NXP Producten

2PD602AS,115

NXP

TRANS NPN 50V 0.5A SC-59

• Transistor Type: NPN
• Current - Collector (Ic) (Max): 500mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Vce Saturation (Max) @ Ib, Ic: 600mV @ 30mA, 300mA
• Current - Collector Cutoff (Max): 10nA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 170 @ 150mA, 10V
• Power - Max: 250mW
• Frequency - Transition: 180MHz
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

package: TO-236-3, SC-59, SOT-23-3

LD6806TD/29H,125

NXP

IC REG LINEAR 2.9V 200MA 5TSOP

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 2.9V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.13V @ 200mA
• Current - Output: 200mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 100µA ~ 250µA
• PSRR: 55dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: SC-74A, SOT-753
• Supplier Device Package: 5-TSOP

package: SC-74A, SOT-753

MC33395EW

NXP

IC GATE DRIVER 3PHASE 32SOIC

• Driven Configuration: Half-Bridge
• Channel Type: 3-Phase
• Number of Drivers: 6
• Gate Type: N-Channel MOSFET
• Voltage - Supply: 5.5 V ~ 24 V
• Logic Voltage - VIL, VIH: -
• Current - Peak Output (Source, Sink): -
• Input Type: Non-Inverting
• High Side Voltage - Max (Bootstrap): -
• Rise / Fall Time (Typ): 350ns, 250ns
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 32-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 32-SOIC

package: 32-SOIC (0.295", 7.50mm Width)

PCA8581T/6,118

NXP

IC EEPROM 1KBIT 100KHZ 8SO

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 1Kb (128 x 8)
• Memory Interface: I2C
• Clock Frequency: 100kHz
• Write Cycle Time - Word, Page: 10ms
• Access Time: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -25°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

package: 8-SOIC (0.154", 3.90mm Width)

74AVCH20T245DGV:11

NXP

TXRX 20BIT TRANSLATNG 56TSSOP

• Translator Type: Voltage Level
• Channel Type: Bidirectional
• Number of Circuits: 2
• Channels per Circuit: 10
• Voltage - VCCA: 0.8V ~ 3.6V
• Voltage - VCCB: 0.8V ~ 3.6V
• Input Signal: -
• Output Signal: -
• Output Type: Tri-State, Non-Inverted
• Data Rate: 380Mbps
• Operating Temperature: -40°C ~ 125°C (TA)
• Features: -
• Mounting Type: Surface Mount
• Package / Case: 56-TFSOP (0.173", 4.40mm Width)
• Supplier Device Package: 56-TSSOP

package: 56-TFSOP (0.173", 4.40mm Width)

74LVT374DB,112

NXP

IC D-TYPE POS TRG SNGL 20SSOP

• Function: Standard
• Type: D-Type
• Output Type: Tri-State, Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 8
• Clock Frequency: 200MHz
• Max Propagation Delay @ V, Max CL: 5.2ns @ 3.3V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 2.7 V ~ 3.6 V
• Current - Quiescent (Iq): 190µA
• Input Capacitance: 4pF
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SSOP (0.209", 5.30mm Width)

package: 20-SSOP (0.209", 5.30mm Width)

MC33797BPEW

NXP

IC SQUIB DRIVER 4-CH 32-SOIC

• Applications: -
• Interface: SPI
• Voltage - Supply: 4.75 V ~ 5.25 V
• Package / Case: 32-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 32-SOIC
• Mounting Type: Surface Mount

package: 32-SOIC (0.295", 7.50mm Width)

P1011NSE2DFB

NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Security; SEC 3.3
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 125°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

package: 689-BBGA Exposed Pad

P89LPC971FDH,129

NXP

IC MCU 8BIT 4KB FLASH 20TSSOP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 18MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 18
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

package: 20-TSSOP (0.173", 4.40mm Width)

P89LPC921FDH,512

NXP

IC MCU 8BIT 4KB FLASH 20TSSOP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 18MHz
• Connectivity: I2C, UART/USART
• Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
• Number of I/O: 18
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

package: 20-TSSOP (0.173", 4.40mm Width)

MC68HC908JL3ECP

NXP

IC MCU 8BIT 4KB FLASH 28DIP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LED, LVD, POR, PWM
• Number of I/O: 23
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V
• Data Converters: A/D 12x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-DIP (0.600", 15.24mm)
• Supplier Device Package: 28-PDIP

package: 28-DIP (0.600", 15.24mm)

