NXP Producten

BF991,215

NXP

MOSFET NCH DUAL GATE 20V SOT143B

• Transistor Type: N-Channel Dual Gate
• Frequency: 100MHz
• Gain: 29dB
• Voltage - Test: 10V
• Current Rating: 20mA
• Noise Figure: 0.7dB
• Current - Test: 10mA
• Power - Output: -
• Voltage - Rated: 20V
• Package / Case: TO-253-4, TO-253AA
• Supplier Device Package: SOT-143B

package: TO-253-4, TO-253AA

PDTC124XE,115

NXP

TRANS PREBIAS NPN 150MW SC75

• Transistor Type: NPN - Pre-Biased
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Resistor - Base (R1) (Ohms): 22k
• Resistor - Emitter Base (R2) (Ohms): 47k
• DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
• Current - Collector Cutoff (Max): 1µA
• Frequency - Transition: -
• Power - Max: 150mW
• Mounting Type: Surface Mount
• Package / Case: SC-75, SOT-416
• Supplier Device Package: SC-75

package: SC-75, SOT-416

BZX84-B5V1/LF1VL

NXP

DIODE ZENER TO-236AB SOT23

• Voltage - Zener (Nom) (Vz): 5.1V
• Tolerance: ±2%
• Power - Max: 250mW
• Impedance (Max) (Zzt): 60 Ohms
• Current - Reverse Leakage @ Vr: 2µA @ 2V
• Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

package: TO-236-3, SC-59, SOT-23-3

PZM11NB,115

NXP

DIODE ZENER 11V 300MW SMT3

• Voltage - Zener (Nom) (Vz): 11V
• Tolerance: ±5%
• Power - Max: 300mW
• Impedance (Max) (Zzt): 10 Ohms
• Current - Reverse Leakage @ Vr: 100nA @ 8V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

package: TO-236-3, SC-59, SOT-23-3

MMPF0200F3AEP

NXP

IC PWR MGMT I.MX6 56QFN

• Applications: Converter, i.MX6
• Voltage - Input: 2.8 V ~ 4.5 V
• Number of Outputs: 11
• Voltage - Output: Multiple
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-QFN (8x8)

package: 56-VFQFN Exposed Pad

PCA9632TK2,118

NXP

IC LED DRVR LIN DIM 25MA 10HVSON

• Type: Power Switch
• Topology: -
• Internal Switch(s): Yes
• Number of Outputs: 4
• Voltage - Supply (Min): 2.3V
• Voltage - Supply (Max): 5.5V
• Voltage - Output: 5.5V
• Current - Output / Channel: 25mA
• Frequency: 100kHz ~ 1MHz
• Dimming: PWM
• Applications: Backlight
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 10-VFDFN Exposed Pad
• Supplier Device Package: 10-HVSON (3x3)

package: 10-VFDFN Exposed Pad

SAA1064T/N2,112

NXP

IC LED DRIVER 4DGT W/I2C 24-SOIC

• Display Type: LED
• Configuration: 7 Segment + DP
• Interface: I2C
• Digits or Characters: 4 Digits
• Current - Supply: 9.5mA
• Voltage - Supply: 4.5 V ~ 15 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SO

package: 24-SOIC (0.295", 7.50mm Width)

N74F11D,602

NXP

IC GATE AND 3CH 3-INP 14-SO

• Logic Type: AND Gate
• Number of Circuits: 3
• Number of Inputs: 3
• Features: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Max): -
• Current - Output High, Low: 1mA, 20mA
• Logic Level - Low: 0.8V
• Logic Level - High: 2V
• Max Propagation Delay @ V, Max CL: 5.6ns @ 5V, 50pF
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-SO
• Package / Case: 14-SOIC (0.154", 3.90mm Width)

package: 14-SOIC (0.154", 3.90mm Width)

TDA7052A/N2,112

NXP

IC AMP AUDIO 1.1W MONO AB 8DIP

• Type: Class AB
• Output Type: 1-Channel (Mono)
• Max Output Power x Channels @ Load: 1.1W x 1 @ 8 Ohm
• Voltage - Supply: 4.5 V ~ 18 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Volume Control
• Mounting Type: Through Hole
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 8-DIP
• Package / Case: 8-DIP (0.300", 7.62mm)

package: 8-DIP (0.300", 7.62mm)

SCC2691AE1A28,602

NXP

IC UART SINGLE 28-PLCC

• Features: Configurable GPIO, Internal Oscillator, Timer/Counter
• Number of Channels: 1, UART
• FIFO's: -
• Protocol: -
• Data Rate (Max): -
• Voltage - Supply: 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: Yes
• With Modem Control: -
• Mounting Type: Surface Mount
• Package / Case: 28-LCC (J-Lead)
• Supplier Device Package: 28-PLCC (11.51x11.51)

package: 28-LCC (J-Lead)

