NXP Producten

MMRF1315NR1

NXP

FET RF 66V 880MHZ TO270

• Transistor Type: LDMOS
• Frequency: 880MHz
• Gain: 21.1dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 450mA
• Power - Output: 14W
• Voltage - Rated: 66V
• Package / Case: TO-270-2
• Supplier Device Package: TO-270-2

package: TO-270-2

PDTC144WE,115

NXP

TRANS PREBIAS NPN 150MW SC75

• Transistor Type: NPN - Pre-Biased
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Resistor - Base (R1) (Ohms): 47k
• Resistor - Emitter Base (R2) (Ohms): 22k
• DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
• Current - Collector Cutoff (Max): 1µA
• Frequency - Transition: -
• Power - Max: 150mW
• Mounting Type: Surface Mount
• Package / Case: SC-75, SOT-416
• Supplier Device Package: SC-75

package: SC-75, SOT-416

PZM5.6NB,115

NXP

DIODE ZENER 5.6V 300MW SMT3

• Voltage - Zener (Nom) (Vz): 5.6V
• Tolerance: ±5%
• Power - Max: 300mW
• Impedance (Max) (Zzt): 40 Ohms
• Current - Reverse Leakage @ Vr: 2µA @ 2.5V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

package: TO-236-3, SC-59, SOT-23-3

BAP65-02,135

NXP

DIODE PIN 30V 100MA SOD523

• Diode Type: PIN - Single
• Voltage - Peak Reverse (Max): 30V
• Current - Max: 100mA
• Capacitance @ Vr, F: 0.375pF @ 20V, 1MHz
• Resistance @ If, F: 350 mOhm @ 100mA, 100MHz
• Power Dissipation (Max): 715mW
• Operating Temperature: -65°C ~ 150°C (TJ)
• Package / Case: SC-79, SOD-523
• Supplier Device Package: SOD-523

package: SC-79, SOD-523

MMPF0200F0AEPR2

NXP

IC PWR MGMT I.MX6 56QFN

• Applications: Converter, i.MX6
• Voltage - Input: 2.8 V ~ 4.5 V
• Number of Outputs: 11
• Voltage - Output: Multiple
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-QFN (8x8)

package: 56-VFQFN Exposed Pad

UBA2015AT/1,118

NXP

IC LAMP DVR FLUORES 600V 20-SOIC

• Type: CFL/TL Controller
• Frequency: -
• Voltage - Supply: 11.9 V ~ 13.8 V
• Current - Supply: 1.7mA
• Current - Output Source/Sink: -
• Dimming: Yes
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SO

package: 20-SOIC (0.295", 7.50mm Width)

74ABT240N,602

NXP

IC BUFF INVERT 5.5V 20DIP

• Logic Type: Buffer, Inverting
• Number of Elements: 2
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Through Hole
• Package / Case: 20-DIP (0.300", 7.62mm)
• Supplier Device Package: 20-DIP

package: 20-DIP (0.300", 7.62mm)

PCA9674PW,118

NXP

IC I/O EXPANDER I2C 8B 16TSSOP

• Number of I/O: 8
• Interface: I2C
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 100µA, 25mA
• Clock Frequency: 1MHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

package: 16-TSSOP (0.173", 4.40mm Width)

NX3L2T384GT,115

NXP

IC ANALOG SWITCH SPDT XSON8

• Switch Circuit: SPST - NC
• Multiplexer/Demultiplexer Circuit: 1:1
• Number of Circuits: 2
• On-State Resistance (Max): 750 mOhm
• Channel-to-Channel Matching (ΔRon): 20 mOhm
• Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 40ns, 15ns
• -3db Bandwidth: 60MHz
• Charge Injection: 6pC
• Channel Capacitance (CS(off), CD(off)): 35pF
• Current - Leakage (IS(off)) (Max): 10nA
• Crosstalk: -90dB @ 100kHz
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 8-XFDFN
• Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)

package: 8-XFDFN

MPC8535EAVTAKGA

NXP

IC MPU MPC85XX 600MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 600MHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (1)
• USB: USB 2.0 (2)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 90°C (TA)
• Security Features: Cryptography
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

package: 783-BBGA, FCBGA

P1020PSE2FDB

NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Security; SEC 3.3
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 125°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

package: 689-BBGA Exposed Pad

MPC8360ECZUAGDG

NXP

IC MPU MPC83XX 400MHZ 740TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 740-LBGA
• Supplier Device Package: 740-TBGA (37.5x37.5)