SPC5567MVZ132

NXP

IC MCU 32BIT 2MB FLASH 324TEBGA

• Core Processor: e200z6
• Core Size: 32-Bit
• Speed: 132MHz
• Connectivity: CAN, EBI/EMI, Ethernet, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 238
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 80K x 8
• Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
• Data Converters: A/D 40x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 324-BBGA
• Supplier Device Package: 324-TEPBGA (23x23)

package: 324-BBGA

MCF5471VR200

NXP

IC MCU 32BIT ROMLESS 388PBGA

• Core Processor: Coldfire V4E
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
• Peripherals: DMA, PWM, WDT
• Number of I/O: 99
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.43 V ~ 1.58 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 388-BBGA
• Supplier Device Package: 388-PBGA (27x27)

package: 388-BBGA

S912XHZ384F1VAG

NXP

IC MCU 16BIT 384KB FLASH 144QFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
• Peripherals: LCD, Motor control PWM, POR, PWM, WDT
• Number of I/O: 117
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 28K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 16x8/10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-QFP (20x20)

package: 144-LQFP

LPC2930FBD208,551

NXP

IC MCU 32BIT ROMLESS 208LQFP

• Core Processor: ARM9?
• Core Size: 16/32-Bit
• Speed: 125MHz
• Connectivity: CAN, EBI/EMI, I2C, LIN, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 152
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 56K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 24x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 208-LQFP
• Supplier Device Package: 208-LQFP (28x28)

package: 208-LQFP

S9S12G128F0MLH

NXP

IC MCU 16BIT 128KB FLASH 64LQFP

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

SE95D,112

NXP

IC SENSOR TEMP 2.8-5.5V SOT96-1

• Sensor Type: Digital, Local
• Sensing Temperature - Local: -55°C ~ 125°C
• Sensing Temperature - Remote: -
• Output Type: I2C/SMBus
• Voltage - Supply: 2.8 V ~ 5.5 V
• Resolution: 10 b
• Features: Output Switch, Programmable Limit, Shutdown Mode
• Accuracy - Highest (Lowest): ±1°C (±3°C)
• Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

package: 8-SOIC (0.154", 3.90mm Width)

MC34VR500V8ES

NXP

REGULATOR BUCK QUAD WITH UP TO

• Applications: QorlQ LS1/T1 Communications Processors
• Current - Supply: 250µA
• Voltage - Supply: 2.8 V ~ 4.5 V
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-QFN-EP (8x8)

package: 56-VFQFN Exposed Pad

LS1023ASE8KQB

NXP

QORIQ 2XCPU 64-BIT ARM ARCH 1.

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

package: -

MCIMX6X2AVN08AC

NXP

I.MX 6SX ROM PERF ENHAN

• Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 200MHz, 800MHz
• Co-Processors/DSP: Multimedia; NEON™ MPE
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
• Package / Case: 400-LFBGA
• Supplier Device Package: 400-MAPBGA (17x17)

package: 400-LFBGA

S9S08DN48F2VLF

NXP

M74K MASK ONLY - AUTO

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1.5K x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

S9S08RN16W2MTJ

NXP

8-BIT MCU S08 CORE 16KB FLASH

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, LINbus, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

package: 20-TSSOP (0.173", 4.40mm Width)

MC34PF8100EQEP

NXP

IC POWER MANAGEMENT I.MX8QM

• Applications: High Performance i.MX 8, S32x Processor Based
• Current - Supply: -
• Voltage - Supply: 2.7V ~ 5.5V
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

package: 56-VFQFN Exposed Pad

MC33FS5502Y0ESR2

NXP

HIGH VOLTAGE PMIC QFN56

• Applications: Power Supplies
• Current - Supply: 15mA
• Voltage - Supply: 60V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

package: -

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MC33FS4508NAE

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: 1V ~ 5V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-HLQFP (7x7)

package: -

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S9S12ZVLS1AMFMR

NXP

S12Z CPU, 16K FLASH

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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MC34VR500VAESR2

NXP

REGULATOR BUCK QUAD WITH UP TO 4

• Applications: QorlQ LS1/T1 Communications Processors
• Current - Supply: 15mA
• Voltage - Supply: 2.8V ~ 4.5V
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-QFN-EP (8x8)

package: -

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TEA8919DAT-1Y

NXP

TEA8919DAT

• Applications: -
• Voltage - Input: -
• Voltage - Supply: -
• Current - Supply: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

package: -

Request a Quote