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

package: 256-BBGA

MPC563MVR66R

NXP

IC MCU 32BIT 512KB FLASH 388BGA

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 56
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 388-BBGA
• Supplier Device Package: 388-PBGA (27x27)

package: 388-BBGA

MC9S12DJ64CPVE

NXP

IC MCU 16BIT 64KB FLASH 112LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: PWM, WDT
• Number of I/O: 91
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

package: 112-LQFP

MC9S08DN32AMLH

NXP

IC MCU 8BIT 32KB FLASH 64LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 1.5K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

S9S08AW32E5CFDE

NXP

IC MCU 8BIT 32KB FLASH 48QFN

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 38
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN-EP (7x7)

package: 48-VFQFN Exposed Pad

MC9RS08KA1CSCR

NXP

IC MCU 8BIT 1KB FLASH 8SOIC

• Core Processor: RS08
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: -
• Peripherals: LVD, POR, WDT
• Number of I/O: 4
• Program Memory Size: 1KB (1K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 63 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

package: 8-SOIC (0.154", 3.90mm Width)

MK26FN2M0VMD18

NXP

IC MCU 32BIT 2MB FLASH 144BGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 180MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 100
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 2x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LFBGA
• Supplier Device Package: 144-PBGA (13x13)

package: 144-LFBGA

MC908AP8CFBE

NXP

IC MCU 8BIT 8KB FLASH 44QFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: I2C, IRSCI, SCI, SPI
• Peripherals: LED, LVD, POR, PWM
• Number of I/O: 32
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-QFP
• Supplier Device Package: 44-QFP (10x10)

package: 44-QFP

MKL26Z64VFT4

NXP

IC MCU 32BIT 64KB FLASH 48QFN

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 36
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D - 16bit, D/A - 12bit
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN (7x7)

package: 48-VFQFN Exposed Pad

DSPB56374AE

NXP

IC DSP 24BIT 150MHZ 52-LQFP

• Type: Audio Processor
• Interface: Host Interface, I2C, SAI, SPI
• Clock Rate: 150MHz
• Non-Volatile Memory: ROM (84 kB)
• On-Chip RAM: 54kB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.25V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 52-LQFP
• Supplier Device Package: 52-LQFP (10x10)

package: 52-LQFP

MMA5124KWR2

NXP

ACCELEROMETER 240G PCM/SPI 16QFN

• Type: Digital
• Axis: Z
• Acceleration Range: ±240g
• Sensitivity (LSB/g): 2
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: PCM, SPI
• Voltage - Supply: 4.2 V ~ 17 V
• Features: Selectable Low Pass Filter
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-QFN Exposed Pad
• Supplier Device Package: 16-QFN (6x6)

package: 16-QFN Exposed Pad

S912ZVC12F0MLF

NXP

MAGNIV 16-BIT MCU S12Z CORE 12

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: CANbus, I²C, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
• Data Converters: A/D 10x10b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

MC56F8006MLC

NXP

16-BIT DSC 56800E CORE 16KB FL

• Core Processor: 56800E
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I²C, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 27
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 16
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 18x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

package: 32-LQFP

MC34PF8100CHEP

NXP

IC POWER MANAGEMENT I.MX8QM

• Applications: High Performance i.MX 8, S32x Processor Based
• Current - Supply: -
• Voltage - Supply: 2.5V ~ 5.5V
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

package: 56-VFQFN Exposed Pad

MRFE6S9060GNR1

NXP

RF MOSFET LDMOS 28V TO270-4

• Transistor Type: LDMOS
• Frequency: 880MHz
• Gain: 21.1dB
• Voltage - Test: 28 V
• Current Rating: -
• Noise Figure: -
• Current - Test: 450 mA
• Power - Output: 14W
• Voltage - Rated: 66 V
• Package / Case: TO-270BB
• Supplier Device Package: TO-270 WB-4 Gull

package: -

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LPC1778FBD208K

NXP

IC MCU 32BIT 512KB FLASH 208LQFP

• Core Processor: ARM® Cortex®-M3
• Core Size: 32-Bit Single-Core
• Speed: 120MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 165
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
• Data Converters: A/D 8x12b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 208-LQFP
• Supplier Device Package: 208-LQFP (28x28)

package: -

MKM35Z512VLL7R

NXP

KM35: 75MHZ CORTEX-M0+ METROLOGY

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 75MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: DMA, LCD, RNG, WDT
• Number of I/O: 72
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
• Data Converters: A/D 12x16b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: -

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