package: 740-LBGA

MPC8265AVVMHBC

NXP

IC MPU MPC82XX 266MHZ 408TBGA

• Core Processor: PowerPC G2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 480-LBGA
• Supplier Device Package: 408-TBGA (37.5x37.5)

package: 480-LBGA

MC9S12XD256VAA

NXP

IC MCU 16BIT 256KB FLASH 80QFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 59
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 14K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

package: 80-QFP

LPC11A02UK,118

NXP

IC MCU 32BIT 16KB FLASH 20WLCSP

• Core Processor: ARM? Cortex?-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 18
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.6 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-UFBGA, WLCSP
• Supplier Device Package: -

package: 20-UFBGA, WLCSP

LPC1765FBD100,551

NXP

IC MCU 32BIT 256KB FLASH 100LQFP

• Core Processor: ARM? Cortex?-M3
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 8x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

package: 100-LQFP

MK02FN64VFM10

NXP

IC MCU 32BIT 64KB FLASH 32QFN

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: DMA, LVD, POR, PWM
• Number of I/O: 26
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 12x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN (5x5)

package: 32-VFQFN Exposed Pad

MF1SEP1001DUD/03V

NXP

MIFARE CLASSIC SMART CARD IC

• Type: RFID Transponder
• Frequency: 13.56MHz
• Standards: ISO 14443
• Interface: UART
• Voltage - Supply: -
• Operating Temperature: -25°C ~ 70°C
• Package / Case: Die
• Supplier Device Package: Die

package: Die

ASC3101HVK

NXP

IC RF TXRX+MCU AISG 144-LQFP

• Type: TxRx + MCU
• RF Family/Standard: AISG
• Protocol: -
• Modulation: OOK
• Frequency: 2.176GHz, 4.352GHz, 6.528GHz
• Data Rate (Max): 38.4kbps
• Power - Output: 10dBm
• Sensitivity: -
• Memory Size: 128kB Flash, 16kB SRAM
• Serial Interfaces: I2C, SPI, UART
• GPIO: 44
• Voltage - Supply: 1.8 V ~ 3.3 V
• Current - Receiving: -
• Current - Transmitting: -
• Operating Temperature: -
• Package / Case: 144-LQFP Exposed Pad

package: 144-LQFP Exposed Pad

1322XNSK-IAR

NXP

KIT STARTER 1322X IAR 256K

• Type: Transceiver; 802.15.4 (ZigBee?)
• Frequency: 2.4GHz
• For Use With/Related Products: MC1322x
• Supplied Contents: 4 Boards, Cables, Power Supply, Accessories

package: -

MW4IC2230MBR5

NXP

IC PWR AMP RF 28V 30W TO-272-16

• Frequency: 1.6GHz ~ 2.4GHz
• P1dB: -
• Gain: 31dB
• Noise Figure: -
• RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
• Voltage - Supply: 26V
• Current - Supply: 60mA
• Test Frequency: -
• Package / Case: TO-272-16 Variant, Flat Leads
• Supplier Device Package: TO-272 WB-16

package: TO-272-16 Variant, Flat Leads

S32G398AAAK1VUCT

NXP

3XM7 400MHZ, 8XA53 1GHZ, 525BG

• Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
• Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
• Speed: 400MHz, 1GHz
• Co-Processors/DSP: Multimedia; NEON
• RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 2.5Gbps (3)
• SATA: -
• USB: USB 2.0 OTG (1)
• Voltage - I/O: 1.8V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: ARM TZ, Boot Security, TRNG
• Package / Case: 525-FBGA, FCBGA
• Supplier Device Package: 525-FCPBGA (19x19)

package: -

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S9KEAZN16AMLHR

NXP

IC MCU 32BIT 16KB FLASH 64LQFP

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit Single-Core
• Speed: 40MHz
• Connectivity: I2C, LINbus, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 57
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 16x12b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

package: -

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MIMX8MN3CUCIZAA

NXP

NANO SOLOLITE I.MX 8M LFBGA486

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

package: -

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FB32K116BFT0MFMT

NXP

S32K116, M0+, FLASH 128K, RAM 17

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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S912ZVL64AMLCR

NXP

S12Z CPU, 64K FLASH

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

package: -

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S912ZVCA64F0VLFR

NXP

IC MCU 16BIT 64KB FLASH 48LQFP

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: CANbus, I2C, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
• Data Converters: A/D 10x12b; D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

package: -

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MVR5510AMBAHES

NXP

IC PMIC VR5510 ASIL-B

• Applications: -
• Current - Supply: 15mA
• Voltage - Supply: 2.7V ~ 60V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

package: -

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