74HC4053D/AUJ

NXP

IC MUX/DEMUX TRIPLE 2X1 16SOIC

• Switch Circuit: SPDT
• Multiplexer/Demultiplexer Circuit: 2:1
• Number of Circuits: 3
• On-State Resistance (Max): 120 Ohm
• Channel-to-Channel Matching (ΔRon): 6 Ohm
• Voltage - Supply, Single (V+): 2 V ~ 10 V
• Voltage - Supply, Dual (V±): ±1 V ~ 5 V
• Switch Time (Ton, Toff) (Max): 31ns, 29ns
• -3db Bandwidth: 170MHz
• Charge Injection: -
• Channel Capacitance (CS(off), CD(off)): 3.5pF
• Current - Leakage (IS(off)) (Max): 100nA
• Crosstalk: -60dB @ 1MHz
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

package: 16-SOIC (0.154", 3.90mm Width)

P1014NSN5FFA

NXP

IC MPU Q OR IQ 800MHZ 425TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 425-FBGA
• Supplier Device Package: 425-TEPBGA I (19x19)

package: 425-FBGA

S9S08DZ60F1MLF

NXP

IC MCU 8BIT 60KB FLASH 48LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: 48-LQFP

MC68HRC908JK1CDW

NXP

IC MCU 8BIT 1.5KB FLASH 20SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LED, LVD, POR, PWM
• Number of I/O: 15
• Program Memory Size: 1.5KB (1.5K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V
• Data Converters: A/D 12x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

package: 20-SOIC (0.295", 7.50mm Width)

MK22FN1M0VLK12

NXP

IC MCU 32BIT 1MB FLASH 80LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 56
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 27x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (12x12)

package: 80-LQFP

S9S08DZ48F2MLH

NXP

IC MCU 8BIT 48KB FLASH 64LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1.5K x 8
• RAM Size: 3K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP

S9S12ZVLS3F0MFM

NXP

IC MCU 16BIT 32KB FLASH 32QFN

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, LIN, SCI, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 19
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN Exposed Pad (5x5)

package: 32-VFQFN Exposed Pad

MKE02Z16VLD2

NXP

IC MCU 32BIT 16KB FLASH 44LQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 20MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: LVD, PWM, WDT
• Number of I/O: 37
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b, D/A 2x6b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

package: 44-LQFP

SA56004CD,118

NXP

SENSOR TEMPERATURE I2C/SMBUS 8SO

• Sensor Type: Digital, Local/Remote
• Sensing Temperature - Local: -40°C ~ 125°C
• Sensing Temperature - Remote: -40°C ~ 125°C
• Output Type: I2C/SMBus
• Voltage - Supply: 3 V ~ 5.5 V
• Resolution: 10 b
• Features: Output Switch, Programmable Limit
• Accuracy - Highest (Lowest): ±2°C (±3°C)
• Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

package: 8-SOIC (0.154", 3.90mm Width)

MMA6821KW

NXP

ACCELEROMETER 16QFN

• Type: Digital
• Axis: X, Y
• Acceleration Range: ±120g, ±25g
• Sensitivity (LSB/g): 4.096 (X), 20.479 (Y)
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: SPI
• Voltage - Supply: 3.135 V ~ 5.25 V
• Features: -
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 16-QFN Exposed Pad
• Supplier Device Package: 16-QFN (6x6)

package: 16-QFN Exposed Pad

MC13213R2

NXP

IC RF TXRX+MCU 802.15.4 71-VFLGA

• Type: TxRx + MCU
• RF Family/Standard: 802.15.4
• Protocol: Zigbee?
• Modulation: DSSS, O-QPSK
• Frequency: 2.4GHz
• Data Rate (Max): 250kbps
• Power - Output: 3dBm
• Sensitivity: -92dBm
• Memory Size: 60kB Flash, 4kB RAM
• Serial Interfaces: I2C, SPI
• GPIO: 32
• Voltage - Supply: 2 V ~ 3.4 V
• Current - Receiving: 37mA
• Current - Transmitting: 30mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 71-VFLGA

package: 71-VFLGA

MC33771BSA1AER2

NXP

BCC14

• Function: Battery Cell Controller
• Battery Chemistry: Lithium-Ion
• Number of Cells: 7 ~ 14
• Fault Protection: Over/Under Voltage
• Interface: SPI
• Operating Temperature: -40°C ~ 105°C (TA)
• Package / Case: 64-LQFP Exposed Pad
• Supplier Device Package: 64-LQFP (10x10)

package: 64-LQFP Exposed Pad

T2080NSN8MQB

NXP

QORIQ 64B POWER ARCH 8X 1.2GHZ

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

package: -

T1024NSE7PQA

NXP

QORIQ 2XCPU 64-BIT PWR ARCH 1.

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

package: -

MCIMX6X1AVO08ACR

NXP

I.MX6SX AUTO ROM P ENHAN

• Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 200MHz, 800MHz
• Co-Processors/DSP: Multimedia; NEON™ MPE
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
• Package / Case: 400-LFBGA
• Supplier Device Package: 400-MAPBGA (17x17)

package: 400-LFBGA

LPC55S14JBD64Y

NXP

IC MCU 32BIT 128KB FLASH 64HTQFP

• Core Processor: ARM® Cortex®-M33
• Core Size: 32-Bit Single-Core
• Speed: 150MHz
• Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
• Number of I/O: 36
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 80K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 10x16b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP Exposed Pad
• Supplier Device Package: 64-HTQFP (10x10)

package: -

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MC33FS8400G5ES

NXP

SYSTEM BASIS CHIP FS8400

• Applications: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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SAF7754HV-N205WY

NXP

DSP AUDIO MULTI-TUNER

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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